NL133717C - - Google Patents
Info
- Publication number
- NL133717C NL133717C NL133717DA NL133717C NL 133717 C NL133717 C NL 133717C NL 133717D A NL133717D A NL 133717DA NL 133717 C NL133717 C NL 133717C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/019—Manufacture or treatment of isolation regions comprising dielectric materials using epitaxial passivated integrated circuit [EPIC] processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US467359A US3308354A (en) | 1965-06-28 | 1965-06-28 | Integrated circuit using oxide insulated terminal pads on a sic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL133717C true NL133717C (en:Method) | 1900-01-01 |
Family
ID=23855376
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL133717D NL133717C (en:Method) | 1965-06-28 | ||
| NL6608974A NL6608974A (en:Method) | 1965-06-28 | 1966-06-28 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6608974A NL6608974A (en:Method) | 1965-06-28 | 1966-06-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3308354A (en:Method) |
| CH (1) | CH449122A (en:Method) |
| DE (1) | DE1250514B (en:Method) |
| NL (2) | NL6608974A (en:Method) |
| SE (1) | SE309454B (en:Method) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1066911A (en) * | 1965-01-01 | 1967-04-26 | Standard Telephones Cables Ltd | Semiconductor devices |
| US3488834A (en) * | 1965-10-20 | 1970-01-13 | Texas Instruments Inc | Microelectronic circuit formed in an insulating substrate and method of making same |
| US3423651A (en) * | 1966-01-13 | 1969-01-21 | Raytheon Co | Microcircuit with complementary dielectrically isolated mesa-type active elements |
| US3440498A (en) * | 1966-03-14 | 1969-04-22 | Nat Semiconductor Corp | Contacts for insulation isolated semiconductor integrated circuitry |
| US3471922A (en) * | 1966-06-02 | 1969-10-14 | Raytheon Co | Monolithic integrated circuitry with dielectric isolated functional regions |
| NL6705847A (en:Method) * | 1967-04-26 | 1968-10-28 | ||
| US3571919A (en) * | 1968-09-25 | 1971-03-23 | Texas Instruments Inc | Semiconductor device fabrication |
| US3838441A (en) * | 1968-12-04 | 1974-09-24 | Texas Instruments Inc | Semiconductor device isolation using silicon carbide |
| US4032950A (en) * | 1974-12-06 | 1977-06-28 | Hughes Aircraft Company | Liquid phase epitaxial process for growing semi-insulating gaas layers |
| JP2773474B2 (ja) * | 1991-08-06 | 1998-07-09 | 日本電気株式会社 | 半導体装置 |
| US5726463A (en) * | 1992-08-07 | 1998-03-10 | General Electric Company | Silicon carbide MOSFET having self-aligned gate structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL283619A (en:Method) * | 1961-10-06 |
-
0
- NL NL133717D patent/NL133717C/xx active
- DE DENDAT1250514D patent/DE1250514B/de active Pending
-
1965
- 1965-06-28 US US467359A patent/US3308354A/en not_active Expired - Lifetime
-
1966
- 1966-03-17 SE SE3580/66A patent/SE309454B/xx unknown
- 1966-06-28 CH CH933666A patent/CH449122A/de unknown
- 1966-06-28 NL NL6608974A patent/NL6608974A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6608974A (en:Method) | 1966-12-29 |
| DE1250514B (en:Method) | 1900-01-01 |
| SE309454B (en:Method) | 1969-03-24 |
| US3308354A (en) | 1967-03-07 |
| CH449122A (de) | 1967-12-31 |