NL126558C - - Google Patents
Info
- Publication number
- NL126558C NL126558C NL126558DA NL126558C NL 126558 C NL126558 C NL 126558C NL 126558D A NL126558D A NL 126558DA NL 126558 C NL126558 C NL 126558C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/148—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL242671 | 1959-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL126558C true NL126558C (xx) |
Family
ID=19751890
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL242671D NL242671A (xx) | 1959-08-25 | ||
NL126558D NL126558C (xx) | 1959-08-25 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL242671D NL242671A (xx) | 1959-08-25 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3080841A (xx) |
CH (1) | CH399596A (xx) |
DE (1) | DE1114940B (xx) |
GB (1) | GB887037A (xx) |
NL (2) | NL126558C (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1051451A (xx) * | 1963-02-08 | |||
DE1282794C2 (de) * | 1965-04-01 | 1975-10-09 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen einer legierungsmaske fuer die gleichzeitige fertigung mehrerer halbleiteranordnungen |
US3571919A (en) * | 1968-09-25 | 1971-03-23 | Texas Instruments Inc | Semiconductor device fabrication |
US3719981A (en) * | 1971-11-24 | 1973-03-13 | Rca Corp | Method of joining solder balls to solder bumps |
US3894329A (en) * | 1972-07-28 | 1975-07-15 | Sperry Rand Corp | Method of making high density electronic interconnections in a termination device |
JPS5277590A (en) * | 1975-12-24 | 1977-06-30 | Toshiba Corp | Semiconductor producing device |
DE2656019C3 (de) * | 1976-12-10 | 1980-07-17 | Brown, Boveri & Cie Ag, 6800 Mannheim | Vorrichtung zum Ausrichten und Anlöten von Podesten bzw. Ronden bezüglich der bzw. an den lötfähigen ohmschen Kontakten) von Halbleiterbauelementen |
US6864570B2 (en) * | 1993-12-17 | 2005-03-08 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL104654C (xx) * | 1952-12-31 | 1900-01-01 | ||
US2756483A (en) * | 1953-05-11 | 1956-07-31 | Sylvania Electric Prod | Junction forming crucible |
US2879188A (en) * | 1956-03-05 | 1959-03-24 | Westinghouse Electric Corp | Processes for making transistors |
US2879189A (en) * | 1956-11-21 | 1959-03-24 | Shockley William | Method for growing junction semi-conductive devices |
US2964431A (en) * | 1959-07-28 | 1960-12-13 | Rca Corp | Jig alloying of semiconductor devices |
-
0
- NL NL242671D patent/NL242671A/xx unknown
- NL NL126558D patent/NL126558C/xx active
-
1960
- 1960-07-19 US US43813A patent/US3080841A/en not_active Expired - Lifetime
- 1960-08-22 DE DEN18803A patent/DE1114940B/de active Pending
- 1960-08-22 GB GB28972/60A patent/GB887037A/en not_active Expired
- 1960-08-22 CH CH949060A patent/CH399596A/de unknown
Also Published As
Publication number | Publication date |
---|---|
US3080841A (en) | 1963-03-12 |
NL242671A (xx) | |
DE1114940B (de) | 1961-10-12 |
GB887037A (en) | 1962-01-10 |
CH399596A (de) | 1965-09-30 |