NL109858C - - Google Patents

Info

Publication number
NL109858C
NL109858C NL109858DA NL109858C NL 109858 C NL109858 C NL 109858C NL 109858D A NL109858D A NL 109858DA NL 109858 C NL109858 C NL 109858C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of NL109858C publication Critical patent/NL109858C/xx
Priority claimed from US685232A external-priority patent/US2916604A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48091—Arched
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01073—Tantalum [Ta]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Fuses (AREA)
NL109858D 1957-09-20 NL109858C (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US685232A US2916604A (en) 1957-09-20 1957-09-20 Fabrication of electrical units
US801847A US3082522A (en) 1957-09-20 1959-03-25 Fabrication of electrical units

Publications (1)

Publication Number Publication Date
NL109858C true NL109858C (de) 1900-01-01

Family

ID=27103538

Family Applications (2)

Application Number Title Priority Date Filing Date
NL109858D NL109858C (de) 1957-09-20
NL231513D NL231513A (de) 1957-09-20

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL231513D NL231513A (de) 1957-09-20

Country Status (6)

Country Link
US (1) US3082522A (de)
BE (1) BE571348A (de)
DE (1) DE1166378B (de)
FR (1) FR1210229A (de)
GB (1) GB902383A (de)
NL (2) NL231513A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280224A (de) * 1961-06-28
NL280850A (de) * 1961-07-12 1900-01-01
US3235943A (en) * 1962-01-04 1966-02-22 Corning Glass Works Method of making a flux free bonded article
US3310866A (en) * 1964-08-28 1967-03-28 Texas Instruments Inc Mountings for power transistors
DE2122104C3 (de) * 1971-05-05 1979-08-23 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum Anlöten eines metallischen Anschlußleiters an einen Halbleiterkörper

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6753C (de) * Dr. G. VON ECKENBRECHER in Düsseldorf, Jägerhofstr. 23 Selbstregulirendes horizontales Windrad
US1695791A (en) * 1927-08-06 1928-12-18 Yunck John Adam Leading-in wires for evacuated containers and process of making same
US2166998A (en) * 1938-08-02 1939-07-25 Westinghouse Electric & Mfg Co Method of brazing turbine blades
US2671958A (en) * 1950-03-20 1954-03-16 Garrett Corp Process of joining metal parts consisting of aluminum and its alloys
GB774800A (en) * 1954-05-03 1957-05-15 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
US2897587A (en) * 1955-05-23 1959-08-04 Philco Corp Method of fabricating semiconductor devices
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
US2947079A (en) * 1955-11-03 1960-08-02 Philco Corp Method of solder bonding
NL216979A (de) * 1956-05-18
BE563189A (de) * 1956-06-08
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication

Also Published As

Publication number Publication date
US3082522A (en) 1963-03-26
FR1210229A (fr) 1960-03-07
NL231513A (de) 1900-01-01
DE1166378B (de) 1964-03-26
GB902383A (en) 1962-08-01
BE571348A (de) 1900-01-01

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