MY200958A - Heat Dissipating Assembly for Circuit Device - Google Patents

Heat Dissipating Assembly for Circuit Device

Info

Publication number
MY200958A
MY200958A MYPI2018703063A MYPI2018703063A MY200958A MY 200958 A MY200958 A MY 200958A MY PI2018703063 A MYPI2018703063 A MY PI2018703063A MY PI2018703063 A MYPI2018703063 A MY PI2018703063A MY 200958 A MY200958 A MY 200958A
Authority
MY
Malaysia
Prior art keywords
heat dissipating
circuit device
circuit board
dissipating assembly
heat sink
Prior art date
Application number
MYPI2018703063A
Inventor
Takafumi Miyata
Wei Chun Ng
See Hooi Lim
Chia Siong Goh
Ai Kee Teoh
Original Assignee
Panasonic Mfg Malaysia Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Mfg Malaysia Berhad filed Critical Panasonic Mfg Malaysia Berhad
Priority to MYPI2018703063A priority Critical patent/MY200958A/en
Publication of MY200958A publication Critical patent/MY200958A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention relates to a circuit device (100) comprising a circuit board (200); and a heat dissipating assembly having a heat dissipating sheet (301) positioned adjacent to at least a portion of the circuit board (200); a heat sink (303); and an insulating component (302) sandwiched between the heat dissipating sheet (301) and heat sink (303); wherein the circuit board (200) has a combined power circuitry (201) and a control circuitry (202) formed thereon. The circuit device (100) is applicable to any electronic devices including ceiling fans. (The Most Illustrative Drawing: Figure 1)
MYPI2018703063A 2018-08-29 2018-08-29 Heat Dissipating Assembly for Circuit Device MY200958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI2018703063A MY200958A (en) 2018-08-29 2018-08-29 Heat Dissipating Assembly for Circuit Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2018703063A MY200958A (en) 2018-08-29 2018-08-29 Heat Dissipating Assembly for Circuit Device

Publications (1)

Publication Number Publication Date
MY200958A true MY200958A (en) 2024-01-25

Family

ID=90885667

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703063A MY200958A (en) 2018-08-29 2018-08-29 Heat Dissipating Assembly for Circuit Device

Country Status (1)

Country Link
MY (1) MY200958A (en)

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