MY196926A - Processing device for electronic components - Google Patents

Processing device for electronic components

Info

Publication number
MY196926A
MY196926A MYPI2019006612A MYPI2019006612A MY196926A MY 196926 A MY196926 A MY 196926A MY PI2019006612 A MYPI2019006612 A MY PI2019006612A MY PI2019006612 A MYPI2019006612 A MY PI2019006612A MY 196926 A MY196926 A MY 196926A
Authority
MY
Malaysia
Prior art keywords
sub
electronic components
processing mechanism
step processing
holding
Prior art date
Application number
MYPI2019006612A
Inventor
Hajime Takamatsu
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY196926A publication Critical patent/MY196926A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

This processing device (I) for electronic components (S) has a main table (2), a step processing mechanism (5a to 5j), a sub-table (10), and a direction correcting part (Se). The main table (2) has a plurality of holding mechanisms (6) for holding electronic components (S) and conveys the electronic components (S). The step processing mechanism (5a to 5j) is provided peripheral to the main table (2). The sub-table (I 0) is provided between the main table (2) and the step processing mechanism (5a to 5j). The sub-table (10) receives, at a first handover position (T1). an electronic component (S) from a holding mechanism ( 6) and conveys same to a processing position of the step processing mechanism (5a to 5j). The electronic component (S) step-processed in the step processing mechanism is handed over by the sub-table (10) to the holding mechanism (6) again at a second handover position (T2). The direction correcting part (Se) corrects misalignment in direction arising from the handover of the electronic component (S) to the sub-table (10). (FIG. 1)
MYPI2019006612A 2018-02-09 2019-02-05 Processing device for electronic components MY196926A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018021614A JP6516132B1 (en) 2018-02-09 2018-02-09 Electronic component processing device
PCT/JP2019/003995 WO2019156055A1 (en) 2018-02-09 2019-02-05 Processing device for electronic components

Publications (1)

Publication Number Publication Date
MY196926A true MY196926A (en) 2023-05-11

Family

ID=66625479

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006612A MY196926A (en) 2018-02-09 2019-02-05 Processing device for electronic components

Country Status (4)

Country Link
JP (1) JP6516132B1 (en)
CN (1) CN110622285B (en)
MY (1) MY196926A (en)
WO (1) WO2019156055A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021004109A (en) * 2019-06-25 2021-01-14 上野精機株式会社 Processing device of electronic component
JP6817648B1 (en) * 2019-09-20 2021-01-20 上野精機株式会社 Electronic component processing equipment
JP6836816B1 (en) * 2020-05-28 2021-03-03 上野精機株式会社 Electronic component processing equipment
JP6860249B1 (en) * 2020-05-28 2021-04-14 上野精機株式会社 Electronic component processing equipment
JP6842732B1 (en) * 2020-09-24 2021-03-17 上野精機株式会社 Electronic component processing equipment
WO2023229030A1 (en) * 2022-05-27 2023-11-30 上野精機株式会社 Component conveyance device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126477A (en) * 1997-06-30 1999-01-29 Toshiba Corp Method and device for manufacturing semiconductor device
JP3613122B2 (en) * 2000-03-16 2005-01-26 松下電器産業株式会社 Electronic component mounting equipment
JP4554852B2 (en) * 2001-09-05 2010-09-29 Ｎｅｃエンジニアリング株式会社 Electronic component measuring device
JP4849661B2 (en) * 2005-03-30 2012-01-11 上野精機株式会社 Electronic component processing equipment
JP2008173744A (en) * 2007-01-22 2008-07-31 Tokyo Electron Ltd Conveying position alignment method for conveying system
WO2013084297A1 (en) * 2011-12-06 2013-06-13 上野精機株式会社 Post-operation processing device, transportation device for externally placed unit, and electronic component transportation device
JP5975556B1 (en) * 2015-12-11 2016-08-23 上野精機株式会社 Transfer equipment

Also Published As

Publication number Publication date
WO2019156055A1 (en) 2019-08-15
JP2019140218A (en) 2019-08-22
JP6516132B1 (en) 2019-05-22
CN110622285B (en) 2022-10-28
CN110622285A (en) 2019-12-27

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