MY196457A - Low-Halogen Underfill, Preparation Method And Use Thereof - Google Patents

Low-Halogen Underfill, Preparation Method And Use Thereof

Info

Publication number
MY196457A
MY196457A MYPI2021001952A MYPI2021001952A MY196457A MY 196457 A MY196457 A MY 196457A MY PI2021001952 A MYPI2021001952 A MY PI2021001952A MY PI2021001952 A MYPI2021001952 A MY PI2021001952A MY 196457 A MY196457 A MY 196457A
Authority
MY
Malaysia
Prior art keywords
underfill
low
halogen
ppm
halogen content
Prior art date
Application number
MYPI2021001952A
Other languages
English (en)
Inventor
Yi Wei
Hebin Luo
Wanshuang Liu
Original Assignee
Bluesive Shanghai Electronic Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluesive Shanghai Electronic Mat Co Ltd filed Critical Bluesive Shanghai Electronic Mat Co Ltd
Publication of MY196457A publication Critical patent/MY196457A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MYPI2021001952A 2018-10-11 2019-08-26 Low-Halogen Underfill, Preparation Method And Use Thereof MY196457A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811183623.1A CN109233651A (zh) 2018-10-11 2018-10-11 一种低卤底部填充胶及其制备方法和应用
PCT/CN2019/102499 WO2020073747A1 (zh) 2018-10-11 2019-08-26 一种低卤底部填充胶及其制备方法和应用

Publications (1)

Publication Number Publication Date
MY196457A true MY196457A (en) 2023-04-12

Family

ID=65052683

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001952A MY196457A (en) 2018-10-11 2019-08-26 Low-Halogen Underfill, Preparation Method And Use Thereof

Country Status (4)

Country Link
CN (1) CN109233651A (zh)
MY (1) MY196457A (zh)
SG (1) SG11202103677PA (zh)
WO (1) WO2020073747A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108384191B (zh) * 2018-02-02 2022-08-09 浙江百合航太复合材料有限公司 一种低粘度高耐热增韧环氧树脂组合物
CN109233651A (zh) * 2018-10-11 2019-01-18 北京蓝海黑石科技有限公司 一种低卤底部填充胶及其制备方法和应用
CN110272686B (zh) * 2019-05-22 2021-10-26 北京蓝海黑石科技有限公司 一种低卤快速固化导电胶组合物及其制备方法
CN115074080B (zh) * 2022-07-21 2024-02-13 广州集泰化工股份有限公司 一种抗沉降有机硅灌封胶及其制备方法
CN115305022B (zh) * 2022-08-30 2024-03-26 华烁科技股份有限公司 一种环氧树脂电子灌封胶及其制备方法和应用
CN115785868B (zh) * 2022-12-02 2024-05-17 深圳先进电子材料国际创新研究院 一种低热阻高导热的底部填充胶及其制备方法
CN116875252B (zh) * 2023-08-11 2024-04-12 有行鲨鱼（上海）科技股份有限公司 一种低温固化倒装芯片填充胶及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010686B (zh) * 2010-09-30 2013-04-17 烟台德邦科技有限公司 一种双固化体系快速流动底部填充胶及其制备方法
CN102127384B (zh) * 2010-12-27 2014-01-01 广东风华高新科技股份有限公司 一种抗冲击和光衰的固晶绝缘胶及其制备方法
CN103725240A (zh) * 2013-12-27 2014-04-16 烟台德邦科技有限公司 一种储存稳定快速流动的底部填充胶及其制备方法
CN103937433B (zh) * 2014-04-01 2015-09-02 烟台德邦科技有限公司 一种高可靠性环保型底部填充材料及其制备方法
CN104119644B (zh) * 2014-06-09 2016-09-07 中山市盈兴电子有限公司 用于变压器的封装材料
JP6567080B2 (ja) * 2015-04-30 2019-08-28 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 一液型硬化性接着剤組成物およびその使用
CN106590320A (zh) * 2015-10-16 2017-04-26 中兴通讯股份有限公司 一种铝合金压铸件缺陷修补剂及其制备方法
CN106566450A (zh) * 2016-11-10 2017-04-19 烟台德邦科技有限公司 一种流动型芯片级底部填充胶及其制备方法
CN107474773B (zh) * 2017-09-09 2020-08-14 烟台德邦科技有限公司 一种智能卡芯片粘合剂及其制备方法
CN109233651A (zh) * 2018-10-11 2019-01-18 北京蓝海黑石科技有限公司 一种低卤底部填充胶及其制备方法和应用

Also Published As

Publication number Publication date
CN109233651A (zh) 2019-01-18
SG11202103677PA (en) 2021-05-28
WO2020073747A1 (zh) 2020-04-16

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