MY195445A - Electrical Device Having A Covering Material - Google Patents
Electrical Device Having A Covering MaterialInfo
- Publication number
- MY195445A MY195445A MYPI2018701733A MYPI2018701733A MY195445A MY 195445 A MY195445 A MY 195445A MY PI2018701733 A MYPI2018701733 A MY PI2018701733A MY PI2018701733 A MYPI2018701733 A MY PI2018701733A MY 195445 A MY195445 A MY 195445A
- Authority
- MY
- Malaysia
- Prior art keywords
- covering material
- electrical device
- electrical component
- cement material
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Thermistors And Varistors (AREA)
- Inorganic Insulating Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015223422.3A DE102015223422A1 (de) | 2015-11-26 | 2015-11-26 | Elektrische Vorrichtung mit einer Umhüllmasse |
| PCT/EP2016/077920 WO2017089208A1 (de) | 2015-11-26 | 2016-11-17 | Elektrische vorrichtung mit einer umhüllmasse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY195445A true MY195445A (en) | 2023-01-21 |
Family
ID=57421824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2018701733A MY195445A (en) | 2015-11-26 | 2016-11-17 | Electrical Device Having A Covering Material |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6639672B2 (de) |
| CN (1) | CN108292635B (de) |
| DE (1) | DE102015223422A1 (de) |
| MY (1) | MY195445A (de) |
| WO (1) | WO2017089208A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017114595A1 (de) * | 2017-06-29 | 2019-01-03 | MAGENWIRTH Technologies GmbH | Elektronische Schaltung |
| DE102018215694A1 (de) | 2018-09-14 | 2020-03-19 | Robert Bosch Gmbh | Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS482057Y1 (de) * | 1968-10-23 | 1973-01-19 | ||
| JPS5111303B1 (de) * | 1970-06-18 | 1976-04-10 | ||
| JPS5144873A (ja) * | 1974-10-16 | 1976-04-16 | Hitachi Ltd | Moorudogatahandotaisoshi |
| JPH0239461A (ja) * | 1988-07-28 | 1990-02-08 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JPH1050900A (ja) * | 1996-08-06 | 1998-02-20 | Nippon Kayaku Co Ltd | 樹脂封止型半導体装置 |
| US6815486B2 (en) * | 2002-04-12 | 2004-11-09 | Dow Corning Corporation | Thermally conductive phase change materials and methods for their preparation and use |
| JP4148351B2 (ja) * | 2002-07-08 | 2008-09-10 | 独立行政法人科学技術振興機構 | 誘電体材料 |
| JP2006201689A (ja) * | 2005-01-24 | 2006-08-03 | Fuji Xerox Co Ltd | 光学組成物、光学素子、及び調光方法 |
| JP4589269B2 (ja) * | 2006-06-16 | 2010-12-01 | ソニー株式会社 | 半導体装置およびその製造方法 |
| GB0721847D0 (en) * | 2007-11-07 | 2007-12-19 | Ciba Sc Holding Ag | Heat storage compositions and their manufacture |
| CN101869008B (zh) * | 2007-12-26 | 2012-08-29 | 松下电器产业株式会社 | 半导体装置和多层配线基板 |
| KR20090107882A (ko) * | 2008-04-10 | 2009-10-14 | 삼성전자주식회사 | 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법 |
| DE102009002519A1 (de) * | 2009-04-21 | 2010-10-28 | Robert Bosch Gmbh | Gekapselte Schaltungsvorrichtung für Substrate mit Absorptionsschicht sowie Verfahren zu Herstellung derselben |
| US8936864B2 (en) * | 2010-07-07 | 2015-01-20 | GM Global Technology Operations LLC | Batteries with phase change materials |
| EP2699631A4 (de) * | 2011-04-14 | 2015-01-21 | Ada Technologies Inc | Wärmeschnittstellenmaterialien sowie systeme und vorrichtungen damit |
| JP5591405B2 (ja) * | 2011-11-21 | 2014-09-17 | パナソニック株式会社 | 電気部品用樹脂、半導体装置、及び配線基板 |
| US9963627B2 (en) * | 2012-11-09 | 2018-05-08 | Bioastra Technologies Inc. | Nanostructured phase change materials for solid state thermal management |
| DE102013112267A1 (de) | 2013-11-07 | 2015-05-07 | Heraeus Deutschland GmbH & Co. KG | Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse |
-
2015
- 2015-11-26 DE DE102015223422.3A patent/DE102015223422A1/de active Pending
-
2016
- 2016-11-17 WO PCT/EP2016/077920 patent/WO2017089208A1/de active Application Filing
- 2016-11-17 CN CN201680069325.2A patent/CN108292635B/zh active Active
- 2016-11-17 MY MYPI2018701733A patent/MY195445A/en unknown
- 2016-11-17 JP JP2018527197A patent/JP6639672B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108292635A (zh) | 2018-07-17 |
| JP6639672B2 (ja) | 2020-02-05 |
| JP2018536996A (ja) | 2018-12-13 |
| CN108292635B (zh) | 2020-12-22 |
| WO2017089208A1 (de) | 2017-06-01 |
| DE102015223422A1 (de) | 2017-06-01 |
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