MY188351A - Soldering device and method for producing a solder connection, using base and pressure plates and a stop device - Google Patents

Soldering device and method for producing a solder connection, using base and pressure plates and a stop device

Info

Publication number
MY188351A
MY188351A MYPI2019006104A MYPI2019006104A MY188351A MY 188351 A MY188351 A MY 188351A MY PI2019006104 A MYPI2019006104 A MY PI2019006104A MY PI2019006104 A MYPI2019006104 A MY PI2019006104A MY 188351 A MY188351 A MY 188351A
Authority
MY
Malaysia
Prior art keywords
solder
components
producing
group
spacing
Prior art date
Application number
MYPI2019006104A
Other languages
English (en)
Inventor
Christoph Oetzel
Aaron Hutzler
Original Assignee
Pink Gmbh Thermosysteme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102017109748.1A external-priority patent/DE102017109748A1/de
Application filed by Pink Gmbh Thermosysteme filed Critical Pink Gmbh Thermosysteme
Publication of MY188351A publication Critical patent/MY188351A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2019006104A 2017-05-05 2018-05-07 Soldering device and method for producing a solder connection, using base and pressure plates and a stop device MY188351A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017109748.1A DE102017109748A1 (de) 2017-05-05 2017-05-05 Lötvorrichtung und Verfahren zum Herstellen einer Lötverbindung
DE202017105174 2017-08-28
PCT/EP2018/061728 WO2018202920A1 (de) 2017-05-05 2018-05-07 Lötvorrichtung und verfahren zum herstellen einer lötverbindung unter verwendung von basis- und andruckplatten und einer anschlagvorrichtung

Publications (1)

Publication Number Publication Date
MY188351A true MY188351A (en) 2021-12-02

Family

ID=62116886

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006104A MY188351A (en) 2017-05-05 2018-05-07 Soldering device and method for producing a solder connection, using base and pressure plates and a stop device

Country Status (7)

Country Link
EP (1) EP3618994B1 (de)
ES (1) ES2890237T3 (de)
HU (1) HUE056579T2 (de)
MY (1) MY188351A (de)
PT (1) PT3618994T (de)
SG (1) SG11201909929UA (de)
WO (1) WO2018202920A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352124A (zh) * 2018-12-12 2019-02-19 博耐尔汽车电气系统有限公司 一种冷水机用钎焊夹具及其钎焊方法
CN114192920A (zh) * 2021-12-10 2022-03-18 深圳市凯思特信息技术有限公司 一种线路板的多方式点焊装置及其点焊方法
CN114632995B (zh) * 2022-03-02 2022-12-30 浙江亚通新材料股份有限公司 一种可同时用于搭接与对接方式的石墨钎焊夹具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801069A (en) 1987-03-30 1989-01-31 Westinghouse Electric Corp. Method and apparatus for solder deposition
US5175410A (en) 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US5881453A (en) * 1994-05-17 1999-03-16 Tandem Computers, Incorporated Method for mounting surface mount devices to a circuit board
JP4402718B2 (ja) 2005-05-17 2010-01-20 パナソニック株式会社 フリップチップ実装方法
JP5807221B2 (ja) * 2010-06-28 2015-11-10 アユミ工業株式会社 接合構造体製造方法および加熱溶融処理方法ならびにこれらのシステム
US8603860B2 (en) * 2011-10-24 2013-12-10 Taiwan Semiconductor Manufacturing Company, L.L.C. Process for forming packages
US8684256B2 (en) * 2011-11-30 2014-04-01 Component Re-Engineering Company, Inc. Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing
WO2016091962A1 (de) 2014-12-09 2016-06-16 Pink Gmbh Thermosysteme Wärmeübertragungsvorrichtung für die lötverbindungsherstellung elektrischer bauteile
EP3095544B1 (de) * 2015-05-21 2018-09-19 Airbus Defence and Space GmbH Verfahren zum verbinden von teilen aus schwer lötbaren materialien

Also Published As

Publication number Publication date
WO2018202920A1 (de) 2018-11-08
EP3618994B1 (de) 2021-08-11
SG11201909929UA (en) 2019-11-28
EP3618994A1 (de) 2020-03-11
PT3618994T (pt) 2021-09-21
HUE056579T2 (hu) 2022-03-28
ES2890237T3 (es) 2022-01-18

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