MY186749A - Holding pin for holding wafers in wafer boats and process for the production thereof - Google Patents
Holding pin for holding wafers in wafer boats and process for the production thereofInfo
- Publication number
- MY186749A MY186749A MYPI2014701671A MYPI2014701671A MY186749A MY 186749 A MY186749 A MY 186749A MY PI2014701671 A MYPI2014701671 A MY PI2014701671A MY PI2014701671 A MYPI2014701671 A MY PI2014701671A MY 186749 A MY186749 A MY 186749A
- Authority
- MY
- Malaysia
- Prior art keywords
- holding
- holding pins
- silicon carbide
- pin
- holding pin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013106461.2A DE102013106461B4 (de) | 2013-06-20 | 2013-06-20 | Haltestifte zum Halten von Wafern in Waferbooten und Verfahren zum Herstellen solcher Haltestifte |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY186749A true MY186749A (en) | 2021-08-17 |
Family
ID=52010273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2014701671A MY186749A (en) | 2013-06-20 | 2014-06-19 | Holding pin for holding wafers in wafer boats and process for the production thereof |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102013106461B4 (de) |
| MY (1) | MY186749A (de) |
| TW (1) | TWI579216B (de) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3052116B2 (ja) * | 1994-10-26 | 2000-06-12 | 東京エレクトロン株式会社 | 熱処理装置 |
| US6113702A (en) * | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
| IL125690A0 (en) * | 1998-08-06 | 1999-04-11 | Reiser Raphael Joshua | Furnace for processing semiconductor wafers |
| DE10003639C2 (de) * | 2000-01-28 | 2003-06-18 | Steag Rtp Systems Gmbh | Vorrichtung zum thermischen Behandeln von Substraten |
| US6528767B2 (en) * | 2001-05-22 | 2003-03-04 | Applied Materials, Inc. | Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications |
| US6917755B2 (en) * | 2003-02-27 | 2005-07-12 | Applied Materials, Inc. | Substrate support |
| DE102005013831B4 (de) * | 2005-03-24 | 2008-10-16 | Siltronic Ag | Siliciumscheibe und Verfahren zur thermischen Behandlung einer Siliciumscheibe |
-
2013
- 2013-06-20 DE DE102013106461.2A patent/DE102013106461B4/de active Active
-
2014
- 2014-06-18 TW TW103121066A patent/TWI579216B/zh active
- 2014-06-19 MY MYPI2014701671A patent/MY186749A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE102013106461A1 (de) | 2014-12-24 |
| TWI579216B (zh) | 2017-04-21 |
| TW201505937A (zh) | 2015-02-16 |
| DE102013106461B4 (de) | 2016-10-27 |
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