MY185105A - Method for producing electrolytic copper foil - Google Patents

Method for producing electrolytic copper foil

Info

Publication number
MY185105A
MY185105A MYPI2020006407A MYPI2020006407A MY185105A MY 185105 A MY185105 A MY 185105A MY PI2020006407 A MYPI2020006407 A MY PI2020006407A MY PI2020006407 A MYPI2020006407 A MY PI2020006407A MY 185105 A MY185105 A MY 185105A
Authority
MY
Malaysia
Prior art keywords
copper foil
electrolytic copper
electrolytic
producing
additive
Prior art date
Application number
MYPI2020006407A
Inventor
Oguro Ryoichi
Original Assignee
Tex Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tex Tech Inc filed Critical Tex Tech Inc
Publication of MY185105A publication Critical patent/MY185105A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Cell Electrode Carriers And Collectors (AREA)

Abstract

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 tm or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.
MYPI2020006407A 2019-07-22 2020-06-03 Method for producing electrolytic copper foil MY185105A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019134775A JP6667840B1 (en) 2019-07-22 2019-07-22 Manufacturing method of electrolytic copper foil
PCT/JP2020/021928 WO2021014778A1 (en) 2019-07-22 2020-06-03 Method for producing electrolytic copper foil

Publications (1)

Publication Number Publication Date
MY185105A true MY185105A (en) 2021-04-30

Family

ID=70000614

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020006407A MY185105A (en) 2019-07-22 2020-06-03 Method for producing electrolytic copper foil

Country Status (13)

Country Link
US (1) US11773501B2 (en)
EP (1) EP3798336B1 (en)
JP (1) JP6667840B1 (en)
KR (1) KR20210013059A (en)
CN (1) CN112543822B (en)
ES (1) ES2961327T3 (en)
HU (1) HUE064556T2 (en)
MY (1) MY185105A (en)
PL (1) PL3798336T3 (en)
RS (1) RS64973B1 (en)
RU (1) RU2762281C1 (en)
TW (1) TWI731731B (en)
WO (1) WO2021014778A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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CN113337855B (en) * 2021-05-24 2022-04-05 常州大学 Filling material and preparation method, preparation method of electrolytic copper foil for high frequency signal transmission
CN113416985B (en) * 2021-07-06 2022-07-19 铜陵市华创新材料有限公司 Additive adding method for preventing edge tearing of 4.5-micron copper foil
CN113463155A (en) * 2021-07-26 2021-10-01 电子科技大学 Roughening liquid for electronic copper foil surface roughening treatment and surface roughening treatment process
WO2023057068A1 (en) * 2021-10-07 2023-04-13 Circuit Foil Luxembourg Copper foil with high engery at break and secondary battery comprising the same
KR102440711B1 (en) * 2022-05-11 2022-09-07 고려아연 주식회사 Method for controlling physical properties of electrolytic copper foil and manufacturing method thereof
KR102405236B1 (en) * 2022-05-11 2022-06-07 고려아연 주식회사 Method for manufacturing electrolytic copper foil
CN115369455B (en) * 2022-08-25 2023-07-21 广东腐蚀科学与技术创新研究院 Copper foil and production equipment and production method thereof
CN115287726B (en) * 2022-08-25 2023-06-23 广东腐蚀科学与技术创新研究院 Preparation device and method of titanium roller oxide film, copper foil and preparation method thereof
CN120265833A (en) * 2022-11-24 2025-07-04 Sk纳力世有限公司 Copper foil, electrode including the copper foil, secondary battery including the copper foil, and method for manufacturing the same
CN116411319A (en) * 2023-01-09 2023-07-11 安徽华威铜箔科技有限公司 Preparation method and product of additive for electrolytic copper foil with high ductility
CN116180166B (en) * 2023-03-01 2024-05-03 安徽华创新材料股份有限公司 Production method of 3.5-4 mu m double-sided light copper foil
KR20240134764A (en) * 2023-03-02 2024-09-10 듀폰 일렉트로닉스, 인크. An ultrathin copper foil, a method for manufacturing the same, and an article made therefrom

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JP4445616B2 (en) 1999-10-27 2010-04-07 Ｄｏｗａホールディングス株式会社 Electrolytic copper foil
JP2004006612A (en) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper-clad laminate using the copper foil with carrier foil
JP4273309B2 (en) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 Low rough surface electrolytic copper foil and method for producing the same
JP4296250B2 (en) 2005-06-14 2009-07-15 古河電気工業株式会社 Copper foil for high frequency circuit and manufacturing method thereof
KR101154203B1 (en) 2006-04-28 2012-06-18 미쓰이 긴조꾸 고교 가부시키가이샤 Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolytic copper foil
JP5255229B2 (en) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 Electrolytic copper foil, surface-treated copper foil using the electrolytic copper foil, copper-clad laminate using the surface-treated copper foil, and method for producing the electrolytic copper foil
RU2366764C2 (en) * 2006-07-24 2009-09-10 Борис Александрович Коновалов Method of production of copper low-profile foil and low-profile foil produced with implementation of this method
RU2350694C1 (en) * 2007-07-09 2009-03-27 Александр Иванович Вольхин Electrolyte for electrosheet copper production by means of electrolysis
JP5598700B2 (en) 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 Electrolytic copper foil and method for producing the same
KR101386093B1 (en) * 2010-04-14 2014-04-24 일진머티리얼즈 주식회사 Copper electrolysis solution for production of electrolytic copper foil, process for producing electrolytic copper foil and electrolytic copper foil
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CN102277597B (en) * 2011-08-12 2013-07-31 合肥铜冠国轩铜材有限公司 Preparation of double-sided photoelectrolytic copper foil for special lithium battery
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CN107460508B (en) * 2017-06-19 2019-11-05 江东电子材料有限公司 A kind of additive package and the technique for preparing 6 μm of high-performance electronic copper foils
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Also Published As

Publication number Publication date
JP6667840B1 (en) 2020-03-18
RU2762281C1 (en) 2021-12-17
US20210317590A1 (en) 2021-10-14
PL3798336T3 (en) 2024-03-11
US11773501B2 (en) 2023-10-03
TW202108824A (en) 2021-03-01
JP2021017630A (en) 2021-02-15
HUE064556T2 (en) 2024-03-28
TWI731731B (en) 2021-06-21
EP3798336B1 (en) 2023-10-04
EP3798336A4 (en) 2021-08-04
EP3798336C0 (en) 2023-10-04
RS64973B1 (en) 2024-01-31
ES2961327T3 (en) 2024-03-11
WO2021014778A1 (en) 2021-01-28
CN112543822B (en) 2022-09-16
CN112543822A (en) 2021-03-23
KR20210013059A (en) 2021-02-03
EP3798336A1 (en) 2021-03-31

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