MY184316A - Paste adhesive composition and semiconductor device - Google Patents

Paste adhesive composition and semiconductor device

Info

Publication number
MY184316A
MY184316A MYPI2020004351A MYPI2020004351A MY184316A MY 184316 A MY184316 A MY 184316A MY PI2020004351 A MYPI2020004351 A MY PI2020004351A MY PI2020004351 A MYPI2020004351 A MY PI2020004351A MY 184316 A MY184316 A MY 184316A
Authority
MY
Malaysia
Prior art keywords
temperature
adhesive composition
paste adhesive
heat treatment
silver particles
Prior art date
Application number
MYPI2020004351A
Inventor
Takayuki Nishi
Koki Kagomiya
Keiichi Kusaka
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Priority claimed from PCT/JP2019/006717 external-priority patent/WO2019167824A1/en
Publication of MY184316A publication Critical patent/MY184316A/en

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)

Abstract

A paste adhesive composition according to the present invention is a paste adhesive composition that contains silver particles and a monomer, in which a silver particle-linked structure is formed by eliminating an interface between the silver particles by a heat treatment, the silver particles include flake-shaped silver particles and spherical silver particles, and when the paste adhesive composition is heated from a temperature of 30?C to a temperature of 200?C at a temperature rising rate of 10 ?C/min, then subjected to a heat treatment at a temperature of 200?C for 60 minutes, then heated from a temperature of 200?C to a temperature of 450?C at a temperature rising time of 10 ?C/min, and then subjected to a heat treatment at a temperature of 450?C for 10 minutes, in a case where a percentage of a weight loss rate of the paste adhesive composition after the heat treatment at a temperature of 200?C for 60 minutes with respect to the paste adhesive composition before heating is W1 [%], and a percentage of a weight loss rate of the paste adhesive composition after the heat treatment at a temperature of 450?C for 10 minutes is W2 [%], (W2 - W1)/W2 is 0.20 or more and 0.90 or less under the following measurement conditions. As the measurement conditions, for the measurement method, a thermogravimetry-differential thermal analysis (TG-DTA) device is used, and the atmosphere is an air atmosphere.
MYPI2020004351A 2018-03-01 2019-02-22 Paste adhesive composition and semiconductor device MY184316A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018036597 2018-03-01
PCT/JP2019/006717 WO2019167824A1 (en) 2018-03-01 2019-02-22 Paste adhesive composition and semiconductor device

Publications (1)

Publication Number Publication Date
MY184316A true MY184316A (en) 2021-04-01

Family

ID=67766729

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020004351A MY184316A (en) 2018-03-01 2019-02-22 Paste adhesive composition and semiconductor device

Country Status (2)

Country Link
JP (1) JP6566177B1 (en)
MY (1) MY184316A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022070294A1 (en) * 2020-09-30 2022-04-07 Ｄｏｗａエレクトロニクス株式会社 Metal paste for joining and joining method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166841A (en) * 2008-03-10 2008-07-17 Hitachi Chem Co Ltd Adhesive, and semiconductor device
TWI608062B (en) * 2011-05-31 2017-12-11 住友電木股份有限公司 Resin composition, semiconductor device using said resin composition, and method of producing semiconductor device
JP6164256B2 (en) * 2015-07-08 2017-07-19 住友ベークライト株式会社 Thermally conductive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heat sink
KR102040529B1 (en) * 2016-08-19 2019-11-06 스미또모 베이크라이트 가부시키가이샤 Die attach pastes and semiconductor devices

Also Published As

Publication number Publication date
JP6566177B1 (en) 2019-08-28
JPWO2019167824A1 (en) 2020-04-16

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