MY180072A - Cr-ti alloy sputtering target material and method for producing same - Google Patents
Cr-ti alloy sputtering target material and method for producing sameInfo
- Publication number
- MY180072A MY180072A MYPI2017702896A MYPI2017702896A MY180072A MY 180072 A MY180072 A MY 180072A MY PI2017702896 A MYPI2017702896 A MY PI2017702896A MY PI2017702896 A MYPI2017702896 A MY PI2017702896A MY 180072 A MY180072 A MY 180072A
- Authority
- MY
- Malaysia
- Prior art keywords
- target material
- sputtering target
- ppm
- mass
- alloy sputtering
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
- G11B5/7373—Non-magnetic single underlayer comprising chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/06—Alloys based on chromium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
Abstract
Provided are: a Cr-Ti alloy sputtering target material, which is capable of suppressing the generation of fine particles during sputtering; and a method for producing this Cr-Ti alloy sputtering target material. A Cr-Ti alloy sputtering target material which is represented by a composition formula Cr100-x-Tix ( 40sXs60) in terms of the atomic ratio, with the balance made up of unavoidable impurities that include Mg, Al, Si, Mn, Ni, Cu and Sn in an amount of from 1 ppm by mass to 50 ppm by mass (inclusive) in total. A method for producing a Cr-Ti alloy sputtering target material, wherein a Ti powder that contains, as impurities, Mg, A1, Si, Mn, Ni, Cu and Sn in an amount of from 1 ppm by mass to 50 ppm by mass (inclusive) in total and a Cr powder that contains, as impurities, Mg, A1, Si, Mn, Ni, Cu and Sn in an amount of from 1 ppm by mass to 50 ppm by mass (inclusive) in total are mixed with each other and sintered under pressure.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015025303 | 2015-02-12 | ||
PCT/JP2016/053020 WO2016129449A1 (en) | 2015-02-12 | 2016-02-02 | Cr-Ti ALLOY SPUTTERING TARGET MATERIAL AND METHOD FOR PRODUCING SAME |
Publications (1)
Publication Number | Publication Date |
---|---|
MY180072A true MY180072A (en) | 2020-11-20 |
Family
ID=56614648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017702896A MY180072A (en) | 2015-02-12 | 2016-02-02 | Cr-ti alloy sputtering target material and method for producing same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6312009B2 (en) |
CN (1) | CN107208259B (en) |
MY (1) | MY180072A (en) |
SG (1) | SG11201706280XA (en) |
TW (1) | TW201631170A (en) |
WO (1) | WO2016129449A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7103233B2 (en) * | 2017-01-12 | 2022-07-20 | 日立金属株式会社 | Cr alloy target material |
CN111438355B (en) * | 2020-04-13 | 2022-02-22 | 河北晟华新材料科技有限公司 | Chromium-aluminum-silicon target material and preparation method thereof |
CN112517917B (en) * | 2020-11-25 | 2023-04-18 | 河南东微电子材料有限公司 | Preparation method of CrTiLa alloy powder for chromium-titanium target material |
CN112813326A (en) * | 2020-12-29 | 2021-05-18 | 有研工程技术研究院有限公司 | Titanium-aluminum-chromium alloy target and preparation method thereof |
TWI769081B (en) * | 2021-09-17 | 2022-06-21 | 光洋應用材料科技股份有限公司 | Cr-ni-ti alloy target and method of preparing the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3002265B2 (en) * | 1990-12-12 | 2000-01-24 | 日本重化学工業株式会社 | Method for producing high-purity chromium metal |
US5866067A (en) * | 1997-03-24 | 1999-02-02 | Sony Corporation And Materials Research Corporation | High purity chromium metal by casting with controlled oxygen content |
US6063254A (en) * | 1997-04-30 | 2000-05-16 | The Alta Group, Inc. | Method for producing titanium crystal and titanium |
US6309595B1 (en) * | 1997-04-30 | 2001-10-30 | The Altalgroup, Inc | Titanium crystal and titanium |
JP5854308B2 (en) * | 2010-05-06 | 2016-02-09 | 日立金属株式会社 | Cr-Ti alloy target material |
JP5734599B2 (en) * | 2010-08-17 | 2015-06-17 | 山陽特殊製鋼株式会社 | CrTi alloy sputtering target material and method for producing perpendicular magnetic recording medium using them |
US20140158532A1 (en) * | 2011-09-14 | 2014-06-12 | Jx Nippon Mining & Metals Corporation | High-purity copper-manganese-alloy sputtering target |
-
2016
- 2016-02-02 JP JP2016574745A patent/JP6312009B2/en active Active
- 2016-02-02 CN CN201680009216.1A patent/CN107208259B/en active Active
- 2016-02-02 SG SG11201706280XA patent/SG11201706280XA/en unknown
- 2016-02-02 MY MYPI2017702896A patent/MY180072A/en unknown
- 2016-02-02 WO PCT/JP2016/053020 patent/WO2016129449A1/en active Application Filing
- 2016-02-03 TW TW105103474A patent/TW201631170A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2016129449A1 (en) | 2017-11-24 |
TW201631170A (en) | 2016-09-01 |
TWI561638B (en) | 2016-12-11 |
SG11201706280XA (en) | 2017-09-28 |
CN107208259B (en) | 2019-08-13 |
JP6312009B2 (en) | 2018-04-18 |
WO2016129449A1 (en) | 2016-08-18 |
CN107208259A (en) | 2017-09-26 |
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