MY179785A - Underfill agent for use in camera module - Google Patents

Underfill agent for use in camera module

Info

Publication number
MY179785A
MY179785A MYPI2013000640A MYPI2013000640A MY179785A MY 179785 A MY179785 A MY 179785A MY PI2013000640 A MYPI2013000640 A MY PI2013000640A MY PI2013000640 A MYPI2013000640 A MY PI2013000640A MY 179785 A MY179785 A MY 179785A
Authority
MY
Malaysia
Prior art keywords
camera module
underfill agent
agent
underfill
suppressed
Prior art date
Application number
MYPI2013000640A
Inventor
Arao Kei
Imai Kazunari
Honma Hiroki
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY179785A publication Critical patent/MY179785A/en

Links

Abstract

There is provided an underfill agent for use in a camera module, which is advantageous in that when a cleaning step is performed after the sealing using the underfill agent, the generation of foreign matter can be suppressed. The present invention is related to an underfill agent for use in a camera module, comprising: (A) a liquid epoxy resin, (B) an unsaturated alicyclic acid anhydride having a molecular weight of 200 to 300, (C) a latent curing agent, (D) an inorganic filler, and (E) a coupling agent.
MYPI2013000640A 2012-07-04 2013-02-26 Underfill agent for use in camera module MY179785A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012150611A JP2014013825A (en) 2012-07-04 2012-07-04 Underfill agent for camera module

Publications (1)

Publication Number Publication Date
MY179785A true MY179785A (en) 2020-11-13

Family

ID=50109342

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013000640A MY179785A (en) 2012-07-04 2013-02-26 Underfill agent for use in camera module

Country Status (2)

Country Link
JP (1) JP2014013825A (en)
MY (1) MY179785A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6371148B2 (en) * 2014-07-16 2018-08-08 ナミックス株式会社 Adhesive for camera modules
JP2016139763A (en) * 2015-01-29 2016-08-04 ソニー株式会社 Imaging apparatus, electronic apparatus
KR102637946B1 (en) * 2015-09-30 2024-02-20 세키스이가가쿠 고교가부시키가이샤 Resin compositions and multilayer substrates
US10298820B2 (en) 2016-08-10 2019-05-21 Apple Inc. Camera module with embedded components

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316452A (en) * 2000-05-10 2001-11-13 Yasuhara Chemical Co Ltd Epoxy resin composition
JP2003026766A (en) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd Epoxy-based reactive diluent and liquid epoxy resin composition containing the same
JP2004235547A (en) * 2003-01-31 2004-08-19 Kyocera Corp Camera module and its manufacturing method
JP2008214381A (en) * 2007-02-28 2008-09-18 Nagase Chemtex Corp One-pack epoxy resin composition
JP5227119B2 (en) * 2007-09-03 2013-07-03 ナミックス株式会社 Light-heat combination type latent curable epoxy resin composition
JP2010053164A (en) * 2008-08-26 2010-03-11 Kyocera Chemical Corp Resin composition for encapsulation and resin-encapsulated semiconductor device
JP5728641B2 (en) * 2009-12-22 2015-06-03 パナソニックＩｐマネジメント株式会社 Semiconductor device

Also Published As

Publication number Publication date
JP2014013825A (en) 2014-01-23

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