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Application filed by Intel CorpfiledCriticalIntel Corp
Priority to MYPI2017700508ApriorityCriticalpatent/MY179221A/en
Priority claimed from PCT/US2014/056406external-prioritypatent/WO2016043761A1/en
Publication of MY179221ApublicationCriticalpatent/MY179221A/en
Embodiments of the invention include multi-die package (100) and methods of making such multi-die packages. In an embodiment a mold layer (140) has a first surface (141) and a second surface (142) that is opposite from the first surface (141). One or more first electrical components (120) that each have a solderable terminal (122) that is oriented to face the first surface (141) of the mold layer (140). The mold layer (140) may also have one or more second electrical components (130) that each have a second type of terminal that is oriented to face the second surface (142) of the mold layer (140). Embodiments may also include one or more conductive through vias formed between the first surface (141) of the mold layer (140) and the second surface (142) of the mold layer (140). Accordingly an electrical connection may be made from the second surface (142) of the mold layer (140) to the first electrical components (122) that are oriented to face the first surface (141) of the mold layer (140).
MYPI2017700508A2014-09-182014-09-18Method of embedding wlcsp components in e-wlb and e-plb
MY179221A
(en)