MY178419A - Swage mount having mixture of a conductive material and coating material and method of manufacturing the swage mount - Google Patents

Swage mount having mixture of a conductive material and coating material and method of manufacturing the swage mount

Info

Publication number
MY178419A
MY178419A MYPI2016703672A MYPI2016703672A MY178419A MY 178419 A MY178419 A MY 178419A MY PI2016703672 A MYPI2016703672 A MY PI2016703672A MY PI2016703672 A MYPI2016703672 A MY PI2016703672A MY 178419 A MY178419 A MY 178419A
Authority
MY
Malaysia
Prior art keywords
swage mount
mixture
coating material
conductive material
swage
Prior art date
Application number
MYPI2016703672A
Other languages
English (en)
Inventor
David Django Dexter
Ryan John Schmidt
Paul Wesley Smith
Original Assignee
Intri Plex Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intri Plex Tech Inc filed Critical Intri Plex Tech Inc
Publication of MY178419A publication Critical patent/MY178419A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4813—Mounting or aligning of arm assemblies, e.g. actuator arm supported by bearings, multiple arm assemblies, arm stacks or multiple heads on single arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4873—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives the arm comprising piezoelectric or other actuators for adjustment of the arm

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
MYPI2016703672A 2014-06-16 2015-06-09 Swage mount having mixture of a conductive material and coating material and method of manufacturing the swage mount MY178419A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/306,074 US9123367B1 (en) 2014-06-16 2014-06-16 Swage mount having a mixture of a conductive material and a coating material and method of manufacturing the swage mount

Publications (1)

Publication Number Publication Date
MY178419A true MY178419A (en) 2020-10-13

Family

ID=53938952

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2016703672A MY178419A (en) 2014-06-16 2015-06-09 Swage mount having mixture of a conductive material and coating material and method of manufacturing the swage mount
MYPI2020000862A MY204494A (en) 2014-06-16 2015-06-09 Swage mount having mixture of conductive material and coating material and method of manufacturing the swage mount

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2020000862A MY204494A (en) 2014-06-16 2015-06-09 Swage mount having mixture of conductive material and coating material and method of manufacturing the swage mount

Country Status (5)

Country Link
US (2) US9123367B1 (enExample)
JP (1) JP6523325B2 (enExample)
CN (1) CN106537504B (enExample)
MY (2) MY178419A (enExample)
WO (1) WO2015195400A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8885299B1 (en) * 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
EP2917026A1 (de) * 2012-11-09 2015-09-16 Evonik Röhm GmbH Mehrfarbiger extrusionsbasierter-3d-druck
US9123367B1 (en) * 2014-06-16 2015-09-01 Intri-Plex Technologies, Inc. Swage mount having a mixture of a conductive material and a coating material and method of manufacturing the swage mount
US10373634B2 (en) * 2016-06-30 2019-08-06 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive head suspension with non-parallel motors
US11232811B2 (en) * 2020-02-26 2022-01-25 Western Digital Technologies, Inc. Offset swage baseplate for stacked assembly

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583930A (en) * 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US5672435A (en) * 1994-12-12 1997-09-30 The Dow Chemical Company Hard disk drive components and methods of making same
US5833777A (en) * 1997-09-16 1998-11-10 Intri-Plex Technologies, Inc. Base plate for suspension assembly in a hard disk drive with a hardened flange and soft hub
US6754044B1 (en) * 1998-05-19 2004-06-22 David A. Janes Swage mounting using surface protrusions
US6231698B1 (en) * 1998-05-19 2001-05-15 David A. Janes Surface hardened swage mount for improved performance
US7324307B2 (en) * 2002-02-20 2008-01-29 Intri-Plex Technologies, Inc. Plated base plate for suspension assembly in hard disk drive
US7304824B2 (en) * 2002-09-10 2007-12-04 Intri-Plex Technologies, Inc. Plated base plate for suspension assembly in disk drive
US20060289311A1 (en) * 2002-09-10 2006-12-28 Brink Damon D Method for making a base plate for suspension assembly in hard disk drive
US7064401B2 (en) * 2003-03-06 2006-06-20 Matsushita Electric Industrial Co., Ltd. Thin film piezoelectric element, method of manufacturing the same, and actuator
US7450344B2 (en) * 2003-11-12 2008-11-11 Intri-Plex Technologies, Inc. Remelted Magnetic head support structure in a disk drive
US7190555B2 (en) * 2004-07-27 2007-03-13 Intri-Plex Technologies, Inc. Micro-hub swage mount for attachment of suspension assembly in hard disk drive
JP4170323B2 (ja) * 2005-07-20 2008-10-22 富士通株式会社 ヘッドスライダ用サスペンション
JP5508789B2 (ja) * 2009-08-28 2014-06-04 エイチジーエスティーネザーランドビーブイ ヘッド・ジンバル・アセンブリ
JP5481151B2 (ja) * 2009-10-09 2014-04-23 日本発條株式会社 ディスク装置用サスペンションと、その製造方法
JP5383557B2 (ja) * 2010-03-03 2014-01-08 日本発條株式会社 ヘッドサスペンション及びヘッドサスペンションの製造方法
US8542465B2 (en) * 2010-03-17 2013-09-24 Western Digital Technologies, Inc. Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
JP5478331B2 (ja) * 2010-03-31 2014-04-23 日本発條株式会社 電子機器と、ディスク装置用サスペンション
US8570688B1 (en) * 2010-11-08 2013-10-29 Magnecomp Corporation Electrical connections to a microactuator in a hard disk drive suspension
US8828213B2 (en) * 2011-02-09 2014-09-09 Dai Nippon Printing Co., Ltd. Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate
US8446694B1 (en) * 2011-06-14 2013-05-21 Western Digital Technologies, Inc. Disk drive head suspension assembly with embedded in-plane actuator at flexure tongue
US9123367B1 (en) * 2014-06-16 2015-09-01 Intri-Plex Technologies, Inc. Swage mount having a mixture of a conductive material and a coating material and method of manufacturing the swage mount

Also Published As

Publication number Publication date
US20150361537A1 (en) 2015-12-17
US9359665B2 (en) 2016-06-07
CN106537504A (zh) 2017-03-22
JP6523325B2 (ja) 2019-05-29
US9123367B1 (en) 2015-09-01
WO2015195400A1 (en) 2015-12-23
MY204494A (en) 2024-08-30
JP2017518599A (ja) 2017-07-06
CN106537504B (zh) 2019-04-12

Similar Documents

Publication Publication Date Title
MY204494A (en) Swage mount having mixture of conductive material and coating material and method of manufacturing the swage mount
SG11202001546WA (en) Ni-BASED CORROSION-RESISTANT ALLOY POWDER FOR ADDITIVE MANUFACTURING, AND METHOD FOR PRODUCING ADDITIVE MANUFACTURING PRODUCT OR MEMBER FOR SEMICONDUCTOR PRODUCTION DEVICES USING THE POWDER
WO2014201252A3 (en) Messenger rna based viral production
EA201301126A1 (ru) Упрочняемый изнашиваемый узел, изготавливаемый с использованием твердой пайки, и соответствующие способ и узел, используемые в процессе изготовления
JP2015164123A5 (enExample)
SG11202006455TA (en) Method for producing glass substrate for magnetic disk
JP2018512415A5 (enExample)
JP2017528591A5 (enExample)
MX2017002941A (es) Aditivo de soldadura y procedimiento para la fabricacion de un grupo constructivo mediante una union de material.
WO2015017478A3 (en) SYNTHESIS OF CdSe/ZnS CORE/SHELL SEMICONDUCTOR NANOWIRES
EP3526357B8 (en) High temperature, damage tolerant superalloy, an article of manufacture made from the alloy, and process for making the alloy
JP2016531238A5 (enExample)
MY172218A (en) Nutritional compositions containing a peptide component with anti-flammatory properties and uses thereof
JP2015143837A5 (ja) トナーおよびトナーの製造方法
IL282970A (en) Control of trace metals during production of anti-CD38 antibodies
WO2016164650A8 (en) Reduced larsen effect electrode
HK1245297A1 (zh) 提高重组蛋白产量的方法
HK1251415A1 (zh) 调味部件以及用於制造调味部件的设备和方法
ZA201808449B (en) Process for pd-catalyzed hydroxycarbonylation of diisobutene: ratio of 3,5,5-trimethylhexanoic acid / h2o
WO2015075090A3 (en) Strike constructions, picks comprising same and methods for making same
MX2018007103A (es) Proceso para la fabricacion de granulos.
EP3459933A3 (en) Solid forms of a pharmaceutically active compound
MX393759B (es) Suspensiones inyectables
WO2010047496A3 (ko) 높은 분출력을 갖는 반송장치 및 이 반송장치에 사용되는 반송플레이트의 제조방법
WO2020106253A3 (en) A plating hanger for obtaining homogeneous plating