MY177520A - Lead frame and method for manufacturing the same - Google Patents

Lead frame and method for manufacturing the same

Info

Publication number
MY177520A
MY177520A MYPI2016700335A MYPI2016700335A MY177520A MY 177520 A MY177520 A MY 177520A MY PI2016700335 A MYPI2016700335 A MY PI2016700335A MY PI2016700335 A MYPI2016700335 A MY PI2016700335A MY 177520 A MY177520 A MY 177520A
Authority
MY
Malaysia
Prior art keywords
parts
dam bar
lead frame
manufacturing
thicknesses
Prior art date
Application number
MYPI2016700335A
Inventor
Ikeda Takaki
Original Assignee
Ohkuchi Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohkuchi Mat Co Ltd filed Critical Ohkuchi Mat Co Ltd
Publication of MY177520A publication Critical patent/MY177520A/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G23/00—Other table equipment
    • A47G23/02—Glass or bottle holders
    • A47G23/0208—Glass or bottle holders for drinking-glasses, plastic cups, or the like
    • A47G23/0216—Glass or bottle holders for drinking-glasses, plastic cups, or the like for one glass or cup
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/38—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
    • B65D81/3865—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation drinking cups or like containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

[Problem] The objective of the present invention is to offer a lead frame applicable regardless of width of dam bar (1, 50) to be cut, having a large degree of freedom of design, making cutting process easy by efficiently reducing a volume of metal to be cut, and making it possible to sufficiently inhibit deformation of or warp of the dam bar (1, 50) and a method of manufacturing the same. [Solution] In a lead frame according which is a matrix type lead frame producing product units, includes a dam bar (1, 50) including first parts (1a, 53) linking to terminals (2) respectively and second parts adjacent to the first parts (1a, 53) respectively and not linking to the terminals (2), and is made of a metal plate, the dam bar (1, 50) includes a surface at each of the first parts (1a, 53) and the second parts which is subjected to half etching on at least one of front and reverge sides of the metal plate so that the surfaces at the first parts (1 a, 53) differ from the surfaces at the second parts in etching depth and in that thicknesses of the dam bar (1, 50) at the first parts (1a, 53) differ from thicknesses of the dam bar (1, 50) at the second parts.
MYPI2016700335A 2015-01-30 2016-01-29 Lead frame and method for manufacturing the same MY177520A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015017503A JP6443978B2 (en) 2015-01-30 2015-01-30 Lead frame and manufacturing method thereof

Publications (1)

Publication Number Publication Date
MY177520A true MY177520A (en) 2020-09-17

Family

ID=56570735

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700335A MY177520A (en) 2015-01-30 2016-01-29 Lead frame and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP6443978B2 (en)
KR (1) KR102443996B1 (en)
CN (1) CN105845657B (en)
MY (1) MY177520A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106332450A (en) * 2016-08-31 2017-01-11 王欣 Conductor hollow circuit board and manufacturing method
JP6856497B2 (en) * 2017-01-12 2021-04-07 株式会社三井ハイテック Lead frame
JP6327732B1 (en) * 2017-06-22 2018-05-23 大口マテリアル株式会社 Lead frame and manufacturing method thereof
WO2019026917A1 (en) * 2017-07-31 2019-02-07 大日本印刷株式会社 Lead frame, semiconductor device and method for producing semiconductor device
JP6938326B2 (en) * 2017-10-17 2021-09-22 大口マテリアル株式会社 Lead frame and its manufacturing method
US11031353B2 (en) * 2019-08-23 2021-06-08 Micron Technology, Inc. Warpage control in microelectronic packages, and related assemblies and methods
KR102514564B1 (en) * 2021-06-28 2023-03-29 해성디에스 주식회사 Lead frame including grooved lead
KR102586967B1 (en) * 2022-04-05 2023-10-11 해성디에스 주식회사 Lead frame including grooved lead

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296254A (en) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd Lead frame
JP2001320007A (en) * 2000-05-09 2001-11-16 Dainippon Printing Co Ltd Frame for resin sealed semiconductor device
US6608366B1 (en) * 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
JP2004063803A (en) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd Method of manufacturing printed wiring board, metallic sheet for printed wiring board, and connected printed wiring board
US7153724B1 (en) * 2003-08-08 2006-12-26 Ns Electronics Bangkok (1993) Ltd. Method of fabricating no-lead package for semiconductor die with half-etched leadframe
JP2007281207A (en) * 2006-04-07 2007-10-25 Renesas Technology Corp Method for manufacturing semiconductor device
JP5214911B2 (en) 2006-12-27 2013-06-19 株式会社デンソー Mold package manufacturing method
JP5807800B2 (en) 2010-11-18 2015-11-10 大日本印刷株式会社 Leadframe and leadframe manufacturing method
JP5997971B2 (en) * 2012-08-09 2016-09-28 株式会社三井ハイテック Lead frame
JP6143468B2 (en) * 2013-01-11 2017-06-07 株式会社三井ハイテック Lead frame

Also Published As

Publication number Publication date
CN105845657A (en) 2016-08-10
JP6443978B2 (en) 2018-12-26
JP2016143730A (en) 2016-08-08
KR20160094280A (en) 2016-08-09
CN105845657B (en) 2020-09-11
KR102443996B1 (en) 2022-09-15

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