MY177520A - Lead frame and method for manufacturing the same - Google Patents
Lead frame and method for manufacturing the sameInfo
- Publication number
- MY177520A MY177520A MYPI2016700335A MYPI2016700335A MY177520A MY 177520 A MY177520 A MY 177520A MY PI2016700335 A MYPI2016700335 A MY PI2016700335A MY PI2016700335 A MYPI2016700335 A MY PI2016700335A MY 177520 A MY177520 A MY 177520A
- Authority
- MY
- Malaysia
- Prior art keywords
- parts
- dam bar
- lead frame
- manufacturing
- thicknesses
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G23/00—Other table equipment
- A47G23/02—Glass or bottle holders
- A47G23/0208—Glass or bottle holders for drinking-glasses, plastic cups, or the like
- A47G23/0216—Glass or bottle holders for drinking-glasses, plastic cups, or the like for one glass or cup
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/38—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
- B65D81/3865—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation drinking cups or like containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
[Problem] The objective of the present invention is to offer a lead frame applicable regardless of width of dam bar (1, 50) to be cut, having a large degree of freedom of design, making cutting process easy by efficiently reducing a volume of metal to be cut, and making it possible to sufficiently inhibit deformation of or warp of the dam bar (1, 50) and a method of manufacturing the same. [Solution] In a lead frame according which is a matrix type lead frame producing product units, includes a dam bar (1, 50) including first parts (1a, 53) linking to terminals (2) respectively and second parts adjacent to the first parts (1a, 53) respectively and not linking to the terminals (2), and is made of a metal plate, the dam bar (1, 50) includes a surface at each of the first parts (1a, 53) and the second parts which is subjected to half etching on at least one of front and reverge sides of the metal plate so that the surfaces at the first parts (1 a, 53) differ from the surfaces at the second parts in etching depth and in that thicknesses of the dam bar (1, 50) at the first parts (1a, 53) differ from thicknesses of the dam bar (1, 50) at the second parts.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015017503A JP6443978B2 (en) | 2015-01-30 | 2015-01-30 | Lead frame and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MY177520A true MY177520A (en) | 2020-09-17 |
Family
ID=56570735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016700335A MY177520A (en) | 2015-01-30 | 2016-01-29 | Lead frame and method for manufacturing the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6443978B2 (en) |
KR (1) | KR102443996B1 (en) |
CN (1) | CN105845657B (en) |
MY (1) | MY177520A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106332450A (en) * | 2016-08-31 | 2017-01-11 | 王欣 | Conductor hollow circuit board and manufacturing method |
JP6856497B2 (en) * | 2017-01-12 | 2021-04-07 | 株式会社三井ハイテック | Lead frame |
JP6327732B1 (en) * | 2017-06-22 | 2018-05-23 | 大口マテリアル株式会社 | Lead frame and manufacturing method thereof |
WO2019026917A1 (en) * | 2017-07-31 | 2019-02-07 | 大日本印刷株式会社 | Lead frame, semiconductor device and method for producing semiconductor device |
JP6938326B2 (en) * | 2017-10-17 | 2021-09-22 | 大口マテリアル株式会社 | Lead frame and its manufacturing method |
US11031353B2 (en) * | 2019-08-23 | 2021-06-08 | Micron Technology, Inc. | Warpage control in microelectronic packages, and related assemblies and methods |
KR102514564B1 (en) * | 2021-06-28 | 2023-03-29 | 해성디에스 주식회사 | Lead frame including grooved lead |
KR102586967B1 (en) * | 2022-04-05 | 2023-10-11 | 해성디에스 주식회사 | Lead frame including grooved lead |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03296254A (en) * | 1990-02-06 | 1991-12-26 | Dainippon Printing Co Ltd | Lead frame |
JP2001320007A (en) * | 2000-05-09 | 2001-11-16 | Dainippon Printing Co Ltd | Frame for resin sealed semiconductor device |
US6608366B1 (en) * | 2002-04-15 | 2003-08-19 | Harry J. Fogelson | Lead frame with plated end leads |
JP2004063803A (en) * | 2002-07-29 | 2004-02-26 | Ngk Spark Plug Co Ltd | Method of manufacturing printed wiring board, metallic sheet for printed wiring board, and connected printed wiring board |
US7153724B1 (en) * | 2003-08-08 | 2006-12-26 | Ns Electronics Bangkok (1993) Ltd. | Method of fabricating no-lead package for semiconductor die with half-etched leadframe |
JP2007281207A (en) * | 2006-04-07 | 2007-10-25 | Renesas Technology Corp | Method for manufacturing semiconductor device |
JP5214911B2 (en) | 2006-12-27 | 2013-06-19 | 株式会社デンソー | Mold package manufacturing method |
JP5807800B2 (en) * | 2010-11-18 | 2015-11-10 | 大日本印刷株式会社 | Leadframe and leadframe manufacturing method |
JP5997971B2 (en) * | 2012-08-09 | 2016-09-28 | 株式会社三井ハイテック | Lead frame |
JP6143468B2 (en) * | 2013-01-11 | 2017-06-07 | 株式会社三井ハイテック | Lead frame |
-
2015
- 2015-01-30 JP JP2015017503A patent/JP6443978B2/en active Active
-
2016
- 2016-01-20 KR KR1020160007108A patent/KR102443996B1/en active IP Right Grant
- 2016-01-29 MY MYPI2016700335A patent/MY177520A/en unknown
- 2016-01-29 CN CN201610064353.7A patent/CN105845657B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102443996B1 (en) | 2022-09-15 |
JP2016143730A (en) | 2016-08-08 |
CN105845657B (en) | 2020-09-11 |
JP6443978B2 (en) | 2018-12-26 |
KR20160094280A (en) | 2016-08-09 |
CN105845657A (en) | 2016-08-10 |
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