MY173995A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY173995A
MY173995A MYPI2014002719A MYPI2014002719A MY173995A MY 173995 A MY173995 A MY 173995A MY PI2014002719 A MYPI2014002719 A MY PI2014002719A MY PI2014002719 A MYPI2014002719 A MY PI2014002719A MY 173995 A MY173995 A MY 173995A
Authority
MY
Malaysia
Prior art keywords
polishing
polishing composition
abrasive
face
composition
Prior art date
Application number
MYPI2014002719A
Inventor
Yokomichi Noritaka
Kamiya Tomohide
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY173995A publication Critical patent/MY173995A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A polishing composition that can be preferably applied to polishing using a polishing pad having a polyurethane foam polishing face is provide. This invention provides a polishing composition comprising an abrasive and water. When Dm0 is the mean secondary particle diameter of the abrasive in the polishing composition and DmA is the mean secondary particle diameter of the abrasive in a mixture of a test solution A having an electrical conductivity of 10 ?S/cm and the polishing composition at a 1:1 volume ratio, the polishing composition has a rate of change of the mean secondary diameter, PA, of 10 % or lower when determined by the next equation: PA (%) = |DmA - Dm0|/Dm0 ? 100. Herein, the test solution A is prepared with aqueous extracts of the polyurethane foam polishing face after dressing of the polishing pad having the polishing face.
MYPI2014002719A 2013-10-01 2014-09-23 Polishing composition MY173995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013206847A JP6512732B2 (en) 2013-10-01 2013-10-01 Test method of polishing composition

Publications (1)

Publication Number Publication Date
MY173995A true MY173995A (en) 2020-03-03

Family

ID=53014273

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014002719A MY173995A (en) 2013-10-01 2014-09-23 Polishing composition

Country Status (2)

Country Link
JP (1) JP6512732B2 (en)
MY (1) MY173995A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809779B2 (en) * 2015-08-25 2021-01-06 株式会社フジミインコーポレーテッド Polishing pads, polishing pad conditioning methods, pad conditioning agents, their use
JP6688129B2 (en) * 2016-03-30 2020-04-28 株式会社フジミインコーポレーテッド Polishing composition, method for producing magnetic disk substrate, and method for polishing magnetic disk substrate
JP7253335B2 (en) * 2018-07-31 2023-04-06 株式会社フジミインコーポレーテッド Polishing composition, method for producing same, and polishing method using polishing composition

Also Published As

Publication number Publication date
JP6512732B2 (en) 2019-05-15
JP2015071660A (en) 2015-04-16

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