MY173995A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY173995A MY173995A MYPI2014002719A MYPI2014002719A MY173995A MY 173995 A MY173995 A MY 173995A MY PI2014002719 A MYPI2014002719 A MY PI2014002719A MY PI2014002719 A MYPI2014002719 A MY PI2014002719A MY 173995 A MY173995 A MY 173995A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- polishing composition
- abrasive
- face
- composition
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing composition that can be preferably applied to polishing using a polishing pad having a polyurethane foam polishing face is provide. This invention provides a polishing composition comprising an abrasive and water. When Dm0 is the mean secondary particle diameter of the abrasive in the polishing composition and DmA is the mean secondary particle diameter of the abrasive in a mixture of a test solution A having an electrical conductivity of 10 ?S/cm and the polishing composition at a 1:1 volume ratio, the polishing composition has a rate of change of the mean secondary diameter, PA, of 10 % or lower when determined by the next equation: PA (%) = |DmA - Dm0|/Dm0 ? 100. Herein, the test solution A is prepared with aqueous extracts of the polyurethane foam polishing face after dressing of the polishing pad having the polishing face.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013206847A JP6512732B2 (en) | 2013-10-01 | 2013-10-01 | Test method of polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MY173995A true MY173995A (en) | 2020-03-03 |
Family
ID=53014273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014002719A MY173995A (en) | 2013-10-01 | 2014-09-23 | Polishing composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6512732B2 (en) |
MY (1) | MY173995A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6809779B2 (en) * | 2015-08-25 | 2021-01-06 | 株式会社フジミインコーポレーテッド | Polishing pads, polishing pad conditioning methods, pad conditioning agents, their use |
JP6688129B2 (en) * | 2016-03-30 | 2020-04-28 | 株式会社フジミインコーポレーテッド | Polishing composition, method for producing magnetic disk substrate, and method for polishing magnetic disk substrate |
JP7253335B2 (en) * | 2018-07-31 | 2023-04-06 | 株式会社フジミインコーポレーテッド | Polishing composition, method for producing same, and polishing method using polishing composition |
-
2013
- 2013-10-01 JP JP2013206847A patent/JP6512732B2/en active Active
-
2014
- 2014-09-23 MY MYPI2014002719A patent/MY173995A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6512732B2 (en) | 2019-05-15 |
JP2015071660A (en) | 2015-04-16 |
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