MY173514A - Electronic component unit and production method thereof - Google Patents
Electronic component unit and production method thereofInfo
- Publication number
- MY173514A MY173514A MYPI2015703761A MYPI2015703761A MY173514A MY 173514 A MY173514 A MY 173514A MY PI2015703761 A MYPI2015703761 A MY PI2015703761A MY PI2015703761 A MYPI2015703761 A MY PI2015703761A MY 173514 A MY173514 A MY 173514A
- Authority
- MY
- Malaysia
- Prior art keywords
- electronic component
- component unit
- case
- production method
- printed board
- Prior art date
Links
Abstract
An electronic component unit (1) includes a printed board (2), an electronic component (3) having a base portion (31) fixed to the printed board (2), a case (4) accommodating the printed board (2) and the electronic component (3) therein, and a foamed resin (5) injected in the case (4). A head portion (32) of the electronic component (3) is fixed to the 10 case (4) through the foamed resin (5). Also, the foamed resin (5) closes a hole portion (41) of the case (4). Accordingly, weight of the electronic component unit (1) can be reduced, and the electronic component unit (1) has an excellent vibration resistance.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014223058A JP6405897B2 (en) | 2014-10-31 | 2014-10-31 | Electronic component unit and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MY173514A true MY173514A (en) | 2020-01-30 |
Family
ID=55888321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015703761A MY173514A (en) | 2014-10-31 | 2015-10-20 | Electronic component unit and production method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6405897B2 (en) |
CN (1) | CN105578823B (en) |
MY (1) | MY173514A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109404536B (en) * | 2017-08-15 | 2022-05-17 | 博西华电器(江苏)有限公司 | Detachable sealing structure and sealing method thereof |
CN110678032A (en) * | 2019-11-01 | 2020-01-10 | 珠海格力电器股份有限公司 | Electrical apparatus box and air conditioner |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3654448B2 (en) * | 1993-10-06 | 2005-06-02 | Tdk株式会社 | Electrical equipment |
JPH08236962A (en) * | 1995-02-22 | 1996-09-13 | Furukawa Electric Co Ltd:The | Structure for supporting substrate mounted with electric parts |
JPH1051158A (en) * | 1996-08-02 | 1998-02-20 | Denso Corp | Circuit device |
JP4289073B2 (en) * | 2003-02-19 | 2009-07-01 | 東芝ライテック株式会社 | Wiring board housing device and discharge lamp lighting device |
DE102008040501A1 (en) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Improved heat dissipation from a control unit |
DE102010062653A1 (en) * | 2010-12-08 | 2012-06-14 | Robert Bosch Gmbh | Control module and method for its manufacture |
-
2014
- 2014-10-31 JP JP2014223058A patent/JP6405897B2/en active Active
-
2015
- 2015-10-20 MY MYPI2015703761A patent/MY173514A/en unknown
- 2015-10-29 CN CN201510725901.1A patent/CN105578823B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105578823B (en) | 2019-09-10 |
CN105578823A (en) | 2016-05-11 |
JP2016092123A (en) | 2016-05-23 |
JP6405897B2 (en) | 2018-10-17 |
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