JPH08236962A - Structure for supporting substrate mounted with electric parts - Google Patents

Abstract

PURPOSE: To provide an inexpensive structure-for supporting substrate mounted with electric parts with which a substrate mounted with electric parts can be assembled easily. CONSTITUTION: Electric parts 15-17 are fitted to the lower surface of a substrate 13 and the bottoms of the parts 15-17 are supported by a supporting body 20 which is deformed in accordance with the bottoms of the parts 15-17. Since a supporting structure uses the supporting body 20 which is deformed in accordance with the bottoms of the parts 15-17, a substrate can be easily assembled by using the inexpensive supporting body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support structure for a large-current printed circuit board or the like on which heavy electric parts are mounted.

[0002]

2. Description of the Related Art As shown in FIG. 6, a large-current printed circuit board is arranged such that a thick conductor (copper bar) 31 is attached to the surface of the circuit board 13 or sandwiched inside the circuit board 13. .
The printed circuit board 13 for large current is made to stand upright and floated, and the conductor 15 and the capacitor are provided under the board 13.
16, heavy electric parts such as the power module 17 are positioned, and these are electrically connected to the thick conductor 31 by soldering or screwing. For this reason, the substrate 13 is easily bent due to the weight of the thick conductor 31 and the electric components 15 to 17, and may be damaged if vibration is applied thereto to cause resonance. For this reason, as shown in FIG. 7, a base 32 is installed under each of the electric components 15 to 17 so that the substrate 13 is not weighted. Conventionally, as the base 32, one which is molded in a predetermined shape in advance is used. In the figure, 11 is a pedestal.

[0003]

However, the method of installing the base has the following problems. Since the shape of the base differs for each electric component and high dimensional accuracy is required, the cost of designing and manufacturing the base becomes high.
Since the work of fixing the base to the pedestal and then fixing the electric parts to the base is performed for each electric part, it is troublesome. An object of the present invention is to provide a support structure for a substrate on which electric parts are mounted, which is inexpensive and easy to assemble.

[0004]

According to the present invention, an electric component is attached to a lower surface of a substrate, and the lower side of the electric component is supported by a support body which is deformed corresponding to the position of the lower surface of the electric component. This is a support structure for a board on which an electric component is mounted.

In the present invention, the support preferably used is one whose height changes when an object is placed on it or pushed from above, or one in which a filling is contained in a bag. It can be illustrated. For example, it is a sponge or a bag (preferably made of rubber) containing gas, liquid, powder, granular material, or the like. As the gas to be put in the bag, air, nitrogen gas, etc., as the liquid, water, an organic solvent, etc., as the particulate matter,
Examples thereof include plastic particles, glass particles and sand. In addition, a bag such as a vinyl bag is set in the space under the substrate in advance, and then the raw material of the foamed polyurethane is injected into this bag to foam under the substrate or to accommodate the above-mentioned granular material, so that an electrical component can be obtained. The present invention also includes a structure in which the support is formed in a shape corresponding to the position of the lower surface of the substrate, preferably in accordance with the spatial shape under the substrate. Since the bag may be broken or the electric parts may be damaged if there is a sharp portion, it is preferable that the granular material has no sharp portion, particularly a spherical shape. Another advantage of using spherical granules is that the spherical granules tend to move relative to each other, making it easier for the support to adapt to the shape of the space under the substrate. The smaller the diameter of the same spherical particles,
This deformability is improved. The volume of the spherical particles is preferably 1 cm ³ or less. The smaller the granular material is, the larger the contact area between the granular material in the bag and the electric component is, so that the electric component is less likely to be damaged by contact with the support. The hardness of the granular material is preferably such that the substrate and electric parts are not damaged. In the present invention, as the granular material to be put in the bag, plastic foam particles such as polystyrene and polyurethane are preferable because they have an insulating property and are lightweight and soft.

As the bag for containing the gas, liquid, granular material, etc., a vinyl bag, a rubber bag, a leather bag, a cloth bag or the like is appropriately used. It is advisable to adjust the amount of gas, liquid, granules, etc. to be put in the bag so that the bag can be freely deformed. In the present invention, at least the surface of the deformable support is made of an electrically insulating material so as not to short-circuit the electric parts and the substrate.
The granular material or the like to be put in the bag is also preferably electrically insulating so that a short circuit does not occur even if the bag is torn and overflows. From the viewpoint of workability, it is preferable that the number of supports used is one per substrate, but two or more supports may be used. In the present invention, it is preferable that the deformable support is also located on the side surface of the electric component to suppress the lateral movement of the electric component, because lateral shake of the electric component can be prevented. When the deformable support is a bag containing a liquid material having a large heat capacity, the support preferably serves as a heat sink for electric parts.

[0007]

In the substrate supporting structure of the present invention, the electric component is attached to the lower surface of the substrate, and the lower side of the electric component is supported by the supporting body deformed corresponding to the position of the lower surface of the electric component. Is. Therefore, since the supporting body fits the height of the electric component, it is not necessary to form the supporting body into a shape corresponding to the height of each electric component. Further, even if the heights of the electric components are different, all the electric components can be supported by one or a small number of supports, and the assembling is easy.

[0008]

Embodiments of the present invention will be described in detail below with reference to FIGS. (Embodiment 1) FIG. 1 is a side view showing a first embodiment of the support structure of the present invention. Pillars 12 are erected at the four corners of the pedestal 11, and a substrate 13 is fixed to the tops of the pillars 12 with bolts 14. A plurality of electric components 15 to 17 having different shapes (heights) are electrically connected to the lower surface of the substrate 13. The pedestal
A rectangular unitary sponge 20 made of urethane foam is arranged between 11 and the substrate 13. This sponge 20
Are deformed corresponding to the positions of the respective lower surfaces by the force applied from the lower surfaces of the electric components 15 to 17. Moreover, each electric component 15
The sponge 20 penetrates into the gap between 17 and 17. The weight of each of the plurality of electric components 15 to 17 is supported in the state of being buried in the sponge 20, and the lateral movement thereof is also suppressed. Further, the sponge 20 partially contacts the substrate 13 and directly supports the substrate 13. As a result, the substrate 13
Is less likely to be bent by the weight of the electric components 15 to 17 and to be damaged due to the lateral shake of the electric components 15 to 17.

This support structure can be easily assembled by the following procedure. A thin plate (not shown) at both upper and lower ends of the sponge 20 having a predetermined shape
Then, it is squeezed in the vertical direction and inserted between the electric component 16 and the pedestal 11, and the four corners are positioned near the columns 12, respectively, and then the thin plate is removed. The sponge 20 swells to its original shape and is arranged entirely between the substrate 13 and the pedestal 11.

(Embodiment 2) FIG. 2 is a side view showing a second embodiment of the support structure of the present invention. Pillars 12 are erected at the four corners of the floor of the housing 30, and a board 13 is fixed to the tops of the pillars 12 with bolts 14. A plurality of electric components 15 to 17 having different shapes (heights) are electrically connected to the lower surface of the substrate 13. A vinyl bag 25 containing water 21 is arranged on the floor surface of the housing 30. The highest position of the vinyl bag 25 containing the water 21 is at the same position as the lower surface of the electric component 17 having the highest lower surface position. Electrical components whose lower surface is lower than that
The lower part of 15, 16 is surrounded by a plastic bag 25 containing water 21, which not only supports the weight but also prevents lateral shake.

This support structure is easily assembled by the following procedure A. In a case 30 in which pillars are set up at the four corners, a vinyl bag 25 containing water 21 is placed, and a board 13 electrically connected to the electric parts 15 to 17 is placed on the vinyl bag 25, and the four corners of the board 13 are set to Secure to the column 12 with bolts 14. The amount of water to be put in the vinyl bag can be calculated in advance from the volumes of the housing 30 and the electric parts 15 and 16. You may leave air in the plastic bag.
The water in the plastic bag also acts as a heat sink that absorbs the heat generated by the electric components 15 to 17. The reason why the housing 30 is used here is to prevent the vinyl bag from jumping out from under the substrate even when water moves inside the vinyl bag.

This support structure can be more easily assembled according to the following procedure B. In the case 30 with pillars standing in the four corners,
Place an empty plastic bag and on top of this, electrical parts 15-17
A substrate 13 electrically connected to is placed, the four corners of the substrate 13 are fixed to the columns 12 with bolts 14, and water is injected from the injection port 24 of the empty vinyl bag. According to this procedure B, it is not necessary to calculate the amount of water put in the vinyl bag. Even if air is put in the plastic bag, the same supporting effect as when water is put is obtained, and at the same time, the weight can be reduced.

(Embodiment 3) FIG. 3 is a side view showing a third embodiment of the support structure of the present invention. In this support structure, a vinyl bag 25 in which fine spherical styrene foam particles 22 are put in a support is used. There is a hole in the center of the pedestal 11.
33 is opened, and the inlet 24 is arranged here.
Other than this, the support structure is the same as that of the first embodiment. The plastic bag 25 containing the expanded styrene particles 22 is an electric component 15-17.
It is also located on the side of, and not only supports the weight of the electric parts 15-17, but also prevents lateral shake of the electric parts 15-17.

To assemble this support structure, as in the procedure B of the second embodiment, the substrate 13 is fixed to the column 12 with the bolts 14, and then an empty vinyl bag is placed on the pedestal 11, and this vinyl bag is used. It can be easily assembled by pneumatically feeding the polystyrene particles from the injection port 24. If a vent hole for air is opened on the side of the plastic bag facing the inlet 24, the polystyrene particles can be quickly pressure-fed. Also in this example,
Since the injection port 24 is provided on the pedestal 11 side, when the polystyrene particles are filled as described above, it is possible to easily form a support body that is deformed corresponding to the position of the lower surface of the electric component.

(Embodiment 4) FIG. 4 is a side view showing a fourth embodiment of the support structure of the present invention. This support structure
The support structure is the same as in Example 1 except that a vinyl bag 25 containing a polyurethane foam 23 is used as the support.

To assemble this support structure, as shown in FIG. 5, an empty vinyl bag 25 is placed on the pedestal 11, and a predetermined amount of the urethane raw material liquid is injected from the injection port 24 of the vinyl bag 25 together with the foaming agent. Then, it can be easily performed by foaming in the bag 25. When a powder having good thermal conductivity (alumina, boron nitride, silicon carbide, etc.) is mixed in the urethane raw material liquid, it also functions as a heat sink for electric parts.

Each of the above-mentioned supports did not damage the electric parts and the board, had a high deformability, and conformed to the shape of the electric parts, and was able to favorably support the board for a long period of time.

[0018]

As described above, the substrate support structure of the present invention is such that the deformed support member is arranged corresponding to the position of the lower surface of the electric component, and it is easy to use an inexpensive support member. Since it can be assembled, it has a remarkable industrial effect.

[Brief description of drawings]

FIG. 1 is a side view illustrating a first embodiment of a support structure of the present invention.

FIG. 2 is a side view showing a second embodiment of the support structure of the present invention.

FIG. 3 is a side view showing a third embodiment of the support structure of the present invention.

FIG. 4 is a side view showing a fourth embodiment of the support structure of the present invention.

5 is an explanatory view of how to assemble the support structure shown in FIG.

FIG. 6 is a perspective view or a side view of a substrate on which electric components are mounted.

FIG. 7 is a side view illustrating a structure in which the electric component of the board on which the electric component is mounted is supported by a base.

[Explanation of symbols] 11 ─── Pedestal 12 ─── Pillar 13 ─── Substrate 14 ─── Bolts 15 to 17 ─ Electrical components 20 ─── Sponge 21 ─── Water 22 ─── Expanded styrene particles 23 ─ ── Polyurethane foam 24 ─── Filling port 25 ─── Vinyl bag 30 ─── Housing 31 ─── Thick conductor 32 ─── Base 33 ─── Hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeki Motomura 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd.

Claims (3)

[Claims] 1. An electric component, wherein an electric component is attached to a lower surface of a substrate, and a lower side of the electric component is supported by a support body deformed corresponding to a position of the lower surface of the electric component. Support structure for the mounted board. 2. The height of the support changes when an object is placed on the support.
A support structure for a substrate on which the described electric component is mounted. 3. The support structure for a substrate on which an electric component is mounted according to claim 1 or 2, wherein the support is a bag containing a filling material.