MY169089A - Wax coating member for mold - Google Patents

Wax coating member for mold

Info

Publication number
MY169089A
MY169089A MYPI2011003292A MYPI2011003292A MY169089A MY 169089 A MY169089 A MY 169089A MY PI2011003292 A MYPI2011003292 A MY PI2011003292A MY PI2011003292 A MYPI2011003292 A MY PI2011003292A MY 169089 A MY169089 A MY 169089A
Authority
MY
Malaysia
Prior art keywords
wax coating
mold
coating member
support part
lower molds
Prior art date
Application number
MYPI2011003292A
Inventor
Kyo An Lee
Original Assignee
Kyo An Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyo An Lee filed Critical Kyo An Lee
Priority to MYPI2011003292A priority Critical patent/MY169089A/en
Publication of MY169089A publication Critical patent/MY169089A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Disclosed are a wax coating member for a mold (1) and a wax coating method using same. The wax coating member includes a support part (3) formed between upper and lower molds (10,20) to be compressed between the upper and lower molds (10,20) and having a larger thickness than heights of cavities (30) formed on the upper and lower molds (10,20), and a wax member (5) provided to the support part (3) and coated on the cavities (30) when the support part (3) is compressed.
MYPI2011003292A 2009-02-13 2009-02-13 Wax coating member for mold MY169089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI2011003292A MY169089A (en) 2009-02-13 2009-02-13 Wax coating member for mold

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/KR2009/000708 WO2010093074A1 (en) 2009-02-13 2009-02-13 Wax application member for mold and method for applying wax using the same
MYPI2011003292A MY169089A (en) 2009-02-13 2009-02-13 Wax coating member for mold

Publications (1)

Publication Number Publication Date
MY169089A true MY169089A (en) 2019-02-18

Family

ID=42561909

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011003292A MY169089A (en) 2009-02-13 2009-02-13 Wax coating member for mold

Country Status (3)

Country Link
CN (1) CN102292406B (en)
MY (1) MY169089A (en)
WO (1) WO2010093074A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002225040A (en) * 2001-02-06 2002-08-14 Hitachi Ltd Sheet for cleaning mold and method for manufacturing semiconductor device using the same
JP4150231B2 (en) * 2002-08-29 2008-09-17 株式会社三井ハイテック Mold cleaning tool
JP4157495B2 (en) * 2004-05-24 2008-10-01 株式会社ルネサステクノロジ Semiconductor chip resin sealing method including molding die cleaning process
JP4373291B2 (en) * 2004-06-24 2009-11-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
KR100884733B1 (en) * 2007-07-31 2009-02-19 이교안 Coating method of epoxy release wax on chip package mold and thereby suitable coating seat

Also Published As

Publication number Publication date
CN102292406B (en) 2013-07-03
WO2010093074A1 (en) 2010-08-19
CN102292406A (en) 2011-12-21

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