MY161391A - Resin-coated metallic material with excellent planar-direction thermal conductivity - Google Patents

Resin-coated metallic material with excellent planar-direction thermal conductivity

Info

Publication number
MY161391A
MY161391A MYPI2011004110A MYPI2011004110A MY161391A MY 161391 A MY161391 A MY 161391A MY PI2011004110 A MYPI2011004110 A MY PI2011004110A MY PI2011004110 A MYPI2011004110 A MY PI2011004110A MY 161391 A MY161391 A MY 161391A
Authority
MY
Malaysia
Prior art keywords
thermally conductive
conductive particles
resin
metallic material
planar
Prior art date
Application number
MYPI2011004110A
Inventor
Takeshi Kojima
Yasuo Hirano
Tetsuya Igarashi
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of MY161391A publication Critical patent/MY161391A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/38—Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A RESIN-COATED METALLIC MATERIAL COMPRISING A METALLIC BASE, AT LEAST ONE SURFACE OF WHICH HAS BEEN COATED WITH A RESINOUS COATING FILM CONTAINING THERMALLY CONDUCTIVE PARTICLES. WHEN A PHOTOGRAPH OF A PLANAR-DIRECTION SECTION OF THE RESINOUS COATING FILM TAKEN WITH A SCANNING ELECTRON MICROSCOPE IS SUBJECTED TO IMAGE ANALYSIS, THE THERMALLY CONDUCTIVE PARTICLES OBSERVED IN THE FIELD OF VIEW SATISFY THE FOLLOWING REQUIREMENTS (1) TO (3). (1) THE THERMALLY CONDUCTIVE PARTICLES HAVE AN ASPECT RATIO, WHICH IS THE VALUE OBTAINED BY DIVIDING THE MAXIMUM LENGTH BY THE MINIMUM LENGTH OF THE PARTICLES (MAXIMUM LENGTH/MINIMUM LENGTH), OF 3.0 OR HIGHER ON AVERAGE, (2) WHEN THE THERMALLY CONDUCTIVE PARTICLES ARE EXAMINED FOR THE ANGLE OF INCLINATION OF THE LONGEST AXIS WITH THE PLANAR-DIRECTION HORIZONTAL LINE, THE FREQUENCY OF THERMALLY CONDUCTIVE PARTICLES HAVING AN ANGLE OF INCLINATION OF 0° OR LARGER BUT LESS THAN 30° IS 40% OR HIGHER, AND (3) THE AREAL PROPORTION OF THE THERMALLY CONDUCTIVE PARTICLES IS 30% OR HIGHER.
MYPI2011004110A 2009-03-04 2010-03-03 Resin-coated metallic material with excellent planar-direction thermal conductivity MY161391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009051133 2009-03-04

Publications (1)

Publication Number Publication Date
MY161391A true MY161391A (en) 2017-04-14

Family

ID=42709743

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011004110A MY161391A (en) 2009-03-04 2010-03-03 Resin-coated metallic material with excellent planar-direction thermal conductivity

Country Status (6)

Country Link
JP (1) JP5337742B2 (en)
KR (1) KR101316981B1 (en)
CN (1) CN102333646B (en)
MY (1) MY161391A (en)
TW (1) TWI430881B (en)
WO (1) WO2010101188A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3096351B1 (en) * 2015-05-22 2017-12-13 ABB Technology Oy Thermal interface foil
KR102406261B1 (en) * 2017-05-15 2022-06-10 주식회사 아모그린텍 Graphite-polymer composite material
KR102383953B1 (en) * 2017-05-15 2022-04-07 주식회사 아모그린텍 Graphite-polymer composite material
US11492528B2 (en) * 2017-06-23 2022-11-08 Sekisui Chemical Co., Ltd. Heat dissipation sheet, method for producing heat dissipation sheet, and laminate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2759620B2 (en) * 1995-01-31 1998-05-28 株式会社神戸製鋼所 Resin-coated metal plate and method of manufacturing the same
JPH1044330A (en) * 1996-08-06 1998-02-17 Toppan Printing Co Ltd Decorative material and its manufacture
JP2001261974A (en) * 2000-03-13 2001-09-26 Hitachi Chem Co Ltd Paste composition
JP3864705B2 (en) 2001-01-31 2007-01-10 住友金属工業株式会社 Thermal radiation surface treatment material
JP2003198173A (en) * 2001-12-27 2003-07-11 Nec Tokin Corp Electromagnetic wave shielding sheet which functions as thermal radiator and electromagnetic wave suppressing sheet which functions as thermal radiator
JP4167048B2 (en) * 2002-12-10 2008-10-15 愛三工業株式会社 Thermally conductive coating and method for forming the same
JP4288188B2 (en) * 2004-01-19 2009-07-01 新日本製鐵株式会社 Surface-treated metal material with excellent heat absorption and dissipation characteristics
EP1598406B1 (en) * 2004-05-18 2013-08-07 SGL Carbon SE Latent heat storage material
JP4907485B2 (en) * 2007-04-24 2012-03-28 新日本製鐵株式会社 Surface-treated metal, method for producing the same, and surface-treated liquid
JP2008303263A (en) * 2007-06-06 2008-12-18 Teijin Ltd Thermally conductive coating material

Also Published As

Publication number Publication date
JP2010228449A (en) 2010-10-14
CN102333646B (en) 2014-07-02
CN102333646A (en) 2012-01-25
WO2010101188A1 (en) 2010-09-10
KR101316981B1 (en) 2013-10-11
TWI430881B (en) 2014-03-21
TW201043456A (en) 2010-12-16
JP5337742B2 (en) 2013-11-06
KR20110111526A (en) 2011-10-11

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