MY161391A - Resin-coated metallic material with excellent planar-direction thermal conductivity - Google Patents
Resin-coated metallic material with excellent planar-direction thermal conductivityInfo
- Publication number
- MY161391A MY161391A MYPI2011004110A MYPI2011004110A MY161391A MY 161391 A MY161391 A MY 161391A MY PI2011004110 A MYPI2011004110 A MY PI2011004110A MY PI2011004110 A MYPI2011004110 A MY PI2011004110A MY 161391 A MY161391 A MY 161391A
- Authority
- MY
- Malaysia
- Prior art keywords
- thermally conductive
- conductive particles
- resin
- metallic material
- planar
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/38—Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A RESIN-COATED METALLIC MATERIAL COMPRISING A METALLIC BASE, AT LEAST ONE SURFACE OF WHICH HAS BEEN COATED WITH A RESINOUS COATING FILM CONTAINING THERMALLY CONDUCTIVE PARTICLES. WHEN A PHOTOGRAPH OF A PLANAR-DIRECTION SECTION OF THE RESINOUS COATING FILM TAKEN WITH A SCANNING ELECTRON MICROSCOPE IS SUBJECTED TO IMAGE ANALYSIS, THE THERMALLY CONDUCTIVE PARTICLES OBSERVED IN THE FIELD OF VIEW SATISFY THE FOLLOWING REQUIREMENTS (1) TO (3). (1) THE THERMALLY CONDUCTIVE PARTICLES HAVE AN ASPECT RATIO, WHICH IS THE VALUE OBTAINED BY DIVIDING THE MAXIMUM LENGTH BY THE MINIMUM LENGTH OF THE PARTICLES (MAXIMUM LENGTH/MINIMUM LENGTH), OF 3.0 OR HIGHER ON AVERAGE, (2) WHEN THE THERMALLY CONDUCTIVE PARTICLES ARE EXAMINED FOR THE ANGLE OF INCLINATION OF THE LONGEST AXIS WITH THE PLANAR-DIRECTION HORIZONTAL LINE, THE FREQUENCY OF THERMALLY CONDUCTIVE PARTICLES HAVING AN ANGLE OF INCLINATION OF 0° OR LARGER BUT LESS THAN 30° IS 40% OR HIGHER, AND (3) THE AREAL PROPORTION OF THE THERMALLY CONDUCTIVE PARTICLES IS 30% OR HIGHER.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009051133 | 2009-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY161391A true MY161391A (en) | 2017-04-14 |
Family
ID=42709743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2011004110A MY161391A (en) | 2009-03-04 | 2010-03-03 | Resin-coated metallic material with excellent planar-direction thermal conductivity |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5337742B2 (en) |
KR (1) | KR101316981B1 (en) |
CN (1) | CN102333646B (en) |
MY (1) | MY161391A (en) |
TW (1) | TWI430881B (en) |
WO (1) | WO2010101188A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3096351B1 (en) * | 2015-05-22 | 2017-12-13 | ABB Technology Oy | Thermal interface foil |
KR102406261B1 (en) * | 2017-05-15 | 2022-06-10 | 주식회사 아모그린텍 | Graphite-polymer composite material |
KR102383953B1 (en) * | 2017-05-15 | 2022-04-07 | 주식회사 아모그린텍 | Graphite-polymer composite material |
US11492528B2 (en) * | 2017-06-23 | 2022-11-08 | Sekisui Chemical Co., Ltd. | Heat dissipation sheet, method for producing heat dissipation sheet, and laminate |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2759620B2 (en) * | 1995-01-31 | 1998-05-28 | 株式会社神戸製鋼所 | Resin-coated metal plate and method of manufacturing the same |
JPH1044330A (en) * | 1996-08-06 | 1998-02-17 | Toppan Printing Co Ltd | Decorative material and its manufacture |
JP2001261974A (en) * | 2000-03-13 | 2001-09-26 | Hitachi Chem Co Ltd | Paste composition |
JP3864705B2 (en) | 2001-01-31 | 2007-01-10 | 住友金属工業株式会社 | Thermal radiation surface treatment material |
JP2003198173A (en) * | 2001-12-27 | 2003-07-11 | Nec Tokin Corp | Electromagnetic wave shielding sheet which functions as thermal radiator and electromagnetic wave suppressing sheet which functions as thermal radiator |
JP4167048B2 (en) * | 2002-12-10 | 2008-10-15 | 愛三工業株式会社 | Thermally conductive coating and method for forming the same |
JP4288188B2 (en) * | 2004-01-19 | 2009-07-01 | 新日本製鐵株式会社 | Surface-treated metal material with excellent heat absorption and dissipation characteristics |
EP1598406B1 (en) * | 2004-05-18 | 2013-08-07 | SGL Carbon SE | Latent heat storage material |
JP4907485B2 (en) * | 2007-04-24 | 2012-03-28 | 新日本製鐵株式会社 | Surface-treated metal, method for producing the same, and surface-treated liquid |
JP2008303263A (en) * | 2007-06-06 | 2008-12-18 | Teijin Ltd | Thermally conductive coating material |
-
2010
- 2010-03-03 KR KR1020117020364A patent/KR101316981B1/en active IP Right Grant
- 2010-03-03 CN CN201080009307.8A patent/CN102333646B/en not_active Expired - Fee Related
- 2010-03-03 JP JP2010046482A patent/JP5337742B2/en not_active Expired - Fee Related
- 2010-03-03 WO PCT/JP2010/053449 patent/WO2010101188A1/en active Application Filing
- 2010-03-03 MY MYPI2011004110A patent/MY161391A/en unknown
- 2010-03-04 TW TW099106332A patent/TWI430881B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2010228449A (en) | 2010-10-14 |
CN102333646B (en) | 2014-07-02 |
CN102333646A (en) | 2012-01-25 |
WO2010101188A1 (en) | 2010-09-10 |
KR101316981B1 (en) | 2013-10-11 |
TWI430881B (en) | 2014-03-21 |
TW201043456A (en) | 2010-12-16 |
JP5337742B2 (en) | 2013-11-06 |
KR20110111526A (en) | 2011-10-11 |
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