MY155363A - Method and jig assembly for manufacturing outer blade cutting wheel - Google Patents
Method and jig assembly for manufacturing outer blade cutting wheelInfo
- Publication number
- MY155363A MY155363A MYPI2010001872A MYPI2010001872A MY155363A MY 155363 A MY155363 A MY 155363A MY PI2010001872 A MYPI2010001872 A MY PI2010001872A MY PI2010001872 A MYPI2010001872 A MY PI2010001872A MY 155363 A MY155363 A MY 155363A
- Authority
- MY
- Malaysia
- Prior art keywords
- base
- cutting wheel
- outer periphery
- blade cutting
- grains
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/028—Circular saw blades of special material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/002—Magnetic work holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1673—Magnetic field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1896—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by electrochemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
Abstract
AN OUTER BLADE CUTTING WHEEL COMPRISING AN ANNULAR THIN DISC BASE OF CEMENTED CARBIDE AND A BLADE SECTION (20) IS MANUFACTURED BY DISPOSING PERMANENT MAGNET PIECES (54) ON THE SIDE SURFACES AND INWARD OF THE OUTER PERIPHERY OF THE BASE (10) TO PRODUCE A MAGNETIC FIELD, PROVIDING MAGNETIC COATED DIAMOND AND/OR CBN ABRASIVE GRAINS SUCH THAT THE MAGNETIC FIELD MAY ACT ON THE GRAINS, CAUSING THE GRAINS TO BE MAGNETICALLY ATTRACTED TO THE BASE OUTER PERIPHERY, AND ELECTROPLATING OR ELECTROLESS PLATING WHEREBY THE ABRASIVE GRAINS ARE BOUND TO THE BASE OUTER PERIPHERY TO FORM THE BLADE SECTION.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009111762A JP5051399B2 (en) | 2009-05-01 | 2009-05-01 | Peripheral cutting blade manufacturing method and outer peripheral cutting blade manufacturing jig |
Publications (1)
Publication Number | Publication Date |
---|---|
MY155363A true MY155363A (en) | 2015-10-15 |
Family
ID=42352729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010001872A MY155363A (en) | 2009-05-01 | 2010-04-26 | Method and jig assembly for manufacturing outer blade cutting wheel |
Country Status (8)
Country | Link |
---|---|
US (2) | US8753412B2 (en) |
EP (1) | EP2260963B1 (en) |
JP (1) | JP5051399B2 (en) |
KR (1) | KR101641387B1 (en) |
CN (1) | CN101905447B (en) |
MY (1) | MY155363A (en) |
SG (1) | SG166086A1 (en) |
TW (1) | TWI503213B (en) |
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US10380602B2 (en) * | 2005-12-24 | 2019-08-13 | Rich Media Club, Llc | System and method for creation, distribution and tracking of advertising via electronic networks |
MY155758A (en) * | 2010-01-06 | 2015-11-30 | Shinetsu Chemical Co | Rare earth magnet holding jig and cutting machine |
MY157471A (en) * | 2010-01-06 | 2016-06-15 | Shinetsu Chemical Co | Rare earth magnet holding jig, cutting machine and cutting method |
JP2012056012A (en) * | 2010-09-08 | 2012-03-22 | Disco Corp | Cutting grinding wheel |
JP5776514B2 (en) * | 2010-11-29 | 2015-09-09 | 信越化学工業株式会社 | Cemented carbide base plate cutting blade |
SG190924A1 (en) * | 2010-11-29 | 2013-07-31 | Shinetsu Chemical Co | Super hard alloy baseplate outer circumference cutting blade and manufacturing method thereof |
SG190724A1 (en) * | 2010-11-29 | 2013-07-31 | Shinetsu Chemical Co | Super hard alloy baseplate outer circumference cutting blade and manufacturing method thereof |
JP5776515B2 (en) * | 2010-11-29 | 2015-09-09 | 信越化学工業株式会社 | Cemented carbide base plate outer cutting blade manufacturing method |
JP2012131015A (en) * | 2010-11-29 | 2012-07-12 | Shin-Etsu Chemical Co Ltd | Super hard alloy baseplate outer circumference cutting blade |
JP2012131018A (en) * | 2010-11-29 | 2012-07-12 | Shin-Etsu Chemical Co Ltd | Method of manufacturing super hard alloy baseplate outer circumference cutting blade |
JP5630389B2 (en) | 2011-07-04 | 2014-11-26 | 信越化学工業株式会社 | Cemented carbide base plate outer peripheral cutting blade and manufacturing method thereof |
JP5853946B2 (en) * | 2012-01-06 | 2016-02-09 | 信越化学工業株式会社 | Manufacturing method of outer peripheral cutting blade |
US9089946B1 (en) | 2012-02-14 | 2015-07-28 | Jeff Toycen | Low speed high feed grinder |
FR2988628B1 (en) | 2012-04-02 | 2015-02-27 | Commissariat Energie Atomique | METHOD AND APPARATUS FOR MANUFACTURING A CUTTING WIRE |
CN102700014B (en) * | 2012-06-11 | 2015-10-21 | 上海精研磨料磨具有限公司 | Diadust titanizing, nickel phosphorus and nickel complex diamond fretsaw and preparation method |
CN102773806A (en) * | 2012-07-19 | 2012-11-14 | 姜堰市吉祥磨料厂 | Double-molding density resin cutting sheet |
CN106087005A (en) * | 2013-05-09 | 2016-11-09 | 吴红平 | The method of work of diamond wire process units |
CN105926024B (en) * | 2013-05-09 | 2017-12-12 | 连云港市荣泰碳化硅有限公司 | The method for producing diamond wire |
CN106011979A (en) * | 2013-05-09 | 2016-10-12 | 吴红平 | Production device for forming diamond line of axis rotating magnetic field |
CN105821466B (en) * | 2013-05-09 | 2017-12-05 | 东海县太阳光新能源有限公司 | A kind of process units for the diamond wire for being suitable to generation axle rotating excitation field |
US20150004890A1 (en) * | 2013-06-28 | 2015-01-01 | Saint-Gobain Ceramics & Plastics, Inc. | Nickel coated diamond particles and method of making said particles |
CN103668403B (en) * | 2013-12-23 | 2016-08-17 | 黄河水利职业技术学院 | A kind of medical manufacture method cutting bottle diamond tool |
JP5880652B2 (en) * | 2014-09-29 | 2016-03-09 | 信越化学工業株式会社 | Cemented carbide base plate outer peripheral cutting blade and manufacturing method thereof |
GB2540385B (en) * | 2015-07-15 | 2017-10-11 | C4 Carbides Ltd | Improvements in or relating to tool blades and their manufacture |
CN105506718B (en) * | 2016-01-10 | 2018-02-27 | 盛利维尔(中国)新材料技术股份有限公司 | A kind of abrasive particle patterned configuration electroplating diamond wire saw production technology and abrasive particle patterning magnetizing assembly |
CN106042200B (en) * | 2016-07-21 | 2018-07-06 | 中国有色桂林矿产地质研究院有限公司 | Inner diamond slicing blade and preparation method thereof |
CN106346190A (en) * | 2016-11-03 | 2017-01-25 | 福建福晶科技股份有限公司 | Method for trimming planeness of diamond cutting blade |
JP6665775B2 (en) * | 2016-12-28 | 2020-03-13 | 信越化学工業株式会社 | Jig for fixing rare earth sintered magnet |
CN107088844B (en) * | 2017-04-21 | 2019-04-19 | 郑州磨料磨具磨削研究所有限公司 | A kind of sand device and method of electroplating abrasion wheel |
JP6844430B2 (en) * | 2017-06-09 | 2021-03-17 | 信越化学工業株式会社 | Peripheral cutting blade and its manufacturing method |
CN110466074B (en) * | 2018-05-11 | 2021-04-16 | 福建省泷澄建设集团有限公司 | Concrete beam body construction operation equipment |
CN109518257A (en) * | 2018-12-24 | 2019-03-26 | 重庆新腾源环保科技有限公司 | A kind of Carborundum wheel plant sand nickel plating clamping tooling |
CN109623676B (en) * | 2018-12-30 | 2020-08-25 | 苏州赛尔科技有限公司 | Hub type diamond ultrathin cutting blade for PCB and application thereof |
CN110640811A (en) * | 2019-09-24 | 2020-01-03 | 李小成 | Pipe cutting blade for pipe cutting machine |
CN111690975B (en) * | 2020-04-10 | 2021-07-16 | 河南平高电气股份有限公司 | Electroplating tool for adjusting nut |
CN114290535A (en) * | 2022-01-06 | 2022-04-08 | 江西坚德实业有限公司 | Preparation method of diamond wire saw bead |
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MY151755A (en) * | 2007-12-28 | 2014-06-30 | Shinetsu Chemical Co | Outer blade cutting wheel and making method |
-
2009
- 2009-05-01 JP JP2009111762A patent/JP5051399B2/en active Active
-
2010
- 2010-04-26 MY MYPI2010001872A patent/MY155363A/en unknown
- 2010-04-28 SG SG201002972-6A patent/SG166086A1/en unknown
- 2010-04-29 CN CN201010241662.XA patent/CN101905447B/en active Active
- 2010-04-29 US US12/770,263 patent/US8753412B2/en active Active
- 2010-04-30 KR KR1020100040930A patent/KR101641387B1/en active IP Right Grant
- 2010-04-30 TW TW099113893A patent/TWI503213B/en active
- 2010-05-04 EP EP20100250867 patent/EP2260963B1/en active Active
-
2012
- 2012-09-14 US US13/617,855 patent/US9156098B2/en active Active
Also Published As
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KR101641387B1 (en) | 2016-07-20 |
JP2010260124A (en) | 2010-11-18 |
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TWI503213B (en) | 2015-10-11 |
CN101905447B (en) | 2015-08-26 |
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JP5051399B2 (en) | 2012-10-17 |
EP2260963B1 (en) | 2013-09-04 |
US9156098B2 (en) | 2015-10-13 |
US20130009353A1 (en) | 2013-01-10 |
TW201105474A (en) | 2011-02-16 |
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US8753412B2 (en) | 2014-06-17 |
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