MY154924A - Cleaning process and apparatus - Google Patents

Cleaning process and apparatus

Info

Publication number
MY154924A
MY154924A MYPI20094436A MYPI20094436A MY154924A MY 154924 A MY154924 A MY 154924A MY PI20094436 A MYPI20094436 A MY PI20094436A MY PI20094436 A MYPI20094436 A MY PI20094436A MY 154924 A MY154924 A MY 154924A
Authority
MY
Malaysia
Prior art keywords
support
article
cleaning process
acoustic wave
cleaning
Prior art date
Application number
MYPI20094436A
Inventor
Yeo Hock Huat
Original Assignee
Jcs Echigo Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200702957-2A external-priority patent/SG147336A1/en
Application filed by Jcs Echigo Pte Ltd filed Critical Jcs Echigo Pte Ltd
Publication of MY154924A publication Critical patent/MY154924A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A METHOD FOR CLEANING AN ARTICLE (110) HELD BY SUPPORT, THE METHOD COMPRISING THE STEPS OF APPLYING AN ACOUSTIC WAVE TO SAID ARTICLE AND SUPPORT, ROTATING SAID ARTICLE AND SUPPORT SUCH THAT AN AREA ON THE ARTICLE PREVIOUSLY MASKED BY THE SUPPORT IS EXPOSED TO SAID ACOUSTIC WAVE.
MYPI20094436A 2007-04-27 2008-04-22 Cleaning process and apparatus MY154924A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200702957-2A SG147336A1 (en) 2007-04-27 2007-04-27 Cleaning process and apparatus
SG200719147-1A SG147361A1 (en) 2007-04-27 2007-12-24 Cleaning process and apparatus

Publications (1)

Publication Number Publication Date
MY154924A true MY154924A (en) 2015-08-28

Family

ID=54150105

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20094436A MY154924A (en) 2007-04-27 2008-04-22 Cleaning process and apparatus

Country Status (2)

Country Link
MY (1) MY154924A (en)
WO (1) WO2008133593A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150343498A1 (en) * 2013-02-14 2015-12-03 Acden Technologies Ltd. A method and apparatus for cleaning a workpiece using ultrasonics

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB944988A (en) * 1960-09-30 1963-12-18 A E W Ltd Improvements relating to heat-treatment and drying apparatus
US4601223A (en) * 1984-07-16 1986-07-22 Westinghouse Electric Corp. Flail tube cutter
JPH0521413A (en) * 1991-07-10 1993-01-29 Matsushita Electric Ind Co Ltd Semiconductor substrate cleaner and semiconductor substrate cleaning method
US5937469A (en) * 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
SG63810A1 (en) * 1997-02-21 1999-03-30 Canon Kk Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
EP1726035A1 (en) * 2004-02-27 2006-11-29 SCP U.S., Inc. Apparatus and method for drying substrates
US7841035B2 (en) * 2005-10-13 2010-11-30 Hitachi High-Technologies Corporation Disc cleaning machinery, disc cleaning device thereof and rotary brush thereof

Also Published As

Publication number Publication date
WO2008133593A3 (en) 2009-11-19
WO2008133593A2 (en) 2008-11-06

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