MY146632A - Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein - Google Patents

Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein

Info

Publication number
MY146632A
MY146632A MYPI20032610A MYPI20032610A MY146632A MY 146632 A MY146632 A MY 146632A MY PI20032610 A MYPI20032610 A MY PI20032610A MY PI20032610 A MYPI20032610 A MY PI20032610A MY 146632 A MY146632 A MY 146632A
Authority
MY
Malaysia
Prior art keywords
resin layer
aluminum sheet
resin film
adhered
casing
Prior art date
Application number
MYPI20032610A
Inventor
Lee Nam Ki
Original Assignee
Alpet Co Ltd
Lee Nam Ki
Kim Yong Rae
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpet Co Ltd, Lee Nam Ki, Kim Yong Rae filed Critical Alpet Co Ltd
Priority to MYPI20032610A priority Critical patent/MY146632A/en
Publication of MY146632A publication Critical patent/MY146632A/en

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Abstract

A TWO-LAYERED POLYESTER RESIN FILM CONSISTING OF FIRST AND SECOND LAYERS (4 AND 6) IS ADHERED TO AT LEAST ONE SURFACE OF AN ALUMINUM SHEET (2) HEATED ABOVE THE MELTING POINT OF THE FIRST RESIN LAYER (4) IN SUCH A MANNER THAT THE FIRST RESIN LAYER (4) FACES THE ALUMINUM SHEET (2). THIS PRODUCES A TWO-LAYERED POLYESTER FILM-ADHERED ALUMINUM SHEET (10). THE FIRST RESIN LAYER (4) IS MADE FROM COPOLYMERIZED POLYESTER HAVING A MELTING POINT LOWER THAN 250°C AND CONTAINING DIMETHYL TEREPHTHALATE AND DIMETHYL ISOPHTHALATE, AS MAIN REPEATING UNITS, AND THE SECOND RESIN LAYER (6) IS MADE FROM COPOLYMERIZED POLYESTER HAVING A MELTING POINT HIGHER THAN 250°C AND CONTAINING POLYETHYLENE TEREPHTHALATE AS MAIN REPEATING UNIT. THE RESIN FILM-ADHERED ALUMINUM SHEET (10) IS DRAWN INTO A CUP-SHAPED CASING (100D) IN SUCH A MANNER THAT THE SECOND RESIN LAYER (6) BECOMES THE OUTER SURFACE OF THE CUP-SHAPED CASING (100D). THE DRAWN CASING HEAT-TREATED IN THE TEMPERATURE RANGE FROM THE INITIAL ADHESION TEMPERATURE OF THE FIRST RESIN LAYER (4) TO THE INITIAL MELTING TEMPERATURE OF THE SECOND RESIN LAYER (6). BY THIS HEAT TREATMENT, THE INTERFACIAL BONDING FORCE BETWEEN THE ALUMINUM SHEET (2) AND THE RESIN FILM IS ENHANCED. A CONDENSER DEVICE (300) IS MOUNTED IN THE HEAT-TREATED CASING, AND THE RESULTING STRUCTURE IS SUBJECTED TO ASSEMBLY PROCESSES, SUCH AS BEADING AND CURLING TO PRODUCE A CHIP CONDENSER.
MYPI20032610A 2003-07-11 2003-07-11 Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein MY146632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20032610A MY146632A (en) 2003-07-11 2003-07-11 Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20032610A MY146632A (en) 2003-07-11 2003-07-11 Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein

Publications (1)

Publication Number Publication Date
MY146632A true MY146632A (en) 2012-09-14

Family

ID=48041010

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20032610A MY146632A (en) 2003-07-11 2003-07-11 Two-layered resin film-adhered aluminum casing for electronic components, producing method thereof, and electronic component mounted therein

Country Status (1)

Country Link
MY (1) MY146632A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021050057A1 (en) * 2019-09-11 2021-03-18 Hewlett-Packard Development Company, L.P. Casings for electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021050057A1 (en) * 2019-09-11 2021-03-18 Hewlett-Packard Development Company, L.P. Casings for electronic devices

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