MY145635A - Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil - Google Patents

Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

Info

Publication number
MY145635A
MY145635A MYPI20063958A MYPI20063958A MY145635A MY 145635 A MY145635 A MY 145635A MY PI20063958 A MYPI20063958 A MY PI20063958A MY PI20063958 A MYPI20063958 A MY PI20063958A MY 145635 A MY145635 A MY 145635A
Authority
MY
Malaysia
Prior art keywords
copper foil
electrodeposited copper
treated
electrodeposited
manufacturing
Prior art date
Application number
MYPI20063958A
Inventor
Matsuda Mitsuyoshi
Sakai Hisao
Tomonaga Sakiko
Dobashi Makoto
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Priority to MYPI20063958A priority Critical patent/MY145635A/en
Publication of MY145635A publication Critical patent/MY145635A/en

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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

IT IS AN OBJECT OF THE PRESENT INVENTION TO PROVIDE AN ELECTRODEPOSITED COPPER FOIL WHICH HAS A LOWER PROFILE AND A HIGHER GLOSSINESS THAN LOW-PROFILE ELECTRODEPOSITED COPPER FOIL CONVENTIONALLY SUPPLIED IN MARKETS. FOR ACHIEVING THIS OBJECT, THE PRESENT INVENTION EMPLOYS AN ELECTRODEPOSITED COPPER FOIL WHICH HAS A SUPER LOW PROFILE, THE SURFACE ROUGHNESS (RZJIS) OF THE DEPOSIT SURFACE OF LESS THAN 1.0 µM, AND THE GLOSSINESS [GS (60°)] THEREOF OF NOT LESS THAN 400 IRRESPECTIVE TO ITS THICKNESS. THE PRESENT INVENTION ALSO PROVIDES A MANUFACTURING METHOD OF AN ELECTRODEPOSITED COPPER FOIL OBTAINED BY ELECTROLYZING USING A SULFURIC ACID BASE COPPER ELECTROLYTIC SOLUTION OBTAINED BY ADDING 3-MERCAPTO-1-PROPANESULFONIC ACID AND/OR BIS(3-SULFOPROPYL) DISULFIDE, A QUATERNARY AMMONIUM SALT POLYMER HAVING A CYCLIC STRUCTURE, AND CHLORINE.
MYPI20063958A 2006-08-16 2006-08-16 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil MY145635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20063958A MY145635A (en) 2006-08-16 2006-08-16 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20063958A MY145635A (en) 2006-08-16 2006-08-16 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

Publications (1)

Publication Number Publication Date
MY145635A true MY145635A (en) 2012-03-15

Family

ID=48040491

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20063958A MY145635A (en) 2006-08-16 2006-08-16 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

Country Status (1)

Country Link
MY (1) MY145635A (en)

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