MY143560A - Deposition and separation apparatus for excess copper in lead-free solder - Google Patents

Deposition and separation apparatus for excess copper in lead-free solder

Info

Publication number
MY143560A
MY143560A MYPI20092362A MY143560A MY 143560 A MY143560 A MY 143560A MY PI20092362 A MYPI20092362 A MY PI20092362A MY 143560 A MY143560 A MY 143560A
Authority
MY
Malaysia
Prior art keywords
lead
molten
solder
excess copper
molten solder
Prior art date
Application number
Inventor
Nishimura Tetsuro
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Priority to MYPI20092362 priority Critical patent/MY143560A/en
Publication of MY143560A publication Critical patent/MY143560A/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Manufacture And Refinement Of Metals (AREA)

Abstract

AN APPARATUS FOR DEPOSITING AND SEPARATING EXCESS COPPER DISSOLVED IN MOLTEN LEAD-FREE SOLDER CONTAINING TIN AS THE MAIN ELEMENT IS PROVIDED. AN APPARATUS 1 DEPOSITS EXCESS COPPER IN THE MOLTEN LEAD-FREE SOLDER AS AN INTERMETALLIC COMPOUND AND SEPARATES IT FROM THE MOLTEN SOLDER. THE APPARATUS INCLUDES A DEPOSITION BATH 2 FOR CAUSING AN INTERMETALLIC COMPOUND IN THE MOLTEN SOLDER, A METAL ADDED FROM THE OUTSIDE AND COPPER IN THE MOLTEN SOLDER TO BE DEPOSITED, A GRANULATION BATH 4 INCLUDING PLATES 31 32 AND 33 FOR ALLOWING THE MOLTEN SOLDER TO PASS THROUGH THE PLATES TO MERGE THE INTERMETALLIC COMPOUNDS INTO PARTICLES HAVING A LARGER DIAMETER, AND A SEPARATION BATH 5 FOR CAUSING THE ENLARGED INTERMETALLIC COMPOUNDS TO PRECIPITATE AND SEPARATE IN THE MOLTEN SOLDER.
MYPI20092362 2006-12-14 2006-12-14 Deposition and separation apparatus for excess copper in lead-free solder MY143560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20092362 MY143560A (en) 2006-12-14 2006-12-14 Deposition and separation apparatus for excess copper in lead-free solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20092362 MY143560A (en) 2006-12-14 2006-12-14 Deposition and separation apparatus for excess copper in lead-free solder

Publications (1)

Publication Number Publication Date
MY143560A true MY143560A (en) 2011-05-31

Family

ID=45020823

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20092362 MY143560A (en) 2006-12-14 2006-12-14 Deposition and separation apparatus for excess copper in lead-free solder

Country Status (1)

Country Link
MY (1) MY143560A (en)

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