MY142532A - Procedure for the manufacture of track patterns - Google Patents

Procedure for the manufacture of track patterns

Info

Publication number
MY142532A
MY142532A MYPI20020228A MY142532A MY 142532 A MY142532 A MY 142532A MY PI20020228 A MYPI20020228 A MY PI20020228A MY 142532 A MY142532 A MY 142532A
Authority
MY
Malaysia
Prior art keywords
punching
manufacture
procedure
pattern
track patterns
Prior art date
Application number
Inventor
Alfred Bauer
Horst Hartmann
Guenter Kolodzei
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of MY142532A publication Critical patent/MY142532A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Abstract

THE PRESENT INVENTION RELATES TO A PROCEDURE FOR THE MANUFACTURE OF TRACK PATTERNS IN AN ELONGATED MATERIAL TAPE (I A, I B, 6A, 6B) WITH THE INDIVIDUAL TRACK PATTERNS BEING FORMED FROM A FIRST PUNCHING PATTERN (2, 7) AND A SECOND PUNCHING PATTERN, IN WHICH THE FIRST PUNCHING PATTERN (2, 7) IS GENERATED THROUGH AT LEAST ONE PUNCHING STEP AT AT LEAST ONE FIRST PUNCHING STATION AND THE SECOND PUNCHING PATTERN (3, 5, 8, 10) IS GENERATED AT AT LEAST ONE ADDITIONAL PUNCHING STEP AT LEAST ONE ADDITIONAL PUNCHING STATION. THE PROBLEM IS TO PROVIDE A PUNCHING PROCEDURE FOR MANUFACTURE OF TRACK PATTERNS AND/OR PUNCHING PATTERNS. THIS PROBLEM IS SOLVED BY DESIGNING THE FIRST PUNCHING PATTERN (2, 7) AND THE SECOND PUNCHING PATTERN (3, 5, 8, 10) TO BE PARTIALLY OVERLAPPING.
MYPI20020228 2001-01-24 2002-01-21 Procedure for the manufacture of track patterns MY142532A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2001103193 DE10103193B4 (en) 2001-01-24 2001-01-24 Method for producing printed conductor structures

Publications (1)

Publication Number Publication Date
MY142532A true MY142532A (en) 2010-12-15

Family

ID=7671638

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020228 MY142532A (en) 2001-01-24 2002-01-21 Procedure for the manufacture of track patterns

Country Status (7)

Country Link
EP (1) EP1227709A3 (en)
JP (1) JP2002321190A (en)
CN (1) CN1289225C (en)
DE (1) DE10103193B4 (en)
MY (1) MY142532A (en)
SG (1) SG120863A1 (en)
TW (1) TW521549B (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3059320A (en) * 1958-06-23 1962-10-23 Ibm Method of making electrical circuit
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
DE1226182B (en) 1960-11-10 1966-10-06 Siemens Ag Process for the production of so-called printed circuits with conductor lines made of metal foil
DE3108490A1 (en) * 1981-03-06 1982-10-21 Robert Bosch Gmbh, 7000 Stuttgart METHOD AND PUNCHING TOOL FOR WASTE-FREE PUNCHING OF PACKING STRIPS AND CORRECTLY PRODUCED PACKING STRIPS
US4555291A (en) * 1981-04-23 1985-11-26 Minnesota Mining And Manufacturing Company Method of constructing an LC network
DE3703649A1 (en) * 1987-02-06 1988-08-18 Heraeus Gmbh W C TOOL FOR PUNCHING COMPLEX CUTTING IMAGES FROM A METAL STRIP
SU1438886A1 (en) * 1987-05-27 1988-11-23 Ульяновский политехнический институт Method of progressive forming on a band
JPH05144336A (en) * 1991-11-22 1993-06-11 Mitsubishi Cable Ind Ltd Manufacture of conductor pattern for flat cable
DE19521022C2 (en) * 1995-06-13 1997-04-10 Heraeus Gmbh W C Process for producing a layered composite
DE19600481A1 (en) * 1996-01-09 1997-07-10 Orga Kartensysteme Gmbh Chip- or intelligent-card design
KR100231837B1 (en) * 1997-05-12 1999-12-01 유무성 Method for inner lead manufacturing in fine pitch leadframe
DE19914032A1 (en) * 1998-11-18 2000-09-28 Prometron Gmbh Method for producing and depositing punched antenna coil with several turns on chip card by depositing one or more coils after splitting on chip card in certain spatial mode

Also Published As

Publication number Publication date
EP1227709A3 (en) 2004-04-07
JP2002321190A (en) 2002-11-05
DE10103193B4 (en) 2008-10-30
SG120863A1 (en) 2006-04-26
DE10103193A1 (en) 2002-08-01
TW521549B (en) 2003-02-21
CN1289225C (en) 2006-12-13
CN1367068A (en) 2002-09-04
EP1227709A2 (en) 2002-07-31

Similar Documents

Publication Publication Date Title
MY130790A (en) Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
GB0015309D0 (en) Apparatus
MXPA02012399A (en) Flat gasket and method for the production thereof.
TW200632542A (en) Mask, mask forming method, pattern forming method, and wiring pattern forming method
SG116443A1 (en) Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same.
TW200502436A (en) Metal photoetching product and method of manufacturing the same
EP1239717A3 (en) Electromagnetic shielding plate and method for producing the same
ATE228687T1 (en) STANDARD FORMAT IC CARD WITH A REMOVABLE MINI CARD AND MANUFACTURING METHOD
EP1011298A4 (en) Substrate for formation of special pattern, and method of manufacture of substrate
GB2344222B (en) Chip type electronic part and method for the manufacture thereof
DE60039110D1 (en) DEVICE FOR ELECTROMAGNETIC SHIELDING
ZA200303699B (en) Multiple zone apertured web.
AU2000226927A1 (en) Semiconductor integrated circuit device and method of producing the same, and method of producing masks
HK1053277A1 (en) Laser machining mask and production method therefor.
AU2001292244A1 (en) Resist pattern, process for producing the same, and utilization thereof
DE50112965D1 (en) APOPTOTIKA
PL401031A1 (en) Flat metal element, method for manufacturing the metal element and the use of the metal element
DE69715472D1 (en) MANUFACTURING METHOD FOR AN INTEGRATED CIRCUIT AND THE INTEGRATED CIRCUIT PRODUCED BY IT
TW200619026A (en) Composite masking tape and method of using same
MY142532A (en) Procedure for the manufacture of track patterns
TW359005B (en) Method for manufacturing mixed circuit bi-gap wall structure
TW358986B (en) Metal layer patterns of a semiconductor device and a method for forming the same
TW200501845A (en) Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board
WO2004109590A3 (en) Data carrier and production method
GB2388840B (en) Bis(4-mercaptophenyl) sulfide derivative and method for producing the same and electronic component