MY119795A - Process for the production of semiconductor device - Google Patents

Process for the production of semiconductor device

Info

Publication number
MY119795A
MY119795A MYPI9801051A MY119795A MY 119795 A MY119795 A MY 119795A MY PI9801051 A MYPI9801051 A MY PI9801051A MY 119795 A MY119795 A MY 119795A
Authority
MY
Malaysia
Prior art keywords
semiconductor element
printed circuit
circuit board
semiconductor device
resin layer
Prior art date
Application number
Inventor
Satoshi Ito
Masaki Mizutani
Hiroshi Noro
Shinichirou Sudou
Takashi Fukushima
Makoto Kuwamura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY119795A publication Critical patent/MY119795A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

THE PRESENT INVENTION PROVIDES A PROCESS FOR THE PRODUCTION OF A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR ELEMENT (3) PROVIDED ON A PRINTED CIRCUIT BOARD (1) WITH A PLURALITY OF CONNECTING ELECTRODE PORTIONS (2) PROVIDED INTERPOSED THEREBETWEEN, THE GAP BETWEEN SAID PRINTED CIRCUIT BOARD (1) AND SAID SEMICONDUCTOR ELEMENT (3) BEING SEALED WITH AN UNDERFILL RESIN LAYER. IN ACCORDANCE WITH THE PRESENT INVENTION, (1) THE UNDERFILL RESIN LAYER IS FORMED BY MELTING A LAMELLAR SOLID RESIN PROVIDED INTERPOSED BETWEEN SAID PRINTED CIRCUIT BOARD (1) AND SAID SEMICONDUCTOR ELEMENT (3), AND (2) THE LAMELLAR SOLID RESIN PROVIDED INTERPOSED BETWEEN SAID PRINTED CIRCUIT BOARD (1) AND SAID SEMICONDUCTOR ELEMENT (3) IS HEATED FOR A PREDETERMINED PERIOD OF TIME UNTIL THE TEMPERATURE OF THE SOLID RESIN LAYER REACHES A PREDETERMINED RANGE WHERE THE TWO COMPONENTS ARE CONNECTED TO EACH OTHER UNDER PRESSURE UNDER THE FOLLOWING CONDITIONS (X) AND (Y): (X) SUPPOSING THAT THE INITIAL RESIDUAL HEAT OF REACTION OF THE SOLID RESIN BEFORE HEATING IS 100% AS DETERMINED BY A DIFFERENTIAL SCANNING CALORIMETER (DSC), THE RESIDUAL HEAT OF REACTION THEREOF IS NOT MORE THAN 70% OF THE INITIAL RESIDUAL HEAT OF REACTION; AND (Y) THE TEMPERATURE OF THE SEMICONDUCTOR ELEMENT (3) IS PREDETERMINED HIGHER THAN THAT OF THE PRINTED CIRCUIT BOARD (1), AND THE DIFFERENCE IN TEMPERATURE BETWEEN THEM IS NOT LESS THAN 50 °C. IN THIS MANNER, A PRODUCTION PROCESS WHICH FACILITATES THE RESIN SEALING OF THE GAP BETWEEN THE SEMICONDUCTOR ELEMENT (3) AND THE BOARD AND THUS CAN INHIBIT WARPAGE OF THE ENTIRE SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE HAVING AN EXCELLENT RELIABILITY CAN BE PROVIDED. IN THE PRESENT INVENTION, THE USE OF A SHEET-LIKE UNDERFILL MATERIAL WHICH GIVES AN UNDERFILL RESIN LAYER HAVING AN ELASTIC MODULUS IN TENSION AT 25 °C OF FROM 300 TO 15,000 MPA WHEN HARDENED CAN PROVIDE A SEMICONDUCTOR DEVICE WHICH EXERTS AN EXCELLENT EFFECT OF RELAXING THE STRESS ON THE SEMICONDUCTOR ELEMENT (3), PRINTED CIRCUIT BOARD (1) AND CONNECTING ELECTRODE PORTIONS (2) AND THUS EXHIBITS A HIGH RELIABILITY.
MYPI9801051 1997-04-02 1998-03-10 Process for the production of semiconductor device MY119795A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8349697 1997-04-02
JP20043597 1997-07-25
JP30896997 1997-11-11

Publications (1)

Publication Number Publication Date
MY119795A true MY119795A (en) 2005-07-29

Family

ID=47227318

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9801051 MY119795A (en) 1997-04-02 1998-03-10 Process for the production of semiconductor device

Country Status (1)

Country Link
MY (1) MY119795A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JPH0513119A (en) * 1991-07-04 1993-01-22 Sharp Corp Tape connector for connecting electronic parts
US5356698A (en) * 1990-03-27 1994-10-18 Hitachi, Ltd. Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US5356698A (en) * 1990-03-27 1994-10-18 Hitachi, Ltd. Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same
JPH0513119A (en) * 1991-07-04 1993-01-22 Sharp Corp Tape connector for connecting electronic parts

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