MXPA97004488A - Multiple layer nebulizer electroformado, yun process for my preparation - Google Patents

Abstract

A nebulizer is described that incorporates the structure that generates upstream turbulence for the control of the spray pattern and the droplet size of the spray. A method for the manufacture of the nebulizer uses a multi-layer protective layer process in conjunction with a multiple layer electroforming process.

Description

MULTIPLE LAYER NEBULIZER ELECTROFORMADO, AND A PROCESS FOR THE PREPARATION OF THE SAME FIELD OF THE INVENTION The present invention relates to a nebulizer incorporating turbulence generation with "upward direction for the control of spray distribution and spray droplet size." The invention also relates to a method for manufacturing a nebulizer that uses a Multi-layer protection process in conjunction with a multi-layer electroforming process.

BACKGROUND OF THE INVENTION Nebulizers or nozzles with small precision holes, are used in numerous industrial applications, including, for example, the use as fuel injectors in automotive internal combustion engines and engines for cuetas, such as thermal inkjet printheads, and in similar services that require the precise measurement of a fluid.

REF: 24834 • Conventional nozzle manufacturing methods include casting from a mold, machining and electroplating, and may require a finishing step to produce the final nozzle. 5 Electroplating methods for the manufacture of nozzles employ various combinations of dry and liquid protective layers and chemical etching or etching. Such methods are # limited, however, in that the maximum thickness of the electroformed layer, achievable, is approximately 100 micrometers. The methods of the prior art for the manufacture of nozzles have generally suffered from a lack of precision in the generation of the orifices.

Up to now, such methods have included the joining of discrete components to form nozzles. For example, William P. Richardson, in the Master's Thesis at Michigan Technological University:: The Influence of Current Flow Up on the Operation of Atomization of a Low Pressure Fuel Injector "(1991), (The Influence of Upstream Flow Conditions on the Atomizing Performance of a Low Pressure Fuel Injector) describes nozzles produced through the Silicon process MicroMachining (SMN). In this process, hole configuration is provided by chemical etching with silicon. US Pat. No. 4,586,226 to Fakler et al., Refers to a method for manufacturing a small orifice fuel injector, using the wax and silver technique followed by post-finishing. A first nickel plate (Ni) is electroplated on a stainless steel base plate, in which passages are formed for fuel feed. The connection of the holes to the perforations is made through a nickel layer of front plate. Plastic mandrels are fabricated having legs with support sections, sections for the section of holes and coupling tongues for joining the legs together. The support section of the mandrels are placed inside the acceptor holes formed in the front plate and a joined layer of rigid material is replaced by electrodeposition to enclose the hole forming sections. The sections of the materials that extend out of the bonded layer are removed, and the surface is smoothly finished. US Patent No. 4,246,076 to Gardner, refers to a multi-layer dry film plating method for manufacturing nozzles for inkjet printers. The process comprises the steps of coating a first layer of a photopolymerizable material on a substrate, and exposing the layer to a radiation pattern until at least a portion of the layer of photopolymerizable material is polymerized. A free surface of the first layer is coated with a second layer of a photopolymerizable material, the process being analogous to the process associated with the deposition of the first layer. Both layers are developed to remove unpolymerized material from the substrate, followed by metal deposition on the substrate by electroplating. U.S. Patent No. 4,229,265 to Kenworthy describes a thick, dry film protective layer coating layer for the fabrication of a plate with holes for a jet drop recorder. A sheet of stainless steel is coated on both sides with a photoresist material. The photoresist is then exposed through appropriate masks and developed to form photoresistive, cylindrical splines on both sides of the sheet. It is then placed in the form of a sheet of nickel on the sheet until its height covers the edges of the pins. A larger diameter photoresist plug is then formed on each photoresist peg. The nickel plating is then continued until the height is level with the plug. The photoresist material and the plate are then dissolved and detached from the nickel, forming two solid plates with homogeneous orifices. U.S. Patent No. 4,675,083 to Bearss et al., Refers to a method for manufacturing metal nozzle plates associated with an ink jet print head, by using a two-step process of protective coating and plating . The method comprises the steps of providing a first mask on a metal substrate that includes a first plurality of masking segments and the provision of a second mask including a second plurality of segments formed on top of the first plurality of segments. This structure is then transferred to an electroforming station, where a Nickel Layer is formed on the exposed surfaces, to a thickness of approximately 63.5 microns (2.5 mils). Once the plate is completed to a desired thickness, the negative and positive photoresist masking segments are removed using conventional photoresist lifting processes. U.S. Patent No. 4,954,225 a Bakewell refers to a method for electroforming nozzle plates that have three-dimensional characteristics. The method employs a dry film on the liquid, and a thick film protective layer. A conductive coating is applied to the surface of a transparent mandrel using photolithographic techniques. A pattern of thin circular masked areas of transparent non-conductive material is formed over each hole formed in the opaque conductive coating. A layer of the first metal is plated on the conductive coating on the transparent mandrel. A second metal layer is plated on the first metal layer, until the first layer of the second metal surrounds, but does not cover the photoresist posts. The depressions caused in the metal layers are filled with fillers to create a smooth continuous surface on top of the sheet metal layers. A thick layer of photoresist material is then applied over the top of the smooth plated layers, and cured to form a pattern of thick photoresist disks that cover and register with full depressions. The plated layers are then separated from the transparent mandrel and the foreign material is removed using appropriate release techniques. U.S. Patent No. 4,839,001 to Bakewell relates to a method for manufacturing an orifice plate using a thick film photoresist material, in which the plate is constructed from two electroformed nickel layers. A first layer of nickel is electroformed on a conductive mandrel, to form a support layer with a selected pattern of holes. The copper is plated on the nickel to cover the holes. The second nickel layer is electroformed on the surface that is attached to the mandrel, in such a manner as to form an orifice layer with a pattern of smaller holes of selected cross section, in alignment with the hole pattern of the first layer nickel The copper is then etched to reveal a thin orifice plate of nickel. US Pat. No. 4,716,423 to Chan et al. Refers to a process that * uses the application of a first liquid and then a dry film for the manufacture of an integrated plate, with holes. The process consists of forming a first portion of masking that has a convergingly contoured outer surface, and a second masking portion having straight vertical walls. A first metallic layer is electroformed around the first masking layer, to define a layer of hole plate and electroforming of the second metal plate is made around the second masking portion, to define a barrier layer of discontinuous and toothed wall portions having one or more cavities * for ink deposit.

Finally, the first and second maskings and the selected portions of metal substrate are removed, whereby the first and second metal layers are left intact in a composite configuration. 20 The North American Patent No. 4,902,386 a Herbert et al. Refers to a cylindrical electroforming mandrel and a thin film photoresist method for the manufacture and use thereof.

U.S. Patent No. 5,167,776 to Bhaskar et al. Describes an orifice or nozzle plate for an ink jet printer, which can be produced by a process 5 comprising the provision of electroplating over the conductive regions and over a portion of the regions of isolation of a mandrel, to form a first electroformed layer having openings of * converging holes that correspond to the regions insulation. The electroplating process can be repeated once to form a second electroformed layer on the first electroformed layer, said second layer having converging hole openings aligned with those of the first layer. layer. U.S. Patent No. 4,972,204 to # Sexton describes an orifice plate for an inkjet printer produced by a multilayer electroforming process that comprise the steps of forming protective pins on a substrate and electroplating said substrate being a first metallic layer complementary to the protective pins, allowing the metal to slightly exceed the upper surface of the pins protectors and form a first electroformed layer.

- A first protective layer in the form of a channel wider than the protective pins, is placed on the protective pins and the first electroformed layer. A second electroformed layer is formed around the first protective layer and on the first electroformed layer. A series of protective layers of increasing width and electroformed layers of decreasing width are subsequently placed in layers on the plate. holes in development in a similar manner to eventually form a plate with holes having openings that open towards a channel that progressively widens in an upward direction of the holes. The above references are incorporated herein by reference in their entirety.

BRIEF DESCRIPTION OF THE INVENTION The embodiments of the present invention are directed to a multi-layer fluid dispersing nebulizer, which incorporates the turbulence-generating structure with upward direction for the control of the distribution of the fluid. roclo and the droplet size of the spray.

* The methods for manufacturing such a "nebulizer are also described.A method provides the manufacture of a nebulizer that uses a process of protection from multiple layers in conjunction with a multi-layer electroforming process. A protective pattern complementary to a cross-sectional pattern of the nebulizer is applied to a substrate conductor, 'followed by the electroforming of a layer in patterns on the substrate. The protective application process and the electroforming process are repeated a plurality of times to produce an electroformed, multi-layered nebulizer. A structure resulting from the nebulizer includes the electroformed multiple layers in which at least one fluid inlet orifice is formed in at least one base layer of the multiple electroformed layers, at least one orifices of The fluid ejection is formed in at least one top layer of the multiple electroformed layers, and a turbulence induction channel connects at least one inlet orifice with at least one ejection orifice. The induction channel of turbulence is arranged such that it causes the direction of the fluid entering through at least one inlet, to change before being expelled from at least one ejection orifice. That is, the turbulence induction channel carries the fluid from at least one inlet opening towards at least one ejection orifice in a non-linear manner. According to a preferred embodiment, the turbulence induction channel is formed in a layer * Multiple, intermediate electroformed, which is placed between the base and the electroformed, upper layers. In this preferred embodiment, the inlet orifice and at least one ejection orifice are laterally displaced from one another (for example, displaced in a direction perpendicular to the direction in which the central axes of the inlet and ejection orifices extend), and the turbulence induction channel extends in the direction perpendicular to the axis of the orifices. In this way, in this modality, the fluid enters the inlet hole flowing in a direction parallel to the inlet orifice axis, enters the turbulence induction channel where the fluid direction changes by approximately 90 °, flows through the turbulence induction channel to at least one ejection hole, and changes direction again by approximately 90 ° after being expelled through at least one ejection orifice. This type of flow path creates turbulence in the fluid, which improves the atomization and spray distribution of the ejected fluid. Other features and advantages of the embodiments of the present invention will become more fully apparent from the following detailed description of the preferred embodiments, the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in conjunction with the following drawings, in which like reference numerals designate similar elements and wherein: FIGURES IA to II are cross-sectional views illustrating the steps of producing a fluid dispersion nebulizer having a fluid path that induces turbulence, according to one embodiment of the invention; FIGURE 2A is a front view of a fluid dispersing nebulizer, according to one embodiment of the invention; FIGURE 2B is a cross-sectional view through line 2B-2B of FIGURE 2A; FIGURE 3A is a side view of a fluid dispersing nebulizer according to an embodiment of the invention; FIGURE 3B is a cross-sectional view through line 3B-3B of FIGURE 3A; FIGURE 4A is a front view of a fluid dispersing nebulizer, according to one embodiment of the invention, and FIGURE 4B is a cross-sectional view through line 4B-4B of FIGURE 4A.

DETAILED DESCRIPTION OF THE PREFERRED MODALITIES One embodiment of the method according to the invention provides multiple layers of electroforming, metallic with each layer that is in the thickness range from about 0.010 mm to about 0.400 mm, and eliminates the requirement of any additional finishing step. The method produces smooth, flat surfaces without borders. No grinding, sanding, forming or machining is necessary to obtain flatness or flatness. The method produces a nebulizer or atomizer with orifice dimensions and desirable fluid path characteristics for applications that require accurate measurement of a fluid, such as, for example, a fuel injection nozzle. Turbulence induction channel improves atomization and fluid distribution of expelled fluid, which is particularly advantageous for fuel injection nozzles. The invention, however, is not limited to nozzles for fuel injection. The invention can also be used for example in paint spraying applications, cosmetic spraying applications, applications for supplying industrial household cleaners, or any other applications in which fluid atomization and spray pattern control are desired.

A protective layer pattern, which is complementary to a desired cross-section of the nebulizer, is prepared for the electroforming process with an appropriate photo-tool design. Photo-tool designs are commonly used in the art. For example, a line drawing in the form of a drawing for a nozzle cross-section is made on a piece of paper, such that the lines dark correspond to the final design that you want to print. The lines were prepared by areas that do not have an image. A positive or negative photo-tool of original illustrations of a text is prepared using conventional photographic processes. The Photoherramienta for a negative protective layer has clear lines that correspond to the lines of the original text illustration and the darkened areas correspond to the areas between the lines. As is known to those skilled in the art, a photo-tool used for a positive protective layer could have these areas inverted, for example, the lines could be dark and the areas between the lines could be clear. A conductive substrate is primarily cleaned by methods well known to those skilled in the art, to prepare it for the application of a protective layer pattern. The sequence of the cleaning steps may include washing with isopropyl alcohol, degreasing with steam in trichlorethylene, electrolysis, rinsing with distilled water, washing in nitric acid, and final rinsing in distilled water. Typical substrates materials include stainless steel, chromium or nickel plated iron, nickel, copper, titanium, aluminum, chromium or nickel plated aluminum, titanium-palladium alloys, nickel-copper alloys such as Inconel® 600 and Invar® ( available from Inco), and the like. Non-metallic substrates can also be used if they have been made conductive, for example, by being properly metallized using metalization techniques known in the art, such as non-electrolytic metallization, vapor deposition, and the like. The substrate may be of any suitable form. If it is cylindrical, the surface of the substrate must be substantially parallel to the axis of the substrate. Protective materials can include various types of liquid protectors. As is well known in the art, these protective materials can be classified as either positive, such as either Microposit® or Photoposit®, obtainable from Shipley, Inc. (Newton, MA) or negative, such as the Waycoat Protectants obtainable from OGC. Microelectronics, Inc. These liquid protective layers are either water processable or solvent processable in commonly used organic solvents such as benzene, dichloromethane, trichloromethane, and the like. Positive-protective materials include solvent-processable protectants containing 2-ethoxyethyl acetate, n-butyl acetate, xylene, O-chlorotoluene, toluene, mixtures of novolac resins and photoactive compounds. Negative protective materials include solvent processable protective materials, which contain cyclised polyisoprene and diazido type photoinitiators. In the case of a negative protective layer, for example, the photo-tool is hermetically secured to the surface of the substrate coated with the protector. The substrate is irradiated with actinic radiation at an energy level of 100-200 mJ / cm2 up to 100-2,000 mJ / cm2, for example. The photo-tool is removed by leaving those portions of the protective layer that were exposed to the portions polymerized with ultraviolet radiation and those portions of the protective layer that were not yet irradiated in semi-solid form. The protective layer is developed on the substrate with development equipment and conventional chemicals. Those portions of the protective layer that were not irradiated are washed in the development process, leaving only the polymerized portions remaining on the surface of the substrate. In the case of positive protective systems, the irradiated areas are washed and the non-irradiated areas remain after the development process. Throughout the FIGURES, similar numbers represent similar parts. As described in FIGS. 1A and IB, a first pattern layer 3 is electroformed onto the substrate 1 having a first protection pattern 2. The shapes of the first layer in patterns 3 and the first protective pattern 2 can be selected in any ways that produce a desired effect on the particle size and / or the directionality of the roclo. Exemplary forms include those that are circular, oblong, egg-shaped, toroid, cylindrical, polygonal, triangular, rectangular, square, regular and irregular.

In the electroforming process it takes place within an electroforming zone comprising an anode, a cathode and an electroforming bath. The bath may be composed of: ions or ion salts of the layer forming material in standards, the concentration of which may be in the range of traces to saturation, whose ions may be in the form of anions or cations; a solvent; a buffering agent, the concentration of which may be in the range of zero to saturation; an anode corrosion agent, the concentration of which may be in the range of zero to saturation; and, optionally, grain refiners, levelers, catalysts, surfactants and other additives known in the art. The preferred concentration ranges can be easily established by those of ordinary experience to the art, without undue experimentation. The preferred electroforming bath for nickel plating (e.g., as the first layer in pattern 3) on a substrate, comprises approximately 80 mg / ml of the nickel ion in solution, approximately 20-40 mg / ml of H3BO2, approximately 3.0 mg / ml of NiCl2"6H20 and approximately 4.0-6.0 ml / liter of sodium lauryl sulfate Other suitable electroforming bath compositions include, but are not limited to, Watts nickel: approximately 68-88 mg / ml nickel ion , approximately 50-70 mg / ml of NiCl2'6H20 and approximately 20-40 mg / ml of H3B03, chlorine sulphate: approximately 70-100 mg / ml of nickel ion, approximately 145-170 mg / ml of NiCl2'6H20 and approximately 30-45 mg / ml of H3B03, and concentrated sulfamate, approximately 100-120 mg / ml of nickel ion, approximately 3-10 mg / ml of NiCl2'6H20 and approximately 30-45 mg / ml of H3B03. electrolysis such as nickel baths without electrolysis, can also be used. various types depending on the properties required in the deposition of electroforming. These non-electrolytic baths are well known to those skilled in the art. Examples of metals that can be electroformed on the surface of a substrate include, but are not limited to, nickel, copper, gold, silver, palladium, tin, lead, chromium, zinc, cobalt, iron and alloys thereof. The preferred metals are nickel and copper. Any suitable conduit or material that can be electrochemically deposited can be used, such as conductive polymers, plastics and non-electrolytic nickel deposits. Examples of suitable non-electrolytic, autocatalytic nickel deposits include, but are not limited to, nickel-phosphorus, nickel-boron, 5-polyacrylate alloys, such as copper-nickel-phosphorus, nickel-polytetrafluoroethylene, composite coatings, and the like. . The methods for preparing the non-electrolytic nickel deposits employed within the scope of this invention are well known for those skilled in the art of electroforming. The electrolytic bath is energized using an appropriate electrical source. Ions that form structured layers or patterns from of the solution are electroformed from the exposed conductive surfaces of the substrate 1, determined by the pattern of the polymerized protective layer 2. Those portions of the substrate covered with the protective layer remain unchanged. plated. It is allowed to proceed until a first patterned layer 3 has been deposited on the exposed surface of the substrate 1 to a desired thickness in the range of about 0.010 mm to about 0.400 mm, and preferably in the range from about 0.020 mm to about 0.200 mm. As described in the figures, this thickness may correspond to the thickness of the first protective layer pattern 2. In this way, the thickness ranges appropriate for the first protection pattern 2 are approximately the same as those for the first structured layer 3. Figures 1C and ID describe another application cycle of protective layer and electroplating. A second pattern 4 of protective layer will be provided on the upper layer of the first pattern 2 of the protective layer and on the part of the first structured structured layer 3. The electrolytic bath is energized and the ions for the structured layer formation coming from the solution are electroformed on the exposed conductive surfaces of the first layer 3 structured or patterned, in a pattern complementary to the second pattern 4 of the protective layer. The process is continued until a second structured layer 5 is deposited on the exposed surface of the first structured layer 3 to a desired thickness in the range of about 0.010 mm to about 0.400 mm to about 0.020 mm, and preferably in the range of about 0.020 mm to approximately 0.200 mm. As described in the figures, this thickness may correspond to the thickness of the second pattern 4 of protective layer. In this way, the thickness ranges appropriate for the second pattern 4 of protective layer are approximately the same as those for the second structured or patterned layer 5. The shapes of the second structured layer 5 and the second protective layer pattern 4 can be selected from any shapes that produce a desired effect on particle size and / or envelope (spray directionality.) Exemplary forms include those that are circular, oblong, ovoid, toroid, cylindrical, polygonal, triangular, rectangular, square, regular and irregular. Figure 1E describes a metallization step in which a metallic layer 6 is coated on the upper layer of the second protective layer 4 and the second structured layer 5.

The metal layer 6 can be applied by any of the numerous metallization techniques known to those skilled in the art, such as, for example, Evaporative Physical Vapor Deposition (PVD), PVD in Crackling and Non-Flaking autocatalytic electrolyte. Suitable components of the metallic layer 6 include, but are not limited to, gold, silver, nickel, palladium, titanium, iron, copper, aluminum and chromium. The thickness of the metal layer should be 0.00001 mm to 0.020 mm, preferably 0.00005 mm to 0.005 mm. The metal layer is provided to make it possible for the electroforming to take place on the second, non-conductive protective layer pattern 4. Figures 1F-1G and Figures 1H-1I describe alternative additional steps according to the different embodiments of the invention. Figures 1F and 1G describe the provision of third protective layer patterns 7, and electroplating of a third structured layer 8 on top of metallic layer 6. The third structured layer 8 is characterized by having a very protruding geometry. In a layer having this geometry, the electroplated material overlaps the edges of each third pattern 7 of the protective layer to define a graduated fluid ejection orifice 9. This type of geometry occurs when the protective material is a liquid protective layer and / or the third protective layer patterns 7 are thin relative to the structured third layer 8. The height of the third protective layer patterns 7 must be 0.0005 mm. up to 0.100 mm, preferably 0.001 mm to 0.075 mm, more preferably 0.002 mm to 0.050 mm. Protective materials that can be employed to form the overdeveloped geometry include, but are not limited to, those liquid protective layers typically containing 2-ethoxyethyl acetate, N-butyl acetate, xylene, o-chlorotoluene, toluene and proto-active compounds and mixtures of proto-active compounds. Examples of proto-active compounds include, but are not limited to, diazo-based compounds or diazodi-based compounds. The shapes of the structured third layer 8 and the third protective layer patterns 7 can be selected in any way that will produce a desired effect on the particle size and / or on the spray directionality. Exemplary forms include those that are circular, oblong, ovoid, toroid, cylindrical, polygonal, triangular, rectangular, square, regular and irregular. In a preferred embodiment of the invention, the third protective layer patterns have shapes with at least one sharp edge.

Figures II and II describe the provision of third protective layer patterns 7 'having a thickness at least sufficient to substantially prevent over-developed geometry, such as that described in Figure 1G. In this embodiment, the third layer structure 8 'is electroplated, on top of the metal layer 6 at a height less than or equal to those of the third protective layer patterns 1'. When the structured third layer 8 'is designed to have a thickness that is less than the third protective layer 7' patterns, the objective thickness for the structured third layer 8 'is preferably approximately 10% less than the thickness of the third layers. 1 'patterns of protective layer. The height of the third patterns 1 'of protective layer and the third structured layer 8', should be 0.010 mm to 0.400 mm ', preferably 0.025 mm to 0.300 mm, more preferably 0.050 mm to 0.250 mm. The upper surface is of the third protective layer patterns 1 'which are substantially free of electroplating. After the thickness of desired multiple layers is electroformed onto the substrate surface 1, the substrate is removed from the solution. The multi-layer electroformed pattern can be removed from the surface of the substrate by standard methods including, but not limited to, mechanical separation, thermal shock, mandrel dissolution, and the like. These methods are well known to those of experience in the electroforming technique. The protective layer patterns and the portion of the metal layer present in the flow path are preferably removed before removing the substrate, to minimize handling of the parts. The protective layer patterns can be removed by any suitable method practiced in the art. Such methods include washing the acetone or dichloromethane substrate for solvent processable protective layers, or mixtures of ethanolamine and glycol ethers for aqueous processable protective layers. Other suitable methods of removing the photoresist material are known in the art, and are typically provided by the photoresist suppliers. The metal layer in the flow path is preferably removed by protective layer cleaning means in the protective layer removal step. However, if the metal layer in the flow path remains after removal of the protective layer, it can be removed by selective etching or etching techniques, well known to those of ordinary skill in the art. In multi-layer structures, such as the three-layer structures, described in the figures, a post-substrate removal cleaning step is usually necessary. Typically, this step can be achieved by drum-polishing the parts, in for example, acetone, dichloromethane, or mixtures of ethanolamine and glycol esters. Although Figures IA to II describe modalities in which the protective layer pattern and the structured layer defining the inlet orifice are the first applications to the substrate, those of ordinary skill in the art will readily appreciate that the process could be reversed, such that the protective layer and the structured layer that has the ejection holes, could be the first applications to the substrate, (for example the base layer), and the protective layer pattern and the structure layer that defines the entrance hole could be the last ones applications to the growing nebulizer (for example, the top layer). An example of such alternative embodiment comprises: the application on a conductive substrate of a first pattern of protective layer having a shape corresponding to a shape of at least one fluid ejection hole; the electroforming on the conductive substrate of a structured first layer complementary to the first protective layer pattern; the application on a first surface defined by the first layer structured and the first protective layer pattern a, a second protective layer pattern having a shape corresponding to a shape of an intermediate channel; the electroforming on the first surface of a second structured layer complementary to the second protective layer pattern; the application of a metallic layer on a second surface defined by the second pattern of protective layer and the second structured layer; the application on the metal layer of a third pattern of protective layer having a shape corresponding to the shape of an inlet orifice; the electroforming of the metallic layer of a structured third layer complementary to the third protective layer pattern, to provide a multi-layer electroforming pattern; the residue of the protective layer patterns and a portion of the metallic layer located in a non-linear fluid path from the multi-layer electroformed pattern; and the removal of the multi-layer electroformed pattern from the substrate, to provide a fluid dispensing unit. Figures 2A-2B and 3A-3B describe a preferred embodiment of a finished nebulizer 20, after the substrate and the substrate have been removed. photoresist material. With reference to figure (2B), an inlet 11 has a central axis XA extending in a first direction, the fluid ejection orifices 9 having central axes XB and XC parallel to, but displaced from, the XA axis of the entry hole. A fluid to be dispensed flows into the fluid dispersing mist 20 through the inlet 11 and into an intermediate channel 10. An inner surface of the third layer 8 Structured interrupts the linear flow of the fluid, forcing the fluid to undergo turbulence which induces the angular transition of the fluid path before the outlet of the intermediate channel 10 and the spraying through two fluid ejection orifices 9. In In the illustrated embodiment, the channel 10 extends in a direction substantially perpendicular to the axes XA, XB and XC of the holes. Figures 4A-4B describe another preferred embodiment of a finished nebulizer 20. In this embodiment, there are four of each of the inlet ports 11, the intermediate channel 10 and the fluid ejection orifice 9. Each intermediate channel 10 has an ovoid cross section. Advantageously, a nebulizer prepared according to the invention can have an intermediate diameter and thickness in cross section. For example, the fluid ejection orifices of a nebulizer may have a minimum transverse dimension from about 0.010 mm to about 2.00 mm, preferably from about 0.020 mm to about 0.500 mm. The dimensions of the fluid ejection orifice 9 are handled by the fluid flow requirements and vary widely depending on the application and the pressure drop requirement through the nebulizer. These dimensions can be determined by someone of ordinary skill in the art without undue experimentation.

The dimensions of the photoresist material on the substrate and the electroformed layers, and the electroforming time, determine the dimensions of the nebulizer. The multi-layer thickness of the nebulizer should be from about 0.100 mm to about 1500 mm. A preferred thickness is in the range of about 0.300 mm to about 0.900 mm. Variations from these exemplary intervals can therefore be Easily performed by those skilled in the art, more than one inlet 11 can be provided in each nebulizer 20. A fluid ejecting orifice 9 can be provided in each nebulizer 20. Alternatively, two (as shown) or three or more orifices 9 for expulsion of fluid may be provided in each nebulizer 20. The number of structured layers in a nebulizer is not limited to three. You can provide more than three structured layers, for example, to facilitate the formation of more intricate cavities, holes, flow paths, and the like. For example, additional layers may be provided to facilitate the formation of grooves, fins or ribs on the wall downstream of the intermediate channel, whose structures have an additional impact on the turbulence of the fluid. The axes of the inlet and ejection ports do not need to be parallel, and do not need to be perpendicular to the intermediate channel, as long as sufficient turbulence is generated in the fluid. A plurality of nebulizers can be simultaneously manufactured on a simple substrate. To allow the parties to be removed from the As the substrate as a continuous sheet and to facilitate the handling of the array, thin coupling strips can be electroformed to attach the final electroformed layer of each nebulizer pattern to at least one of the other patterns of the nebulizer. The The distance between the nebulizers in the array pattern can vary widely, with the goal being to minimize space. The nebulizers prepared according to the present invention can be used in applications that require nebulizers with precision holes, such as the precise measurement of a fluid. Such uses include, but are not limited to, nozzles for fuel injectors for use in internal combustion engines, nozzles printing for thermal ink jet printing, drop on demand printing, and piezoelectric drive printing, and spray applications, including epoxy spray, paint spray, adhesive spray, cosmetic spray, spray for household or industrial cleaners, and sprays of solder paste, or any other applications in which the atomization of the fluid and the f control of the spray pattern are desired. While the invention has been described in detail and with reference to the specific modalities thereof, it will be apparent to those of experience in the art that various changes and modifications may be made therein without departing from the spirit and scope thereof. It is noted that in relation to this date, the best method known by the applicant to carry out the aforementioned invention, is that which is clear from this description of the invention. Having described the invention as above, property is claimed as contained in the following:

Claims (32)

1. A fluid dispensing unit comprising a plurality of electroformed layers, said layers defining a non-linear fluid path, characterized in that the unit comprises: an inlet orifice for receiving a fluid; a hole for the expulsion of the fluid, to expel said fluid; and - an intermediate inductor-turbulence channel between the inlet orifice and the fluid ejection orifice, for the non-linear transportation of fluid from the inlet orifice to the fluid ejection orifice.

2. The fluid dispersing unit according to claim 1, characterized in that the intermediate channel that induces the turbulence is defined by an upstream wall and a downstream wall, the upstream wall is penetrated by the entry orifice, and the running wall below it is penetrated by the fluid ejection orifice, at a site displaced from the entrance orifice.

3. The fluid dispersing unit according to claim 2, characterized in that the turbulence-inducing intermediate channel has a cross section that is rectangular or ovoid in shape.

4. The fluid dispersing unit according to claim 1, characterized in that it has four of each of the inlet orifices, fluid melting orifice and the intermediate turbulence induction channel.

5. The fluid dispersing unit according to claim 2, characterized in that the turbulence induction intermediate channel extends in a direction that is substantially perpendicular to a central axis of at least one of the fluid melting orifice and the inlet orifice.

6. The fluid dispersing unit according to claim 1, characterized in that it comprises two fluid ejection orifices, in fluid communication with the turbulence inductor intermediate channel.

7. The fluid dispersing unit according to claim 1, characterized in that the fluid ejection orifice is defined by at least one electroformed layer that 5 has overdeveloped geometry.

8. The fluid dispersing unit according to claim 1, characterized in that the • fluid ejection orifice has a 10 shape with at least one sharp edge.

9. The fluid dispersing unit according to claim 1, characterized in that the inlet hole has a shape 15 sectional cross section selected from the group consisting of circular, oblong, toroid, polygonal, triangular, rectangular and irregular.

10. The fluid dispersing unit according to claim 1, characterized in that the electroformed layers comprising at least one member selected from the group consisting of nickel, copper, gold, silver, palladium, tin, lead, cobalt, chromium, iron, zinc, and alloys of the same 25.

- * 11. The fluid dispersing unit according to claim 1, characterized in that the electroformed layers comprise at least one member selected from the group consisting of 5 alloys of nickel-phosphorus, nickel-boron, copper-nickel-phosphorus, nickel-polytetrafluoroethylene, and compounds thereof.

12. The fluid dispersing unit according to claim 1, characterized in that the electroformed layers are identical in composition.

13. The fluid dispersing unit according to claim 1, characterized in that the fluid dispersing unit is a fuel injection nozzle for liquid fuel atomization, for a motor.

14. A method for the production of a fluid dispersing unit according to claim 1, characterized in that it comprises: (a) electroforming on

A substrate on at least one structured base layer for defining the inlet or fluid ejection orifice; (b) electroforming on at least one structured base layer of at least one 5 structured intermediate layer, to define the intermediate channel; (c) the electroforming on at least one intermediate structured layer of the at least one structured upper layer, to define another 10 hole and to provide a multi-layered electroformed pattern; and (d) separating said electroformed pattern from multiple capable of the substrate, to provide the fluid dispensing unit. 15. A method for the production of a fluid dispersing unit according to claim 1, characterized in that it comprises: (a) application on a conductive substrate of a first pattern of protective layer having a shape corresponding to a form of inlet hole; (b) the electroforming on the conductive substrate of a structured first layer complementary to the first protective layer pattern; (c) the application on a first surface defined by the first structured layer and the first protective layer pattern, of a second protective layer pattern having a shape corresponding to a shape of said intermediate channel; 10 (d) the electroforming on the first surface of a second structured layer, complementary to the second pattern of protective layer; (e) the application of a metallic layer on a second surface defined on

F the second protective layer pattern and the second structured layer; (f) the application on the metallic layer of a third protective layer pattern 20 having a shape corresponding to a fluid ejection orifice shape; (g) electroforming on the metallic layer of a structured third layer, complementary to the third protective layer pattern, to provide a multi-layer electroformed pattern; (h) removing the protective layer patterns and a portion in the metal layer located in the non-linear fluid path from the multi-layer electroformed pattern; e (i) removing the electroformed multi-layer pattern from the substrate to form the fluid-dispensing unit. 16. A method for the production of the fluid dispersing unit according to claim 1, characterized in that the method comprises: (a) applying a first pattern of protective layer on a conductive substrate, having a corresponding shape to a shape of the fluid ejection orifice; (b) the electroforming of a first layer structured on the conductive substrate, complementary to the first pattern of protective layer; (c) the application on a first surface defined by the first structured layer and the first pattern of protective layer, of 25 a second pattern of protective layer having a shape corresponding to a shape of the intermediate channel; (d) the electroforming on the first surface of a second structured layer, complementary to the second pattern of protective layer; (e) the application of a metallic layer on a surface defined by the second pattern of protective layer and the second structured layer; (f) the application on the metal layer of a third protective layer pattern having a layer corresponding to an inlet orifice shape; (g) electroforming on a metallic layer, of a third structured pattern complementary to the third protective layer pattern, to provide a multi-layer electroformed pattern; (h) removing the protective layer patterns and a portion of the metallic layer located in the non-linear fluid path from the multi-layer electroformed pattern; e (i) removing the multi-layer electroformed pattern from said substrate to provide the fluid dispensing unit.

17. A fluid dispersing unit, characterized in that it comprises: a first electroformed layer having at least one inlet in it; a second electroformed layer having at least one fluid ejection hole therein; and at least one turbulence inducing channel, extending between at least one inlet port and at least one fluid ejection port, extending from at least one turbulence inducing channel in a direction that is at a non-zero angle of a central axis of at least one inlet and at least one fluid ejection hole, to induce turbulence in the liquid flowing from at least one inlet orifice to at least one ejection orifice.

18. The fluid dispersing unit according to claim 17, characterized in that it comprises an intermediate electroformed layer located between the first electroformed layer and the second electroformed layer, at least one turbulence inducing channel located in the intermediate electroformed layer.

19. A method for the production of a fluid dispersing unit, characterized in that it comprises: (a) the application of a first pattern of protective layer on a conductive substrate; (b) electroforming on an inductor substrate of a structured or patterned first layer, complementary to the first protective layer pattern; 15 (c) the application of a second pattern of protective layer, -on the first structured layer and the first protective layer pattern; (d) the electroforming on the first surface, of a second structured layer complementary to the second protective layer pattern; (e) the application of a metallic layer on a surface defined by the second. protective layer pattern and the second structured layer; (f) applying a third protective layer pattern on the metallic layer in a position that is displaced from the first protective layer pattern at a position along the surface of the substrate; (g) electroforming on the metallic layer of a structured third layer, complementary to the third protective layer pattern, to provide a multi-layer electroformed pattern; (h) removing the protective layer patterns and a portion of the metallic layers, located adjacent to the third protective layer pattern, from the multi-layer electroformed pattern; e (i) removal of the multi-layer electroformed pattern from the substrate, to provide the fluid dispersing unit.

20. The method according to claim 19, characterized in that the protective layer patterns comprise at least one member selected from the group consisting of 2-ethoxyethyl acetate, N-butyl acetate, xylene, 0-chlorotoluene, toluene, a photoactive compound and mixtures thereof.

21. The method according to claim 19, characterized in that the protective layer patterns comprise at least one member selected from the group consisting of polyisoprene. # cyclised and diazido type photoinitiators.

22. The method according to claim 19, characterized in that the patterned or structured layers comprise at least one member selected from the group consisting of nickel, copper, 15 gold, silver, palladium, tin, lead, cobalt, chromium, iron, zinc and alloys thereof. *

23. The method according to claim 19, characterized in that the layers Structured members comprise at least one member selected from the group consisting of nickel-phosphorus, nickel-boron, copper-nickel-phosphorus, nickel-polytetrafluoroethylene, and compounds thereof.

24. The method according to claim 19, characterized in that the first structured or patterned layer has a thickness of about 0.010 mm to about 0.400 mm.

25. The method according to claim 19, characterized in that the first protective layer pattern has a thickness of about 0.010 mm to about 0.400 mm.

26. The method according to claim 19, characterized in that the second structured or patterned layer has a thickness of about 0.010 mm to about 0.400 mm.

27. The method according to claim 19, characterized in that the second pattern of protective layer has a thickness of about 0.010 mm to about 0.400 mm.

28. The method according to claim 19, characterized in that the third structured or patterned layer has a thickness of about 0.010 mm to about 5 0.400 mm.

29. The method according to claim 19, characterized in that the third protective layer pattern has a thickness of 10 approximately 0.010 mm to approximately 0.400 mm.

30. The method according to claim 19, characterized in that the third The structured layer projects over the third protective layer pattern.

31. The method according to claim 19, characterized in that the layer The metal comprises at least one metal selected from the group consisting of gold (Au), silver (Ag), nickel (Ni), palladium (Pd), titanium (Ti), iron (Fe), copper (Cu), aluminum ( Al) and chromium (Cr).

32. The method according to claim 19, characterized in that the metal layer has a thickness of about 0.00001 mm to about 0.020 mm.