KR100307781B1 - Manufacturing method of nozzle plate by electric casting and polishing process - Google Patents
Manufacturing method of nozzle plate by electric casting and polishing process Download PDFInfo
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- KR100307781B1 KR100307781B1 KR1019980060602A KR19980060602A KR100307781B1 KR 100307781 B1 KR100307781 B1 KR 100307781B1 KR 1019980060602 A KR1019980060602 A KR 1019980060602A KR 19980060602 A KR19980060602 A KR 19980060602A KR 100307781 B1 KR100307781 B1 KR 100307781B1
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- nozzle plate
- nozzle
- electroforming
- substrate
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000007517 polishing process Methods 0.000 title claims abstract description 19
- 238000005266 casting Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 24
- 238000005323 electroforming Methods 0.000 claims abstract description 21
- 238000005498 polishing Methods 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 4
- 230000002940 repellent Effects 0.000 claims description 4
- 239000005871 repellent Substances 0.000 claims description 4
- 239000010970 precious metal Substances 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000001846 repelling effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 11
- 230000005499 meniscus Effects 0.000 description 8
- 238000004080 punching Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14411—Groove in the nozzle plate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
본 발명은 기판에 포토레지스터를 도포하는 단계와; 기판에 도포된 포토레지스터상에 일련의 원형패턴을 형성하는 단계와; 패턴이 형성된 기판 위에 전기주조 공정에 의하여 원하는 두께이상의 두께를 가지는 노즐 플레이트를 형성하는 단계와; 형성된 노즐 플레이트에 결합된 기판과 포토레지스트를 제거하는 단계와; 노즐 플레이트를 원하는 두께로 연마하는 단계와: 연마한 노즐 플레이트의 거친 표면을 폴리싱(polishing)공정에 의하여 제거하는 단계를 포함하는 전기주조와 연마공정에 의한 노즐 플레이트의 제조방법에 관한 것으로, 제조된 노즐 플레이트는 출구부가 거의 직관에 가까워서 잉크의 직진운동성이 향상되고 노즐사이의 평탄한 부위가 넓어 프린터 헤드와의 접착의 신뢰성 및 프린터 헤드의 안정성이 확보되며 제조비용을 줄일 수 있는 효과가 있다.The present invention comprises the steps of applying a photoresist to the substrate; Forming a series of circular patterns on the photoresist applied to the substrate; Forming a nozzle plate having a thickness greater than or equal to a desired thickness by an electroforming process on the patterned substrate; Removing the substrate and photoresist coupled to the formed nozzle plate; A method of manufacturing a nozzle plate by electroforming and polishing, comprising: polishing a nozzle plate to a desired thickness; and removing the rough surface of the polished nozzle plate by a polishing process. The nozzle plate has an outlet portion close to a straight tube, so that the linear motion of the ink is improved, and the flat portion between the nozzles is wide, thereby ensuring the reliability of adhesion with the printer head and the stability of the printer head, and reducing the manufacturing cost.
Description
본 발명은 잉크젯 프린터 헤드에 사용되는 노즐 플레이트를 제조하는 방법에 관한 것으로, 보다 상세하게는 전기주조에 의채 -인하는 두께보다 두꺼운 노즐 플레이트를 형성한 후 연마공정에 의하여 원하는 두께를 형성하여 노즐 플레이트의 출구부위에 거의 직관에 가까운 부분을 가지는 노즐 플레이트를 제조하는 방법에 관한 것이다.The present invention relates to a method for manufacturing a nozzle plate for use in an inkjet printer head, and more particularly, to form a nozzle plate thicker than the thickness of the electrophoresis-forming the desired thickness by a polishing process after forming a nozzle plate It relates to a method for producing a nozzle plate having a portion near the outlet portion of the nearly straight pipe.
잉크젯 프린터 헤드에서 잉크공급장치에 함유되어 있던 잉크는 잉크공급관을 통하여 기록장치에 공급되고, 기록장치는 잉크공급장치로부터 공급받은 잉크를 피기록재에 분사하여 인쇄를 행한다. 이때 잉크는 노즐 플레이트에 형성된 노즐을 통하여 피기록재에 분사된다.Ink contained in the ink supply apparatus in the inkjet printer head is supplied to the recording apparatus through the ink supply tube, and the recording apparatus injects ink supplied from the ink supply apparatus onto the recording material to perform printing. At this time, ink is injected onto the recording material through the nozzle formed on the nozzle plate.
잉크가 분사된 후에는 분사된 양만큼의 잉크를 층진하기 위한 잉크의 관성흐름으로 인하여 노즐 플레이트의 출구부위에서 대기에 노출되는 매니스커스(meniscus)가 진동을 일으키게 되며, 이와 같은 매니스커스의 진동은 유체시스템의 공진식에 의해 유추될 수 있다.After the ink is ejected, the meniscus exposed to the atmosphere at the outlet of the nozzle plate vibrates due to the inertial flow of the ink for layering the ejected amount of ink. Vibration can be inferred by the resonance of the fluid system.
매니스커스가 진동하는 동안에는 잉크가 분사될 수 없으므로 다음 잉크분사 까지의 시간을 줄이기 위해서는 이 매니스커스의 진동을 빠른 시간안에 감쇄, 안정화시키는 것이 중요하며, 매니스커스의 진동을 빠른 시간에 감쇄시킬 수 있으면 프린터 헤드의 분사주파수를 높일 수 있게 된다.Since the ink cannot be ejected during the vibration of the meniscus, it is important to attenuate and stabilize the vibration of the meniscus in a short time to reduce the time until the next ink injection. If possible, the injection frequency of the print head can be increased.
매니스커스의 진동을 빨리 감쇄시키기 위한 방법으로는 일반적으로 잉크의 점도를 높여 감쇄기능을 강화시키거나 노즐 플레이트의 출구부위의 직경을 작게 하여 감쇄기능을 강화시키는 방법을 사용한다.As a method for quickly attenuating the vibration of the meniscus, a method of increasing the viscosity of the ink to enhance the attenuation function or reducing the diameter of the outlet portion of the nozzle plate is used.
따라서 잉크젯 프린터 헤드에 있어서 노즐 플레이트의 출구부위는 잉크방을의 분사성능과 잉크를 분사한 후의 안정성에 영향을 미치는 중요한 인자이다.Therefore, in the inkjet printer head, the outlet portion of the nozzle plate is an important factor that affects the spraying performance of the ink room and the stability after spraying the ink.
노즐 플레이트의 출구부위의 직경을 작게 하기 위하여 종래에는 노즐 플레이트의 출구부위의 단면형상이 적당한 길이의 직관부위를 가지도록 하였다.In order to reduce the diameter of the outlet portion of the nozzle plate, conventionally, the cross-sectional shape of the outlet portion of the nozzle plate has a straight pipe portion of an appropriate length.
노즐의 출구부위에 적당한 길이의 직관부위를 가지는 노즐 플레이트는 그 부분의 직경이 다른 부분에 비하여 상대적으로 작아지므로 매니스커스의 진동을 빨리 감쇄시킬 수 있게 된다.Since the nozzle plate having a straight pipe portion of a suitable length at the outlet portion of the nozzle is relatively smaller in diameter than the other portion, the vibration of the meniscus can be quickly attenuated.
출구부위에 적당한 길이의 직관부위를 가지는 노즐 플레이트는 그 위에 유로, 챔버, 액츄에이터 등을 조림하여 프린터 헤드를 구성하고 잉크를 분사하는 경우에 노즐 플레이트의 출구를 통해 흐르는 잉크가 직관상당부분에서 층류를 형성하게 되므로 잉크의 직진운동성이 향상된다. 따라서 잉크방울이 피기록재에 착지하는 위치의 정도 또는 산포가 향상되어 인쇄상태가 향상된다.A nozzle plate having a straight pipe portion of a suitable length at the outlet portion is formed by squeezing a flow path, a chamber, an actuator, and the like on the nozzle head, and when ink is injected, the ink flowing through the outlet of the nozzle plate causes laminar flow in a straight pipe equivalent portion. Because of the formation, the linear movement of the ink is improved. Therefore, the degree or spread of the position where the ink droplets land on the recording material is improved, and the printing state is improved.
노즐 플레이트를 제조하기 위하여 종래에는 전기주조에 의하여 노즐 플레이트를 형성하는 방법과 마이크로펀칭과 연마공정에 의하여 노즐 플레이트를 형성하는 방법을 사용하여 왔다.In order to manufacture the nozzle plate, conventionally, a method of forming a nozzle plate by electroforming and a method of forming a nozzle plate by micropunching and polishing processes have been used.
전기주조(Electroforming)에 의하여 노즐 플레이트를 형성하는 공정은 제1도에 도시한 바와 같다.The process of forming the nozzle plate by electroforming is as shown in FIG.
먼저 기판(10)상에 포토레지스터(12)를 코팅법에 의하여 얇게 도포한다. 도포한 포토레지스터(12)상에 마스크를 위치시키고 노광한 후 현상하여 불필요한 포토레지스터부분을 제거하여 기판에 일정한 패턴을 형성한다.First, the photoresist 12 is applied to the substrate 10 by a thin coating method. A mask is placed on the coated photoresist 12, exposed, and developed to remove unnecessary photoresist portions to form a predetermined pattern on the substrate.
이때 포토레시스터상의 패턴은 일련의 원형으로 하고 그 원의 크기는 형성하고자 하는 노즐의 직경과 사용하고자 하는 노즐 플레이트의 두께의 2배를-합한 값으로 한다.The pattern on the photoresistor is a series of circles and the size of the circle is a sum of twice the diameter of the nozzle to be formed and the thickness of the nozzle plate to be used.
패턴을 형성한 후 패턴이 형성된 기판(10)을 전해액에 넣고 전류를 흘려주면 도금물질이 성장하게 되며, 사용하고자 하는 노즐의 크기만큼 도금물질이 성장하면 도금을 중지한다.After the pattern is formed, the substrate 10 in which the pattern is formed is placed in an electrolyte solution and a current flows to cause a plating material to grow. When the plating material grows to the size of a nozzle to be used, plating is stopped.
이때 도금물질은 포토레지스터가 없는 부분에서는 거의 플레이트의 형상으로 성장하지만 포토레지스터가 남아있는 부분은 전류밀도의 차이로 자연스럽게 원형으로 성장하게 된다.At this time, the plating material is almost grown in the shape of a plate in the part without the photoresist, but the part in which the photoresist remains is naturally grown in a circular shape due to the difference in current density.
도금이 완료되면 기판(10)과 기판에 형성된 포토레지스터(12)를 제거하여 노즐 플레이트(14)를 제조한다.When the plating is completed, the nozzle plate 14 is manufactured by removing the substrate 10 and the photoresist 12 formed on the substrate.
상기와 같이 전기주조에 의하여 노즐 플레이트를 형성하는 방법은 노즐 플레이트를 제조하는 공정이 간단하다는 장점이 있다.As described above, the method of forming the nozzle plate by electroforming has an advantage in that the process of manufacturing the nozzle plate is simple.
그러나 형성된 노즐의 단면형태가 자연스러운 원호의 형태를 가지므로 노즐의 출구부위에 직관부를 형성하는 것이 어렵고, 노즐 플레이트를 프린터 헤드에 접착할 때 프린터 헤드에 접착되는 노즐 플레이트의 면적이 감소하여 접착의 안정성이 낮아지는 문제점이 있다.However, since the cross-sectional shape of the formed nozzle has the shape of a natural arc, it is difficult to form a straight pipe at the outlet of the nozzle, and when bonding the nozzle plate to the print head, the area of the nozzle plate adhered to the print head is reduced, thereby ensuring stability of the adhesion. There is a problem that this is lowered.
다음으로 마이크로 펀칭과 연마공정에 의한 노즐 플레이트의 형성방법은 제2도에 도시한 바와 같다.Next, the method of forming the nozzle plate by the micro-punching and polishing process is as shown in FIG.
노즐 플레이트로 사용할 금속시트(20)와 금속시트에 노즐을 형성하도록 마이크로 펀칭할 금형판(22)을 준비한다.A metal sheet 20 to be used as the nozzle plate and a mold plate 22 to be micropunched to prepare a nozzle on the metal sheet are prepared.
준비한 긍형판(22)위에 금속시트(20)를 얹고 마아크로 펀칭핀(24)으로 드로잉하여 금속시트의 반대면 깊이 이상까지 노즐단면을 형성한다.The metal sheet 20 is placed on the prepared positive plate 22 and drawn with a macro punching pin 24 to form a nozzle section up to the depth of the opposite side of the metal sheet.
드로잉을 한 후 금속시트(20)를 금형판(22)으로부터 분리하여 드로잉에 의하여 금속시트에 돌출된 부분을 연마공정에 의해 제거한다. 연마공정에 의하여 금속시트(20)에 발생하는 거친 표면(burr)은 전해연마나 화학연마에 의하여 제거한다.After drawing, the metal sheet 20 is separated from the mold plate 22, and the portion protruding from the metal sheet by drawing is removed by a polishing process. The burr generated in the metal sheet 20 by the polishing process is removed by electrolytic polishing or chemical polishing.
이 방법은 사용하는 펀칭핀에 따라 노즐의 단면형태를 자유롭게 제작할 수 있고 노즐의 출구부위에 직관부의 형성이 용이하다는 장점이 있다. 또한 노즐 플레이트를 프린터 헤드에 접착하는 경우 접착면적이 넓어 안정성이 높은 장점이 있다.This method has an advantage that the cross-sectional shape of the nozzle can be freely produced according to the punching pin to be used, and the straight pipe portion can be easily formed at the outlet of the nozzle. In addition, when the nozzle plate is adhered to the print head, there is an advantage of high stability due to the large adhesion area.
그러나 마이크로 펀칭을 한 후 돌출된 부분을 제거하기 위하여 연마공정을 거쳐야 하고, 이 연마공정에서 발생하는 거친 표면을 전해연마나 화학연마 등의 연마공정에 의하여 제거하여야 하는 등 가공공정이 복잡하고 대규모의 설비가 필요하다는 문제점이 있다.However, after micro-punching, the grinding process must be performed to remove the protruding part, and the rough surface generated by this polishing process must be removed by electrolytic polishing or chemical polishing. There is a problem that equipment is required.
상기의 문제점을 해결하기 위한 본 발명은 전기주조공정에 의해 원하는 두께 보다 두꺼운 노즐 플레이트를 형성한 후 연마공정에 의하여 원하는 두께를 형성함으로써 공정이 간단하고 대규모의 설비없이 노즐 플레이트의 출구부위에 거의 직관에 가까운 부분을 가지는 노즐 플레이트를 제조하는 방법을 제공하는 것을 목적으로 한다.The present invention for solving the above problems is formed by forming the nozzle plate thicker than the desired thickness by the electroforming process, and then forming the desired thickness by the polishing process, the process is simple and almost straight to the outlet of the nozzle plate without large-scale equipment It is an object to provide a method of manufacturing a nozzle plate having a portion close to.
제1도는 종래의 전기주조에 의한 노즐 플레이트의 성형공정을 도시한 공정도.1 is a process chart showing a forming process of a nozzle plate by conventional electroforming.
제2도는 종래의 마이크로펀칭과 연마공정에 의한 노즐 플레이트의 성형공정을 도시한 공정도.2 is a process chart showing a forming process of a nozzle plate by a conventional micropunching and polishing process.
제3도는 본 발명의 전기주조와 연마공정에 의한 노즐 플레이트의 성형공정을 도시한 공정도.3 is a process chart showing the forming process of the nozzle plate by the electroforming and polishing process of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10,20,30 : 기판 12,32 : 포토레지스터10,20,30: substrate 12,32: photoresistor
14,34 : 노즐 플레이트(도금물질)14,34: nozzle plate (plating material)
22 : 금형판 24 : 마이크로 펀칭핀22: mold plate 24: micro punching pin
상기의 목적을 달성하기 위한 본 발명은 기판에 포토레지스터를 도포하는 단계와; 기판에 도포된 포토레지스터상에 일련의 원형패턴을 형성하는 단계와; 패턴이 형성된 기판 위에 전기주조공정에 의하여 원하는 두께이상의 두께를 가지는 노즐 플레이트를 형성하는 단계와; 형성된 노즐 플레이트에 결합된 기판과 포토레지스트를 제거하는 단계와; 노즐 플레이트를 원하는 두께로 연마하는 단계와; 연마한 노즐 플레이트의 거친 표면을 폴리싱(polishing)공정에 의하여 제거하는 단계를 포함하는 전기주조와 연마공정에 의한 노즐 플레이트의 제조방법에 그 특징이 있다.The present invention for achieving the above object comprises the steps of applying a photoresist to the substrate; Forming a series of circular patterns on the photoresist applied to the substrate; Forming a nozzle plate having a thickness greater than or equal to a desired thickness by an electroforming process on the substrate on which the pattern is formed; Removing the substrate and photoresist coupled to the formed nozzle plate; Polishing the nozzle plate to a desired thickness; The manufacturing method of the nozzle plate by the electroforming and polishing process which includes removing the rough surface of the polished nozzle plate by a polishing process is characteristic.
이하 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.
본 발명에 의하여 노즐 플레이트를 제조하는 공정을 제3도에 도시하였다.The process of manufacturing the nozzle plate according to the present invention is shown in FIG.
먼저 기판에 포토레지스터를 코팅법 등을 사용하여 勢게 도포한다. 기판에 도포된 포토레지스터상에 마스크를 위치시키고 노광한 후 현상하여 포토레지스터중 불필요한 부분을 제거하여 기판에 일정한 패턴을 형성한다.First, a photoresist is applied to the substrate by using a coating method or the like. The mask is placed on a photoresist applied to the substrate, exposed, and developed to remove unnecessary portions of the photoresist to form a predetermined pattern on the substrate.
이때 포토레지스터상의 패턴은 일련의 원형으로 하고 그 원의 크기는 형성하고자 하는 노즐의 직경과 노즐피치에서 허용하는 최대크기로 하는 것이 바람직하다.At this time, it is preferable that the pattern on the photoresist is a series of circles and the size of the circle is the maximum size allowed by the diameter and nozzle pitch of the nozzle to be formed.
포토레지스터상의 패턴을 크게 하는 경우 노즐 플레이트의 일단면에 포함되는 노즐의 수는 종래의 방법에 의해 제조된 노즐 플레이트의 일단면에 포함되는 노즐의 수에 비해 쪄어지지만, 노즐 플레이트 전체를 비교하면 동일한 수의 노즐을 가지게 된다.When the pattern on the photoresist is enlarged, the number of nozzles included in one end face of the nozzle plate is smaller than the number of nozzles included in one end face of the nozzle plate manufactured by the conventional method. You will have the same number of nozzles.
패턴이 형성된 기판을 전해액에 넣고 전류를 흘려주는 전기주조공정에 의하여 기판상에 도금물질이 성장하도쪽 하고, 원하는 노즐의 크기만큼 도금물질이 성장하면 도금을 중지한다.The plating material is grown on the substrate by an electroforming process in which a patterned substrate is placed in an electrolyte and a current flows therebetween, and the plating is stopped when the plating material is grown by a desired nozzle size.
이때 형성되는 노즐 플레이트의 두께는 200㎛ 이상이 되도록 하는 것이 바람직하다.At this time, it is preferable that the thickness of the nozzle plate formed is 200 micrometers or more.
이때 포토레지스터가 남아있는 부분은 전류밀도의 차이로 자연스럽게 원형으로 성장하게 되며, 기판에 형성되는 포토레지스터의 패턴을 크게 함으로써 도금물질은 큰 반경을 가지는 원형으로 성장하게 된다.At this time, the remaining portion of the photoresist naturally grows in a circular shape due to the difference in current density, and by increasing the pattern of the photoresist formed on the substrate, the plating material grows in a circular shape having a large radius.
전기주조공정에 의한 도금이 완료되면 노즐 플레이트에 결합된 기판과 포토레지스트를 제거하여 연마전의 노즐 플레이트를 완성한다.When plating by the electroforming process is completed, the substrate and photoresist bonded to the nozzle plate are removed to complete the nozzle plate before polishing.
상기와 같이 제조된 노즐 플레이트는 원하는 두께로 연마한다. 연마는 래핑(lapping)공정에 의해 원하는 두에로 연마절삭하는 방법을 사용하는 것이 일반적이다.The nozzle plate prepared as above is polished to the desired thickness. Polishing generally uses a method of polishing and cutting to a desired thickness by a lapping process.
이때 연마절삭된 노즐 플레이트의 두께는 30-100㎛로 하는 것이 바람직하며, 일반적으로 사용되는 노즐 플레이트의 두께인 70-80㎛로 하는 것이 특히 바람직하다.At this time, the thickness of the nozzle plate that has been polished and cut is preferably set to 30-100 μm, and particularly preferably 70-80 μm, which is the thickness of the nozzle plate generally used.
연마절삭한 후 연마절삭과정에서 발생한 노즐 플레이트의 거친 표면은 폴리싱(polishing)공정에 의하여 제거하여 노즐 플레이트를 완성한다.After the abrasive cutting, the rough surface of the nozzle plate generated during the abrasive cutting process is removed by a polishing process to complete the nozzle plate.
연마처리 및 폴리싱공정을 거치면서 노즐 플레이트표면의 내식성이 낮아지므로 노즐 플레이트의 표면에 내식성이 있는 금속을 도포하여 노즐 플레이트표면의 내식성을 향상시키는 공정을 추가할 수 있다.Since the corrosion resistance of the surface of the nozzle plate is lowered through the polishing and polishing processes, a process of improving the corrosion resistance of the surface of the nozzle plate may be added by applying a metal having corrosion resistance to the surface of the nozzle plate.
내식성이 있는 금속으로는 금(Au), 은(Ag), 백금(Pt) 등의 귀금속을 사용하는 것이 바람직하며, 이러한 귀금속은 전기주조, 증착(Evaporation), 스퍼터링(Sputtering) 등의 방법을 사용하여 노즐 플레이트의 표면에 박막형태로 도포한다.As the metal having corrosion resistance, it is preferable to use precious metals such as gold (Au), silver (Ag), and platinum (Pt), and such precious metals may be used by electroforming, evaporation, and sputtering. To the surface of the nozzle plate.
이때 형성되는 내식성금속의 막은 0.5㎛ 이상의 두께를 가지도록 하는 것이 바람직하다.At this time, the corrosion-resistant metal film is preferably formed to have a thickness of 0.5㎛ or more.
또한 노즐의 바깥면을 발수처리제를 도포하여 발수처리하는 단계를 추가할 수도 있다. 이때 발수처리제로는 일반적으로 불소수지계의 물질을 사용한다.It is also possible to add a step of applying a water repellent treatment to the outer surface of the nozzle water repellent treatment. In this case, a fluorine resin-based material is generally used as the water repellent treatment agent.
상기의 방법으로 완성된 노즐 플레이트의 출구부의 단면형상은 반경이 큰 원호를 그리기 때문에 완전한 직관부흘 형성하지는 못하지만 상대적으로 곡률이 작은 단면을 형성하므로 잉크흐름에 층류를 형성하는 것이 가능하게 된다.Since the cross-sectional shape of the outlet portion of the nozzle plate completed by the above method draws a circular arc with a large radius, it does not form a perfect straight pipe portion but forms a cross section with a relatively small curvature, thereby making it possible to form a laminar flow in the ink flow.
또한 상기의 방법으로 제조된 노즐 플레이트를 사용하여 프린터 헤드를 제조하는 경우 노즐사이의 평탄한 부위가 넓어 노즐 플레이트의 접착강도가 높아져서 프린터 헤드의 안정성이 향상된다.In addition, when manufacturing the print head using the nozzle plate manufactured by the above method, the flat portion between the nozzles is wide, thereby increasing the adhesive strength of the nozzle plate, thereby improving the stability of the print head.
이하 본 발명을 실시예 및 비교예에 의하여 보다 상세하게 설명한다. 그러나 다음의 실시예는 본 발명을 예시하는 것으로 본 발명의 범위를 한정하는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. The following examples, however, illustrate the invention and do not limit the scope of the invention.
[비교예][Comparative Example]
종래의 전기주조공정에 의하여 직경이 28㎛이고 피치가 423㎛인 노즐을 가지는 두께 0.07mm의 노즐 플레이트를 제조하였다.A nozzle plate having a thickness of 0.07 mm having a nozzle having a diameter of 28 μm and a pitch of 423 μm was manufactured by a conventional electroforming process.
제조된 로즐 플레이트는 매니스커스가 진동하른 노즐 플레이트의 출구부에서 깊이 20㎛인 지점과 노즐의 직경차이가 5.8㎛로서 20% 이상의 직견변화가 발생하였고, 노즐 플레이트 윗면의 노즐간 평탄면거리(d)가 255㎛로서 노즐피치의 60% 수준이었다.In the manufactured nozzle plate, the difference of orthogonal change occurred more than 20% as the difference between the diameter of the nozzle and the nozzle diameter was 5.8 µm at the outlet of the nozzle plate where the meniscus vibrated. ) Was 255 µm, which was 60% of the nozzle pitch.
[실시예]EXAMPLE
본 발명의 방법에 의하여 직경이 28㎛이고 피치가 423㎛인 노즐을 가지는 두께 0.07mm의 노즐 플레이트를 제조하였다.A nozzle plate having a thickness of 0.07 mm having a nozzle having a diameter of 28 μm and a pitch of 423 μm was produced by the method of the present invention.
상기의 노즐 플레이트는 전기주조공정에 의하여 노즐 플레이트의 두께가 200㎛가 될 때까지 도금한 후 래핑과 폴리싱에 의하여 70㎛의 두에를 가진 노즐 플레이트를 완성하였다.The nozzle plate was plated until the thickness of the nozzle plate became 200 μm by the electroforming process, and then a nozzle plate having a thickness of 70 μm was completed by lapping and polishing.
이때 노즐 플레이트의 출구부에서 깊이 20㎛인 지점과 노즐의 직경차이는 2㎛로서 직경변화가 7% 내외이다. 따라서 노즐 플레이트의 출구부위가 직판부에 가까운 형상을 가지는 것을 알 수 있었다.At this time, the diameter difference between the point of 20㎛ depth and the nozzle at the outlet of the nozzle plate is 2㎛, the diameter change is about 7%. Therefore, it turned out that the exit part of a nozzle plate has a shape near a direct plate part.
또한 노즐 플레이트 원면의 노즐간 평탄면거리(D)는 369㎛로서 노즐피치의 8% 수준이어서, 본 발명의 노즐 플레이트를 적용하여 프린터 헤드를 제조하는 경우 동일한 직경, 피치 및 두께를 가지는 비교예의 노즐 플레이트에 비하여 접촉면적이 넓었다.In addition, the flat surface distance (D) between the nozzles on the nozzle plate surface is 369 μm, which is about 8% of the nozzle pitch, so that the nozzle of the comparative example having the same diameter, pitch, and thickness when manufacturing the print head by applying the nozzle plate of the present invention. The contact area was wider than the plate.
상기와 같은 본 발명의 방법께 의하면 복잡한 공정과 대규모의 설비가 없이도 노즐 플레이트의 출구부에 거의 직관에 가까운 부분을 가지는 노즐 플레이트를 제조할 수 있으므로 잉크의 직진운동성이 향상되고 잉크방울의 -착지위치의 정도가 향상되며, 매니스커스가 형성되는 부위의 직경이 작아 매니스커스가 빨리 안정되므로 분사주파수를 높일 순 있는 효과가 있다.According to the method of the present invention as described above, it is possible to manufacture a nozzle plate having a portion almost close to the outlet of the nozzle plate without complicated processes and large-scale equipment, so that the linear movement of the ink is improved and the ink-dropping position of the ink drop. The degree of improvement is improved, and since the diameter of the part where the meniscus is formed is small, the meniscus is stabilized quickly, thereby increasing the injection frequency.
또한 제조된 노즐 플레이트의 노즐사이의 평탄한 부위가 넓으므로 이 노즐 플레이트를 사용하여 프린터 헤드를 제조하는 경우 노즐 플레이트의 접착강도를 높여 접착의 신뢰성 및 프린터 헤드의 안정성을 확보할 수 있다.In addition, since the flat portion between the nozzles of the manufactured nozzle plate is wide, when manufacturing the print head using the nozzle plate, the adhesive strength of the nozzle plate can be increased to ensure the reliability of the adhesion and the stability of the print head.
또한 제조공정이 단순하면서도 마이크로 펀칭 기술에 의해 제작된 노즐 플레이트와 유사한 효과를 낼수 있으므로 노즐 플레이트의 제조비용을 줄일 수 있는 효과가 있다.In addition, since the manufacturing process is simple and can produce a similar effect to the nozzle plate produced by the micro punching technology, there is an effect that can reduce the manufacturing cost of the nozzle plate.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980060602A KR100307781B1 (en) | 1998-12-30 | 1998-12-30 | Manufacturing method of nozzle plate by electric casting and polishing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980060602A KR100307781B1 (en) | 1998-12-30 | 1998-12-30 | Manufacturing method of nozzle plate by electric casting and polishing process |
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| Publication Number | Publication Date |
|---|---|
| KR20000044119A KR20000044119A (en) | 2000-07-15 |
| KR100307781B1 true KR100307781B1 (en) | 2001-12-28 |
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| KR1019980060602A KR100307781B1 (en) | 1998-12-30 | 1998-12-30 | Manufacturing method of nozzle plate by electric casting and polishing process |
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