MXPA98009139A - Multiple layer flow regulator electroform - Google Patents

Abstract

The present invention relates to a fluid flow regulator, characterized in that it comprises: at least one inlet receiving a fluid, at least one expulsion orifice that expels the fluid, and an intermediate turbulence-inducing channel between at least one inlet port and at least one fluid ejection port, which transports non-linearly the fluid in a direction of fluid flow from at least one inlet orifice to at least one fluid ejection orifice, the intermediate channel being turbulence by a space between the first and second electroformed layers, wherein the second layer is electroformed on the first layer or the first layer is electroformed on the second layer, and wherein the second layer is selectively elastically movable relative to the first layer between at least two positions an open position in which the second layer is separated from the first layer to define the intermediate channel it gave turbulence inductor and allowing the flow of fluid through this, and a closed position in which the second layer makes contact with at least a portion of the first layer to occupy the space and prohibit the flow of the fluid.

Description

-. * MULTIPLE LAYER FLOW REGULATOR ELECTROFORMED FIELD OF THE INVENTION This invention relates to a flow regulator that incorporates turbulence generation with upward direction and force generating means for controlling fluid flow. The flow regulators of the fluid according to this The invention includes, but is not limited to, spray directors (e.g., fuel injector nozzles), check valves, flow control regulators, and the like. The invention also relates to a method for manufacture a flow regulator that uses a multi-layer resistance process in conjunction with an e-lactro multi-layer formation process.

BACKGROUND OF THE INVENTION Flow regulators with small precision holes are used in numerous industrial applications, including, for example, fuel injectors in automotive engines of REF: 28491 internal combustion and rocket motors, thermal inkjet print heads, and similar services that require the precise measurement of a fluid. Conventional methods for manufacturing flow regulators include casting a mold, machining, and electroplating. In addition, these methods may require a finishing step for the production of the final product. The electroplating methods for manufacturing the flow regulators employ various combinations of dry and liquid resistances and etching. Such methods are limited, however, in that the maximum thickness of the electro-formed layer achievable is about 200 microns. The methods of the prior art for the manufacture of flow regulators have generally suffered from a lack of precision in the generation of the orifice. Heretofore, such methods have comprised the joining of discrete components to form flow regulators. For example, William P. Richardson, Michigan, Technological University Master's Thesis "The Influence of Upstream Flow Conditions on the Atomizing Performance of a Low Pressure Fuel Injector" (1991), describes nozzles produced by a silicon micromachining process (SMM). In this process, the orifice configuration is provided by the acid etching by silicon. U.S. Patent No. 4,586,225 to Fakler et al., Refers to a method for manufacturing a small orifice fuel injector that utilizes a wax and silver technique, followed by post-finishing. A first layer of nickel is electrodeposited on a stainless steel base plate, in which fuel feed passages are formed. Holes for connection to the perforations are made through a nickel layer of front plate. The plastic mandrels are manufactured having legs with support sections, sections forming holes and coupling tongues for joining the legs together. The support sections of the mandrels are fitted into the acceptor holes formed in the center plate and a bonded layer of rigid material is constituted by electrodeposition to enclose the orifice forming sections. The sections of the mandrels extending out of the bonded layer are removed from the surface that is finished in a manner. U.S. Patent No. 4,246,076 to Gardner, refers to a multi-layer dry film plating method for the manufacture of inkjet printer nozzles. The process comprises the steps of coating a first layer of a photopolymerizable material on a substrate, and exposing the layer to a radiation pattern until at least a portion of the photopolymerizable layer is polymerized. A free surface of the first layer is covered by a second layer of a photopolymerizable material, the process being analogous to the process associated with the deposition of the first layer. Both layers are developed to remove the unpolymerized material from the substrate, followed by metal deposition on the substrate, by electroplating. U.S. Patent No. 4,229,265 to Kenworthy discloses a thick, dry film resistant plating technique for making an orifice plate for a jet drop recorder. A stainless steel sheet is coated on both sides with a photoprotection material. The photoprotection material is then exposed through suitable masks and developed or developed to form areas of photoprotection legs, cylindrical on both sides of the sheet. The nickel is then veneered on the sheet until the height of the sheet covers the edges of the legs. A larger diameter photo-protection plug is then formed on each photoprotection leg. The nickel plating is then continued until the height is level with the plug. The photoprotection and the plate are then dissolved and detached from the nickel forming two plates of homogeneous orifices, solids. U.S. Patent No. 4,675,083 to Bearss et al. Relates to a method for manufacturing metal nozzle plates associated with an ink jet print head by the use of a two-step plating and coating process. The method comprises the steps of providing a first mask or masking on a metal substrate including a first plurality of masking segments and providing a masking, including a second plurality of segments formed in the upper part of the first plurality of segments. This structure is then transferred to an electroforming station where a nickel layer is formed on exposed surfaces to a thickness of up to approximately 63.5 microns (2.5 mils). Once the plate is completed to a desired thickness, the photoprotection masking segments, negative and positive, are removed using conventional photoprotection lifting processes. U.S. Patent No. 4,954,225 to Bakewell, refers to a method for electroforming nozzle plates which have three-dimensional characteristics. The method employs a dry film on the liquid, and a thick film photoprotection. A conductive coating is applied to a surface of a transparent mandrel using photolithographic techniques. A pattern of thin, circular masked areas of a non-conductive transparent material is formed over each hole formed in the opaque conductive coating. A first metal layer is plated on the conductive coating on the transparent mandrel. A layer of the second metal is plated on the first metal layer until the first layer of the second metal surrounds, but does not cover, the photoprotection posts. The depressions caused in the metal layers are filled with fillers to create a smooth continuous surface on top of the sheet metal layers. A thick layer of photoprotection is then applied over the top of the smooth plated layers and cured to form a pattern of photoprotection discs, thick covering and registration with full depressions. The plated layers are then separated after the transparent mandrel and the foreign material is removed using proper disposal techniques. U.S. Patent No. 4,839,001 to Bakewell, refers to a method of manufacturing an orifice plate using a thin film photoresist in which the plate is constructed from two electroformed layers of nickel. A first nickel layer is electroformed on a conductive mandrel to form a support layer with a selected hole pattern. The copper is plated over the nickel to cover the holes. A second layer of nickel is electroformed on the surface that is attached to the mandrel, in such a manner as to form a layer of holes with a pattern of small holes of selected cross section in alignment with the pattern of holes in the first layer of nickel . The copper is then etched to reveal an orifice plate, thin, nickel. U.S. Patent No. 4,716,423 to Chan et al. Refers to a process that employs the application of a first liquid and then a dry film for the manufacture of an integrated orifice plate. The process consists of the formation of a first masking portion having a convergingly contoured outer surface and a second masking portion having straight vertical walls. A first metallic layer is electroformed around the first masking portion to define a layer of the orifice plate, and the electroforming of the second metallic layer is performed around the second masking portion, to define a barrier layer of the portions of discontinuous wall and with recesses having one or more cavities for ink deposit. Finally, the first and second masks, and the selected portions of the metal substrate, are removed, whereby the first and second metal layers are left intact in a composite configuration. U.S. Patent No. 4,902,386 a Herbert et al. Refers to a cylindrical electroforming mandrel and a thick-film photo-protection method for manufacturing and using same. U.S. Patent No. 5,167,776 to Bhaskar et al. Discloses an orifice or nozzle plate for an ink jet printer that can be produced by a process comprising the provision of electroplating over the conductive regions and over a portion of the insulating regions of a mandrel to form a first electroformed layer having converging hole openings corresponding to the insulating regions. The electroplating process can be repeated once to form a second electroformed layer on the first electroformed layer, and the second layer having converging hole openings aligned with those of the first layer.

US Patent No. 4,972,204 to Sexton, discloses an orifice plate for an ink jet printer produced by a multilayer electroforming process comprising the steps of forming protective layer legs on a substrate, and electroplating on said substrate of a first metallic layer complementary to the layers of the protective layer, allowing the metal to protrude slightly from the upper surface of the legs of the protective layer and form a first electroformed layer. A first protective layer in the form of a channel wider than the legs of the protective layer is placed on the protective layers and the first electroformed layer. A second electroformed layer is formed around the first protective layer and on the first electroformed layer. A series of protective layers of increasing width and electroformed layers of decreasing width are subsequently placed in layers on the incipient orifice plate, in a similar manner to eventually form a plate of holes that lines openings that open towards a channel that it progressively widens upstream of the holes.

Copending US Patent Application No. 08 / 371,118, filed January 11, 1995, describes spray directors that disperse multi-layer fluids, incorporating the structure that produces upstream turbulence generation, and protective layer processes of multiple layers to produce such spray directors. Fluid regulators of the prior art have been known to suffer from the drawbacks of downstream "dead space" or "bag volume" during periods of inactivity. When the flow of fluid through such flow regulators is stopped, the residual fluid remains within the cavities of the flow regulators. This residual fluid can leak from the flow regulators at inopportune times, thus causing various problems. For example, prior art motor fuel injectors have suffered from fuel leakage during the non-injection part of the engine cycle, leading for example to decreased efficiency and increased emission of hydrocarbon contaminants.

Another known problem that is related to the residual fluid that is retained in the dead space of flow regulators of the prior art, which has non-zero bag volume, has been the tendency of certain residual fluids to plug the flow regulators when they are retained within the dead space for a sufficient amount of time to coagulate. The above references are incorporated herein by reference in their totals.

BRIEF DESCRIPTION OF THE INVENTION The embodiments of the present invention are directed to a multi-layer flow regulator incorporating the generating structure of upstream turbulence generation, for control of fluid distribution and droplet size, and the force generating means for selectively constraining at least a portion of the fluid flow path to eliminate dead space and providing a bag volume flow regulator equal to zero (or close to zero). The path or path of the fluid in the turbulence generation channel is defined by a space between the first and second multi-layer regulator layers. The second layer is elastically movable relative to the first layer and can assume at least two positions: an open position in which the second layer is separated from the first layer to define an intermediate turbulence inducing channel and allow the flow of the fluid to through this one, and a closed position in which the second layer contacts at least a portion of the first layer to occupy at least a portion of the space that otherwise defines the intermediate channel and prevents fluid flow. In certain embodiments, the second The layer may also assume an intermediate or constricted position in which the second layer moves towards the first layer to constrict the turbulence-inducing intermediate channel and reduce, but not stop, a quantity of fluid flow therethrough. The force generating means selectively applies a force to the second layer to move it between the positions to selectively constrain and / or close the fluid flow path. The methods for manufacturing a flow regulator as described above are also described. One method provides the manufacture of a flow regulator that uses a protective, multi-layered process in conjunction with a multilayer electroforming process. A protective pattern complementary to a cross-sectional pattern of the flow regulator is applied to a conductive substrate, followed by the electroforming of a patterned layer on the substrate. The protection application process and the electroforming process are repeated at least once to produce an electroformed, multi-layered flow regulator. A resulting structure of the flow regulator includes multiple electroformed layers, in which at least one fluid inlet orifice is formed in at least one upper (or base) layer of the multiple electroformed layers, at least one fluid ejecting orifice. in the form of a base layer (or greater) of the multiple electroformed layers, and a turbulence inducing channel connects at least one inlet orifice with at least one ejection orifice. The turbulence inducing channel is structured such that it causes the direction of the fluid entering through at least one inlet orifice, to change before being expelled from at least one ejection orifice. That is, the turbulence inducing channel transports fluid from at least one inlet orifice to at least one ejection orifice in a non-linear manner. According to a preferred embodiment, a plurality of inlet orifices and one ejection orifice are laterally displaced from each other (for example, displaced in a direction perpendicular to the direction in which the central axes of the inlet and ejection orifices extend), and the turbulence inducing channel extends in the direction perpendicular to the axis of the orifices. Thus, in this embodiment, the fluid enters the inlet orifices flowing in a direction parallel to the axes of the inlet orifices, enters the turbulence-inducing channel where the flow direction changes by approximately 90 °, flows through of the turbulence inducing channel towards the ejection orifice, and changes direction again by approximately 90 ° after being expelled through the ejection orifice. This type of flow path creates turbulence in the fluid, which improves atomization and spray distribution of the ejected fluid. The force generating means may be coupled to the top layer by any suitable means, including, but not limited to, laser welding, welding, diffusion bonding, or adhesive bonding. Other features and advantages of the embodiments of the present invention will become more fully apparent from the following detailed description of the preferred embodiments, the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in conjunction with the following drawings in which like reference numerals designate similar elements and wherein: FIGURES 1A to ID are cross-sectional views illustrating certain stages of the production of a flow regulator having a turbulence inducing fluid path, according to one embodiment of the invention; FIGURE 2A is a front view of the production of a regulator, according to one embodiment of the invention.

FIGURE 2B is a cross-sectional view through line 2B-2B of FIGURE 2A; FIGURES 3A-3C are cross-sectional views through one embodiment of the invention in different states of fluid flow. FIGURE 3A shows an open flow state. FIGURE 3B shows a partially constricted flow state. FIGURE 3C shows a fully constricted flow state (eg, closed or no flow).

DESCRIPTION DETAIL OF THE PREFERRED MODALITIES A method according to the invention provides the electroforming of multiple layers of metal, with each layer in the range of about 0.025 mm to about 0.250 mm in thickness. The method produces smooth, flat surfaces without requiring any additional finishing step. No abrasion, grinding, forming, or machining is necessary to obtain smoothness and planarity. This does not mean that smoothness and planarity are not advantageous or not achievable with the invention, but rather that the part can be produced so that the lack of smoothness and planarity is not an impediment in operation, since each layer is a true replica of the previous layer. Any non-conformation is automatically compensated. The method produces a flow regulator with orifice dimensions and fluid path characteristics, desirable for applications that require accurate measurement of a fluid, such as, for example, a fuel injection nozzle. The turbulence inducing channel improves the atomization and fluid distribution of the expelled fluid, which is particularly advantageous for fuel injection nozzles. The invention, however, is not limited to fuel injection nozzles. The invention can also be used, for example, in paint spray applications, cosmetic spray applications, domestic or industrial cleaning agent dispensing applications, or any other applications in which control of fluid atomization and spray pattern is desired. The invention is also suitable for use as a check valve and use in applications in which the removal of bag volume is desired. For applications where fluid atomization is not a problem, the turbulence inducing intermediate channel does not need to be included in the flow regulator. A protective layer pattern, which is complementary to a desired cross section of the flow regulator, is prepared for the electroforming process with an appropriate photo-tool design. Photo-tool designs are commonly used in the art.

For example, the drawing of a line by nature of a design for a flow regulator cross-section is performed on a piece of paper, such that the dark lines correspond to the desired final design to be printed. The lines are separated by areas that do not carry an image. A positive or negative photo-tool of the original artistic work is prepared using conventional photographic processes. The photo-tool for a negative protective layer has clear lines corresponding to the lines of the original artwork and darkened areas corresponding to the areas between the lines. As is known to those skilled in the art, a photo-tool used for a positive protective layer could have these areas inverted, for example, the lines could be dark and the areas between the lines could be clear. A conductive substrate is first cleaned by methods well known to those of skill in the art to prepare it for the application of a protective layer pattern. The sequence of cleaning steps may include washing with isopropyl alcohol, degreasing with steam in trichlorethylene, electrolysis, rinsing in distilled water, washing in nitric acid, and final rinsing in distilled water. Typical substrates materials include stainless steel, chromium or nickel plated steel, copper, titanium, aluminum, chrome-plated or nickel-plated aluminum, titanium and palladium alloys, nickel-copper alloys such as Inconel® 600 and Invar® (available from Inco, Houston, TX), and the like. Non-metallic substrates can also be used if they have been made conductive, for example, by being properly metallized using known mentalization techniques, such as non-electrolytic mentalization, vapor deposition, and the like. The substrate can be in any appropriate form. For example, if it is cylindrical, the surface of the substrate may be substantially parallel to the axis of the substrate. The protective materials may include various types of liquid protective layers. As is well known, these protective materials can be classified as either positive, such as Microposit® or Photoposit®, obtainable from Shipley, Inc. (Newton, MA) or negative, such as the Waycoat protective layers obtainable from OCG Microelectronics, Inc. (Saddle Brook, NJ; Tempe, AZ). These liquid protective layers are either processable in water or processable in solvent, in commonly used organic solvents such as benzene, dichloromethane, trichloroethane, and the like. Positive protective materials include solvent processable protective layers containing 2-ethoxyethyl acetate, n-butyl acetate, xylene, o-chlorotoluene, toluene, mixtures of novolac resins, and photoactive compounds. Negative protective materials include solvent-processable protective layers containing cyclised polyisoprene and di-azido type photoinitiators. In the case of a negative protective layer, for example, the photo-tool is tightly secured to the surface of the substrate coated with the protective layer. For example, the substrate is irradiated with actinic radiation at an energy level of approximately 100 mJ / cm2 to 2,000 mJ / cm2. The photo-tool is removed by leaving portions of the protective layer that were exposed to the ultraviolet radiation to be polymerized, and portions of the protective layer that were not irradiated in a semi-solid form. The protective layer is developed or developed on the substrate with conventional development equipment and chemistry. Those portions of the protective layer that were not irradiated are washed in the development process, leaving only the polymerized portions remaining on the surface of the substrate. In the case of positive protective layer systems, the irradiated areas are washed and the non-irradiated areas remain after the development process. Throughout the figures, similar numbers represent similar parts. As described in FIGURES IA and IB, a first pattern layer 3 is electroformed onto the substrate 1 leaving a first pattern 2 of protective layer. The shapes of the first pattern layer 3 and the first pattern 2 of the protective layer can be selected from any shapes that produce a desired effect on the fluid flow, the particle size of the fluid and / or the directionality of the fluid spray. Exemplary forms include those that are circular, oblong, ovoid, toroid, cylindrical, polygonal, triangular, rectangular, square, regular, and irregular.

The process of elect rformation takes place within an electroforming zone comprising an anode, a cathode, and an electroforming bath. The bath may be composed of: ions or ion salts of the layer-forming material in the standard, the concentration of which may be in the range of traces to saturation, where the ions may be in the form of anions or cations; a solvent, a buffering agent, the concentration of which may be in the range of zero to saturation; an anode corrosion agent, the concentration of which may be in the range of zero to saturation; and, optionally, grain refiners, levellers, catalysts, surfactants, and other additives known in the art. Preferred concentration ranges can be established by those of skill in the art without undue experimentation. A preferred electrophoretic bath for nickel plating (eg, as the first layer in pattern 3) on a substrate, comprises about 80 mg / ml of nickel ion in solution, about 20-40 mg / ml of H3B03, about 3.0 mg / ml. ml of NiCl2 # 6H20 and approximately 2.5-6.0 ml / liter of sodium lauryl sulphate. Other suitable electroforming bath compositions include, but are not limited to, Watts nickel: about 68-88 mg / ml nickel ion, about 50-70 mg / ml NiCl2"6H20, and about 20-40 mg / ml H3B03; chloride sulfate: approximately 70-100 mg / ml of nickel ion, approximately 145-170 mg / ml of NiCl2 «6H20 and approximately 30-45 mg / ml of H3B03; and concentrated sulfamate: about 100-120 mg / ml of nickel ion, about 3-10 mg / ml of NiCl2 »6H20 and about 30-45 mg / ml of H3B03. Non-electrolytic baths such as non-electrolytic nickel baths may also be employed. Various types are available, depending on the properties referred to in the deposition of electroforming. These non-electrolytic baths are well known to those skilled in the art. Examples of metals that can be electroformed on the surface of a substrate include, but are not limited to, nickel, copper, ero, silver, palladium, tin, lead, chromium, zinc, cobalt, iron, and alloys thereof. The preferred metals are nickel and copper.

Any suitable conductor or material that can be electrochemically deposited can also be used, such as conductive polymers, plastics, and non-electrolytic nickel deposits. Examples of suitable non-electrolytic nickel deposits, autocatalytic, include, but are not limited to, nickel-phosphorus, nickel-boron, polyaccharides, such as copper-nickel-phos, nickel-polytetrafluoroethylene, composite coatings, and the like. . The methods of preparing non-electrolytic nickel deposits employed within the scope of this invention are well known to those skilled in the electroforming art. The electrolytic bath is energized using a suitable electrical source. The ions forming patterned layers from the solution are electroformed onto the exposed conductive surfaces of the substrate 1, determined by the pattern of the polymerized protective layer 2. Those portions of the substrate covered with the protective layer, remain unplated. The process is allowed to proceed until a first patterned layer 3 has been deposited on the exposed surface of the substrate 1 to a desired thickness in the range of about 0.010 mm to about 0.400 mm, and preferably in the range of about 0.020 mm to about 0.200 mm. As described in the figures, this thickness can exceed the thickness of the first protective layer pattern 2, producing over-developed geometry. In a layer having this geometry, the electroplated material translates the edges of the first pattern 2 of the protective layer to partially define a non-linear fluid flow path. This type of structure occurs when the resistant layer material is a liquid resistant layer and / or the first pattern 2 of the resist layer is thin relative to the first in pattern 3. The thickness of the first layer in pattern 2 must be 0.002 mm to 0.300 mm, preferably 0.005 mm to 0.250 mm, and more preferably 0.040 mm to 0.200 mm. Resistant layer materials that can be employed to form the overgrowth geometry include, but are not limited to, those liquid protective layers typically containing 2-ethoxyethyl acetate, n-butyl acetate, xylene, o-chlorotoluene, toluene, and photoactive compounds and mixtures of photoactive compounds. Examples of photoactive compounds include, but are not limited to, diazo based compounds or diazodi based compounds. FIGURES IC and ID describe another cycle of application of protective layer and electroplating. FIGURE ID describes an electroformed, multi-layer flow regulator after removal of the protective layer patterns. A second pattern 4 of protective layer is provided on top of the first pattern 2 of the protective layer and on the part of the first layer 3 in pattern. A metallic layer (not shown) is coated on top of the second pattern 4 of protective layer, to enable electroforming to take place on the second pattern 4 of non-conductive protective layer. The metal layer can also coat the first layer in pattern 3. The metal layer can be applied by any of the numerous mentalization techniques known to those of ordinary skill in the art, such as, for example, Evaporative Physical Vapor Deposition (PVD). ), PVD by sputtering and autocatalytic non-electrolyte deposition. Suitable components of the metal layer include, but are not limited to gold, silver, nickel, palladium, titanium, iron, copper, aluminum and chromium. The thickness of the metal layer should be 0.00001 mm to 0.020 mm, preferably 0.00005 mm to 0.005 mm. The electrolytic bath is energized and the ions forming the standard layer coming from the solution are electroformed on the metal layer in a pattern complementary to the second pattern of protective layer. The process is continued until a second patterned layer 5 is deposited on the metal layer to a desired thickness in the range of about 0.050 mm to about 0.300 mm, and preferably in the range of about 0.075 mm to about 0.250 mm. The range of thickness suitable for the second pattern 4 of the protective layer is from about 0.10 mm to about 0.250 mm, and preferably from about 0.050 mm to about 0.150 mm. The shapes of the second layer in pattern 5 and in the second pattern of protective layer 4 may be in any suitable form that produces a desired effect on fluid flow, the size of the fluid particle and / or the directionality of the fluid spray. . Exemplary forms include those that are circular, oblong, ovoid, toroid, cylindrical, polygonal, triangular, rectangular, square, regular, and irregular. After the desired multi-layer thickness is electroformed on the surface of the substrate 1, the substrate is removed from the solution. The multi-layer electroformed pattern can be removed from the surface of the substrate by standard methods including, but not limited to, mechanical separation, thermal shock, mandrel dissolution, and the like. These methods are well known to those of experience in the technique of alectroformation. The protective layer patterns and any metallic layer present in the flow path are preferably removed before removal of the substrate, in order to minimize the handling of the parts. The patterns of the protective layer can be removed by any suitable method known in the art. Such methods include washing the substrate in acetone or dichloromethane for the solvent-processable protective layers, or mixtures of ethanolamine and glycol ethers for water-processable protective layers. Other suitable methods for removal of the photoprotective layer are known in the art and are typically provided by the suppliers of foprotective material. Any metallic layer present in the flow path can be eliminated by any suitable method known in the art., and is preferably removed together with the protective layer standards in the above-described methods of removal of protective layer patterns. In multi-layer structures, a post-substrate removal cleaning step is usually necessary. Typically, this step can be carried out by tapping the parts for example in acetone, dichloromethane, or mixtures of ethanolamine and glycol esters. Although FIGURES IA and ID describe embodiments in which the pattern of protective layer and pattern layer defining the ejection orifice are the first applications to the substrate, those of ordinary skill in the art will readily appreciate that the process can be reversed, such that the resistant layer patterns and the pattern layer defining the entry holes could be the first applications to the substrate (for example, the base layer), and the protective layer pattern and the pattern layer that defines the orifice Ejecting could be the latest applications to the nascent flow regulator (for example, the top layer). An example of such alternative embodiment comprises: the application on a conductive substrate, of a first protective layer pattern having a shape corresponding to a shape of at least one inlet orifice; the electroforming on the conductive substrate of a first layer in a pattern complementary to the first pattern of protective layer; the application on a first surface defined by the first pattern layer and the first pattern of protective layer, of a second pattern of protective layer having a shape corresponding to a shape of an intermediate channel; the electroforming on the first surface of a second layer in a pattern complementary to the second pattern of protective layer; the application of a metallic layer on a second surface defined by the second pattern of protective layer and the second layer in pattern; the application on the metallic layer of a third pattern of protective layer having a shape corresponding to the shape of an ejection orifice; the electroforming on the metallic layer of a third layer in pattern, complementary to the third pattern of protective layer, to provide an electroformed pattern of multiple layers; the removal of the protective layer patterns and a portion of the metallic layer located in a non-linear fluid path from the multi-layer electroformed pattern; and the removal of the multi-layered electroformed pattern from the substrate, to provide a flow regulator. As illustrated in FIGURES 3A-3C. the force generator means 6 can be applied to the flow regulator, before or after removal of the substrate 1, with the latter being the preferred method. The force generating means 6 can be coupled directly or indirectly to the elastically movable layer 5, for example, by means of a post 7, to be able to selectively generate the force along the axis F. The force generating means 6 it can be coupled to the elastically movable layer 5 by any suitable means, including, but not limited to, laser welding, welding, diffusion bonding and adhesive bonding.

With diffusion bonding (not shown), a layer of material having a melting point lower than the material of the elastically movable layer 5 can be applied to the elastically mobile layer in a sufficient thickness to the diffusion bond for an appropriate pole or structure that engages or is engageable with the force generating means. The thickness of the lower melting material layer can be, for example, from about 0.020 mm to 0.075 mm. If, for example, the material of the elastically mobile layer 5 is nickel, then the lowest melting point diffusion bond layer could be, for example, copper, zinc or tin. Diffusion bonding is a preferred method of coupling the force generating means to the elastically movable layer 5, since the lower melting point material for diffusion bonding can be electrodeposited during the formation of the electroformed layers, facilitating the mass production of the invention. FIGURES 2A-2B describe a mode of a flow regulator 20, after the substrate and the foprotective material have been removed.

In the open state of FIGS. 2A, 2B and 3A, a fluid to be dispersed flows to the fluid dispersing flow regulator 20, through 4 inlet holes 11 and into an intermediate channel 10. An internal surface of the first layer in pattern 3 interrupts the linear flow of the fluid, forcing the fluid to undergo a transition of the fluid path, angular, inducing turbulence, before leaving the intermediate channel 10 and spraying through the ejection orifice 9 of fluid. In the illustrated embodiment, the channel 10 extends in a direction substantially perpendicular to the axes defined by the entry holes 11 and the ejection orifice 9. In FIGURES 3A-3C, the force generating means 6 can be used to apply a force to the second electroformed layer 5 to deflect an annular portion of the second electroformed layer 5, towards the first electroformed layer 3, whereby the intermediate channel 10 is selectively constrained (FIGURE 3B) and / or (FIGURE 3C) to reduce and / stopping the flow of fluid from the inlet orifices 11 through the ejection orifice 9.

The suitable force generator means 6 may include a mechanical device, such as a spring and / or an electromechanical device, such as a solenoid or piezoelectric device. These devices may be employed alone, or in conjunction with other force generators, such as fluid and / or vapor pressure, forward and / or backward, associated with the fluid and / or vapor that is passed through. of the fluid flow regulator. Alternatively, the non-mechanical, force-generating means above can be employed independently of the force-generating mechanical means to selectively close the flow generator, for example, in a fluid flow check valve. The force generating means 6, such as for example a solenoid or piezoelectric device, can be attached to the second electroformed layer 5 (or "seal") and used to selectively close the well-defined annular ring, creating a fluid seal of bag volume equal to zero (or close to zero). For example, in a fuel injector according to the invention, when fuel is needed, the solenoid or piezoelectric device or equivalent is operated to restore a defined opening that can be controlled through a feedback loop. The shutdown or stopping of the fuel is at a point of emission, which results in no leakage of residual fuel during the non-injection part of the cycle. This also has the advantage of creating a spray nozzle that does not clog, since the seal is at the point of emission, which is especially useful for the regulation of coagulable fluids. These and other modalities can also be used as a check valve, for example, by applying a spring (not illustrated) to the second electroformed layer 5. The spring is used to close the well-defined annular ring to create a bag volume seal equal to zero (or close to zero). When the pressure of the fluid or vapor exceeds a predetermined force exerted by the spring, the check valve opens to allow fluid and / or steam to flow. A similar configuration can also be used to prevent the reflux of the fluid (e.g., reverse flow). The embodiments as described in Figures 2A and 2B can also be modified by applying a mechanical actuator to the second electroformed layer 5. A solenoid or piezoelectric device can be fixed to the upper layer, for example, by laser welding, welding, diffusion bonding or adhesive bonding, and used to close the well-defined annular ring, creating a bag volume seal essentially equal to zero. When flow is needed, the solenoid or equivalent is driven for a given displacement, creating a controlled opening through a loop or feedback loop to maintain a constant flow rate or constant pressure. A major advantage provided by the invention is that all critical interface parts can be defined and constructed as an integral unit, thereby saving substantial costs in the tools and in the voltage. In addition, the replication of the preceding layer by the subsequent layer ensures good fit, and automatically compensates for any structural non-uniformity. The flow regulator prepared according to the invention can have a range of transverse diameters and thicknesses. For example, the fluid ejection orifices of a flow regulator can have a minimum transverse dimension of about 0.050 mm to about 0.500 mm, preferably about 0.100 mm to about 0.300 mm. The dimensions of the orifice 9 of the fluid ejection are guided by the fluid flow requirements, and vary widely depending on the application and the pressure drop requirement through the flow regulator. These dimensions can be determined by someone of ordinary skill in the art without undue experimentation. The dimensions of the photoprotection layer on the substrate and the electroformed layers, and the electroforming time, determine the dimensions of the flow regulator. The thickness of the multiple layers of the flow regulator should be approximately 0.075 mm to approximately 0.550 mm. A preferred thickness is in the range of about 0.125 mm to about 0.460 mm. Variations of these exemplary ranges can easily be made by those of skill in the art.

More than one fluid ejection orifice 9 can be provided in each flow regulator 20. An inlet orifice 11 can be provided in each flow regulator 20. Alternatively, two, three, four can be provided (as in FIGS. 2A). and 2B) or more inlet ports 11 and / or fluid ejection holes 9 in each flow regulator 20. The number of patterned layers in a flow regulator is not limited to two (as in FIGS. 2A and 2B) . More than two patterned layers may be provided, for example, to facilitate the formation of more intricate cavities, holes, flow paths, and the like. For example, additional layers may be provided to facilitate the formation of notches or channels, fins or ribs on the low running wall of the intermediate channel, and the structures further impact fluid flow. The axes of the inlet and ejection holes need not be parallel, nor perpendicular to the intermediate channel, as long as sufficient turbulence is generated in the fluid for the modes in which good dispersion of the fluid spray is desirable.

A plurality of flow regulators can be manufactured simultaneously on a single substrate. To allow all parts to be removed from the substrate as a continuous sheet and to facilitate the handling of the array, thin coupling strips can be electroformed to fix the final electrophoretic layer of each flow regulator pattern to at least one of the other patterns. Flow regulator. The distance between flow regulators in the array pattern can vary widely, with the goal being to minimize space. The flow regulators prepared according to the invention can be used in applications that require flow regulators with precision holes, such as the precise measurement of a fluid. Such uses include, but are not limited to, fuel injector nozzles for use in internal combustion engines, print nozzles for thermal inkjet printing, drop-on-demand printing and piezoelectric printing; spray applications, including epoxy sprays, paint sprays, adhesive sprays, cosmetic sprays, household or industrial cleaning sprays and solder paste sprays, or any other applications in which fluid atomization and spray pattern control are desired; and check valves. For example, a fuel regulator according to the invention can be replaced by a conventional fuel injection nozzle in an otherwise conventional internal combustion engine, thereby making such an engine more fuel efficient and less polluting by decreasing or eliminating the leakage of residual fuel during the non-injection part of the engine cycle. The fuel injection control system of the engine can be adapted to use at least one fuel injection nozzle according to the invention, to regulate the flow of fuel from the fuel supply lines to the combustion chambers. For example, the flow of fuel through the fuel injection nozzle can be regulated by having the computer control of the engine, the magnitude and / or the direction of the force generated by the force generating means, to constrict and / or selectively close the fuel injection nozzle. While the invention has been described in detail and with reference to the specific embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes and modifications may be made therein without departing from the spirit and scope of the present invention. .

It is noted that in relation to this date, the improved The method known to the applicant for carrying out the said invention is that which is clear from the present description of the invention.

Having described the invention as above, property is claimed as contained in the following:

Claims (22)

1. A fluid flow regulator, characterized in that it comprises: at least one inlet opening that receives a fluid, at least one expulsion orifice that expels the fluid; and an intermediate turbulence-inducing channel between at least one inlet and at least one fluid ejection port, which non-linearly transports the fluid in a fluid flow direction from at least one inlet orifice to at least one inlet orifice. ejection of fluid, the turbulence inducing intermediate channel being defined by a space between the first and second electroformed layers, wherein the second layer is electroformed on the first layer or the first layer is electroformed on the second layer, and wherein the second layer is layer is selectively elastically movable relative to the first layer between at least two positions an open position in which the second layer is separated from the first layer to define the turbulence inducing intermediate channel and allow fluid flow therethrough, and a closed position in which the second layer makes contact with at least a portion of the first layer to occupy the spacing and prohibit the flow of fluid.

2. The fluid flow regulator according to claim 1, characterized in that the turbulence inducing intermediate channel is further defined by an upstream wall and a downstream wall, the upstream wall is penetrated by at least one entry orifice, and the downstream wall is penetrated by at least one fluid ejection orifice, a central axis of at least one inlet orifice and a central axis of at least one fluid expelling orifice that is non-collinear.

3. The fluid flow regulator according to claim 1, characterized in that the turbulence inducing intermediate channel has a circular cross section.

4. The fluid flow regulator according to claim 1, characterized in that the regulator has a plurality of inlet orifices and a selective fluid ejection orifice.

5. The fluid flow regulator according to claim 4, characterized in that the regulator has four inlet openings.

6. The fluid flow regulator according to claim 1, characterized in that the turbulence inducing intermediate channel has an axis extending in a direction substantially perpendicular to a central axis of at least one of the at least one fluid ejection orifice and at least one of an entrance hole.

7. The fluid flow regulator according to claim 1, characterized in that at least one fluid ejection orifice has an arcuate cross section.

8. The fluid flow regulator according to claim 1, characterized in that at least one of the first and second electroformed layers has an over developed geometry.

9. The fluid flow regulator according to claim 1, characterized in that at least one inlet has a transverse shape selected from the group consisting of circular, oblong, toroid, polygonal, triangular, rectangular and irregular.

10. The fluid flow regulator according to claim 1, characterized in that the electroformed layers comprise at least one member selected from the group consisting of nickel, copper, gold, silver, palladium, tin, lead, cobalt, chromium, iron, zinc , and alloys thereof.

11. The fluid flow regulator according to claim 1, characterized in that the electroformed layers comprise at least one member selected from the group consisting of nickel-phosphorus, nickel-boron, copper-nickel-phosphorus, or chel-polytetrafluoroethylene, and compounds thereof .

12. The fluid flow regulator according to claim 1, characterized in that the first and second electroformed layers are formed from an identical material.

13. The fluid flow regulator according to claim 1, characterized in that the first and second electroformed layers are formed from different materials.

14. The fluid flow regulator according to claim 1, characterized in that the fluid flow regulator is a nozzle for injecting liquid fuel atomization, for a motor.

15. The fluid flow regulator according to claim 1, characterized in that it further comprises the force generating means for selectively deflecting the second electroformed layer.

16. The fluid flow regulator according to claim 15, characterized in that the force generating means is selected from the group consisting of a spring, a piezoelectric device, a solenoid and fluid pressure.

17. The fluid flow regulator according to claim 1, characterized in that the second layer is movable between a constricted position in which the second layer is intermediate to the open and closed positions, to constrict the turbulence-inducing intermediate channel and reduce a amount of fluid flow through it.

18. A method for producing a fluid flow regulator comprising at least one inlet orifice that receives a fluid; at least one ejection orifice ejecting said fluid; and a turbulence inducing intermediate channel between the inlet and an inlet orifice and at least one fluid ejecting port that transports the fluid non-linearly in a fluid flow direction from at least one inlet orifice to at least one ejection orifice. of fluid, the turbulence inducing intermediate channel is defined by a space between the first and second electroformed layers, wherein the second layer is electroformed on the first layer, or the first layer is electroformed on the second layer, and wherein the second layer is The layer is selectively elastically movable relative to the first layer between at least two positions: (i) an open position in which the second layer is separated from the first layer to define the turbulence-inducing intermediate channel and allow the flow of the fluid to through it, and (ii) a closed position in which the second layer makes contact with at least a portion of the first layer, to occupy space and prohibit the flow of fluid, the method is characterized in that it comprises: (a) the electroforming on a substrate, a layer to define at least one entry hole and at least one fluid ejection hole; (b) forming an electroformed multi-layered pattern by electroforming on the layer of at least one other layer to define the intermediate channel, and at least one of an inlet orifice and at least one fluid ejection orifice; (c) separating the multi-layer electroformed pattern from said substrate; and (d) placing force generating means in contact with an outer layer to provide the fluid flow regulator.

19. The method according to claim 18, further characterized in that it comprises the provision of protective layer patterns and the removal of the protective layer patterns to define at least one inlet orifice, at least one fluid ejecting hole f the intermediate channel , wherein the protective layer patterns comprise at least one member selected from the group consisting of 2-ethoxyethyl acetate, n-butyl acetate, xylene, o-chlorotoluene, toluene, a photoactive compound, and mixtures thereof.

20. The method according to claim 18, further characterized by comprising the provision of protective layer patterns and the removal of said protective layer patterns to define at least one inlet orifice, at least one fluid ejecting orifice and the intermediate channel , wherein the protective layer patterns comprise at least one member selected from J. group consisting of cyclized polyisoprene and diazido type photoinitiators.

21. The method according to claim 18, characterized in that the pattern layers are formed from at least one member selected from the group consisting of nickel, copper, gold, silver, palladium, tin, lead, cobalt, chromium, iron, zinc, and alloys thereof.

22. The method according to claim 18, characterized in that the patterned layers are formed from at least one member selected from the group consisting of nickel-phosphorus, nickel-boron, copper-nickel-phosphorus, nickel-poly-tetrafluoroethylene, and compounds thereof