MXPA02001093A - Hebras de fibra de vidrio impregnadas y productos que las incluyen. - Google Patents

Hebras de fibra de vidrio impregnadas y productos que las incluyen.

Info

Publication number
MXPA02001093A
MXPA02001093A MXPA02001093A MXPA02001093A MXPA02001093A MX PA02001093 A MXPA02001093 A MX PA02001093A MX PA02001093 A MXPA02001093 A MX PA02001093A MX PA02001093 A MXPA02001093 A MX PA02001093A MX PA02001093 A MXPA02001093 A MX PA02001093A
Authority
MX
Mexico
Prior art keywords
same
glass fiber
products including
fiber strands
impregnated glass
Prior art date
Application number
MXPA02001093A
Other languages
English (en)
Spanish (es)
Inventor
Wu Xiang
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US1999/021443 external-priority patent/WO2000021900A1/en
Priority claimed from PCT/US1999/021442 external-priority patent/WO2000021899A1/en
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MXPA02001093A publication Critical patent/MXPA02001093A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/48—Coating with two or more coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
MXPA02001093A 1999-07-30 2000-07-28 Hebras de fibra de vidrio impregnadas y productos que las incluyen. MXPA02001093A (es)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US14633799P 1999-07-30 1999-07-30
US14660599P 1999-07-30 1999-07-30
US14686299P 1999-08-03 1999-08-03
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
PCT/US1999/021442 WO2000021899A1 (en) 1998-10-13 1999-10-08 Impregnated glass fiber strands and products including the same
US18356200P 2000-02-18 2000-02-18
US52703400A 2000-03-16 2000-03-16
US54837900A 2000-04-12 2000-04-12
US56891600A 2000-05-11 2000-05-11
US62052600A 2000-07-20 2000-07-20
PCT/US2000/020459 WO2001009054A1 (en) 1999-07-30 2000-07-28 Impregnated glass fiber strands and products including the same

Publications (1)

Publication Number Publication Date
MXPA02001093A true MXPA02001093A (es) 2003-07-21

Family

ID=27574952

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02001093A MXPA02001093A (es) 1999-07-30 2000-07-28 Hebras de fibra de vidrio impregnadas y productos que las incluyen.

Country Status (8)

Country Link
EP (1) EP1204613A1 (ko)
JP (1) JP2003527491A (ko)
KR (1) KR20020057947A (ko)
CN (1) CN100366563C (ko)
CA (1) CA2380975A1 (ko)
HK (1) HK1046896A1 (ko)
MX (1) MXPA02001093A (ko)
WO (1) WO2001009054A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2811662B1 (fr) * 2000-07-13 2003-07-18 Saint Gobain Isover Produit d'isolation thermique/phonique a base de laine minerale
US7354641B2 (en) * 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
KR100879284B1 (ko) * 2008-02-12 2009-01-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
KR101015626B1 (ko) * 2009-01-14 2011-02-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트
US10099435B2 (en) * 2015-06-04 2018-10-16 Ford Global Technologies, Llc Method of splitting fiber tows
CN107949085A (zh) * 2017-11-29 2018-04-20 曹结宾 一种柔型加热电缆
CN113396254B (zh) * 2019-02-08 2024-03-15 Ppg工业俄亥俄公司 涂覆含纤维的材料的方法和经过涂覆的含纤维的材料
CN110554455B (zh) * 2019-08-21 2020-06-09 北京大学 一种快速制备过渡金属硫族化合物复合光纤材料的方法
WO2022202600A1 (ja) * 2021-03-26 2022-09-29 東レ株式会社 プリプレグ積層体および複合構造体および複合構造体の製造方法
EP4067410A1 (de) * 2021-03-29 2022-10-05 Evonik Operations GmbH Verwendung von polyamin- und/oder polyalkanolamin-basierten carbonsäurederivaten in wässrigen polyurethandispersionen
CN113444338B (zh) * 2021-08-17 2022-05-03 瑞安市瑞鑫电器有限公司 一种碳刷架用高分子绝缘材料及其制备方法
CN113896436B (zh) * 2021-10-29 2023-06-09 巨石集团有限公司 玻璃纤维浸润剂及其应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
JP2545957B2 (ja) * 1988-12-15 1996-10-23 日東紡績株式会社 プリント配線基板及び同基板用織物
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
JP3151397B2 (ja) * 1995-10-26 2001-04-03 松下電工株式会社 プリプレグ及び金属箔張り積層板
AU2787499A (en) * 1998-03-03 1999-09-20 Ppg Industries Ohio, Inc. Methods for inhibiting abrasive wear of glass fiber strands
CN1155531C (zh) * 1998-03-03 2004-06-30 Ppg工业俄亥俄公司 无机颗粒涂覆的玻璃纤维束以及包括它的产品
JP2002505216A (ja) * 1998-03-03 2002-02-19 ピーピージー インダストリーズ オハイオ， インコーポレイテッド ガラス繊維−強化積層板、電子回路基板およびファブリックの組み立て方法
CA2346027A1 (en) * 1998-10-13 2000-04-20 Ernest L. Lawton Impregnated glass fiber strands and products including the same
EP1124770A1 (en) * 1998-10-13 2001-08-22 PPG Industries Ohio, Inc. Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Also Published As

Publication number Publication date
HK1046896A1 (zh) 2003-01-30
CA2380975A1 (en) 2001-02-08
CN100366563C (zh) 2008-02-06
KR20020057947A (ko) 2002-07-12
WO2001009054A1 (en) 2001-02-08
EP1204613A1 (en) 2002-05-15
JP2003527491A (ja) 2003-09-16
WO2001009054A8 (en) 2001-04-19
WO2001009054A9 (en) 2001-08-16
CN1402695A (zh) 2003-03-12

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