MXPA00011554A - Reworkable thermosetting resin compositions - Google Patents

Reworkable thermosetting resin compositions

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Publication number
MXPA00011554A
MXPA00011554A MXPA00011554A MXPA00011554A MX PA00011554 A MXPA00011554 A MX PA00011554A MX PA00011554 A MXPA00011554 A MX PA00011554A MX PA00011554 A MXPA00011554 A MX PA00011554A
Authority
MX
Mexico
Prior art keywords
composition
further characterized
composition according
methylimidazole
imidazole
Prior art date
Application number
Other languages
Spanish (es)
Inventor
Mark M Konarski
Zbigniew A Szczepaniak
Afranio Torres-Filho
Lawrence N Crane
Original Assignee
Lawrence N Crane
Mark M Konarski
Loctite Corp
Loctite Corporation
Zbigniew A Szczepaniak
Torresfilho Afranio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lawrence N Crane, Mark M Konarski, Loctite Corp, Loctite Corporation, Zbigniew A Szczepaniak, Torresfilho Afranio filed Critical Lawrence N Crane
Publication of MXPA00011554A publication Critical patent/MXPA00011554A/en

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

This invention relates to thermosetting resin compositions useful for mounting semiconductor devices in a circuit board, for example, capsule or scale size packets ("CSP2"), spherical grid devices ("BGA") and the like; of which has a semiconductor capsule, such as large-scale integration ("LSI"), in a carrier substrate.The compositions of this invention can be reworked when subjected to appropriate conditions.

Description

RESIN COMPOSITIONS TERMOFRAGU ABLE, WHICH CAN BE WORKED AGAIN BACKGROUND OF THE INVENTION FIELD OF THE INVENTION This invention relates to thermosetting resin compositions, useful for mounting on a circuit board semiconductor device, such as capsule ("chip") or capsule scale ("CSP") packages. ), spherical grid devices ("BGA") and the like; each of which has a semiconductor capsule, such as large-scale integration ("LSI") on a carrier substrate. The compositions of this invention can be reworked when subjected to the appropriate conditions.
BRIEF DESCRIPTION OF THE RELATED TECHNOLOGY In recent years the popularity of small-sized electronic devices, such as tape recorders, integrated into the camera ("VTR") and portable telephone devices, has made it convenient to reduce size of large-scale integration devices (LSI). As a result, CPS and BGA have been used to reduce the size of the packets, substantially that of the simple "chips". These CSP and BGA improve the characteristics of the electronic device, while retaining many of its operational aspects, thus serving to protect the simple semiconductor capsules, such as the LSI, and facilitate their testing. Ordinarily, the CSP / BGA assembly is connected to electrical conductors in a circuit board through the use of a welded connection or the like. However, when the printed circuit structure is exposed to thermal cycling, the reliability of the soldered connection between the circuit board and the CSP / BGA is often made suspicious. Recently, after assembling a CSP / BGA assembly on the circuit board, it is frequently filled with a sealing resin (commonly referred to as an imperfect cross-section filler seal) in order to relieve the stresses caused by the thermal cycles; thus improving the thermal shock properties and increasing the reliability of the structure. However, since thermosetting resins are typically used as imperfect cross-section filler material, in the event of a failure after the CSP / BGA assembly is mounted on the circuit board, it is very difficult to replace the CSP assembly. / BGA without destroying or scraping the structure in its entirety. For that purpose it is accepted that the techniques for mounting a single capsule on a circuit board are substantially similar to the assembly of a CSP / BGA assembly on a circuit board. One such technique, described in Japanese Patent Publication, open to the public, No. 102343/93, involves a mounting process where the simple capsule is fixed and connected to a circuit board using a photocurable adhesive, where, in case of failure, the simple capsule is removed from it. However, this technique is limited to those cases in which the circuit board includes a transparent substrate (eg glass), which allows exposure to light from the rear side, and the resulting structure exhibits low thermal shock properties . Japanese Patent Laid-Open No. 69280/94 discloses a process where a single capsule is fixed and connected to a substrate by the use of a resin capable of hardening at a predetermined temperature. In case of failure, this simple capsule is removed from the substrate by softening the resin at a temperature above the predetermined temperature. However, no specific resin is disclosed, and there is no description about the treatment of the resin remaining on the substrate. Thus, the process described is, at least, incomplete. As noted in Japanese Laid-open Patent Publication No. 77264/94, it is conventional to use a solvent to remove residual resin from a circuit board. However, swelling the resin with a solvent is a time-consuming process and corrosive organic acid, ordinarily used as a solvent, can reduce the reliability of the circuit board. Rather, that description speaks of a method for removing the residual resin by irradiation with electromagnetic radiation. The Japanese patent publication open to the public No. 251516/93 also describes a mounting process using bisphenol A, an epoxy type resin (CV5183 or CV5183S, manufactured by Matsushita Electric Industrial Co., Ltd.). However, the elimination process thus described does not consistently allow easy separation of the capsule, the curing step is taken at elevated temperatures, and the process results, in general, in low productivity. Of course, the mechanical methods of removing / replacing semiconductor capsules from / on a substrate are known; such as cutting the capsule that is going to be removed / replaced. See U.S. Patent No. 5,355,580 (Tsukada). Incomplete thermoplastic resin resins are known for use in the attachment of semiconductor capsules. See U.S. Patent No. 5,783,867 (Belke, Jr.). However, such thermoplastic resins tend to leak under relatively modest temperature conditions. In contrast, thermosetting resins cure a matrix that, ordinarily, has greater thermal stability under end-use operating temperatures. U.S. Patent No. 5,512,613 (Afzali-Ardakani) and 5,560,934 (Afzali-Ardakani) refer to a thermofracable composition, which can be reworked, which is based on a diepoxide component in which the organic linking portion connecting the Two epoxy groups of the diepoxide include an acyclic acetal group separable with acid. With those acyclic acetal groups separable with acid, which form the bases of the composition that can be reworked, a cured thermosetting resin only needs to be introduced in an acidic environment, in order to obtain the softening and loss of much of its adherence. U.S. Patent No. 5872,158 (Kuczynski) relates to thermosettable compositions, capable of curing by exposure to actinic radiation, which are based on acetal diacrylates, and whose reaction products are said to be soluble in dilute acid. U.S. Patent No. 5,760,337 (lyer) refers to interlaced resins, which can be thermally reworked, to fill the gap created between a semiconductor device and a substrate to which it is attached. These resins are produced by reacting a dienophile (with a functionality greater than 1), with a polymer containing furan, substituted with 2,5-dialkyl. International patent publication No. PCT / US98 / 00858 refers to a thermosetting resin composition, capable of sealing with insufficient filling between a semiconductor device that includes a semiconductor capsule mounted on a carrier substrate and a circuit board, to which it is attached. electrically connected the semiconductor device. The composition includes about 100 parts by weight of an epoxy resin, about 3 to 60 parts by weight of a curing agent, and about 1 to 90 parts by weight of a plasticizer. Here, the area around the cured thermosetting resin will be heated to a temperature of about 190 to 260 ° C for a period of time ranging from about 10 seconds to about 1 minute, in order to obtain the smoothing and a loss of most of your grip. In spite of the state of the art, a filler seal material of imperfect cross-section would be desirable to provide good productivity and thermal shock properties, while allowing the substrates with which it is to be used to be easily processed and they are easily separated from a semiconductor device without application of acidic media or high temperature conditions, which may compromise the integrity of the semiconductor devices remaining in the substrate, or of the substrate itself.
BRIEF DESCRIPTION OF THE INVENTION The thermosetting resin composition which is used as imperfect cross-section filler seal between a semiconductor device and a circuit board to which the semiconductor device is electrically connected, broadly includes a curable resin component, a component of epoxy resin, a portion of which is an epoxy compound that has at least one thermally breakable ligature; an optional inorganic filler component; and a curing agent component, including an anhydride component, a nitrogen-containing component, such as an amine compound, an amide compound and / or an imidazole compound, and combinations thereof. The reaction products of these compositions are capable of softening upon exposure to high temperature conditions, such as above the temperatures used to cure the composition. Said exposure to temperature, combined with the epoxy compound having at least one thermally breakable ligature, gives the appearance of this invention, that the resin can be reworked. The remaining components, which are discussed below, provide the physical properties and characteristics for the compositions of the present invention to be attractive for commercial use, particularly in the microelectronics industry. The epoxy compounds with at least one thermally breakable ligature can be selected from those having the following formula: wherein each R is independently selected from hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertbutyl, alkoxy of 1 to 4 carbon atoms, halogen, cyano and nitro; and each R3 is independently selected from hydrogen, methyl, ethyl, propyl and isopropyl; R i and R 2 are each independently selected from hydrogen, methyl, ethyl, propyl, phenyl, tolyl and benzyl; provided that R ^ and R2 can not be hydrogen and m is 0 or 1. Particularly suitable epoxy compounds, within formula I, are given in the section entitled "Detailed description of the invention" which follows. The thermosetting resin composition of the invention is useful as an imperfect cross-section filler resin, and allows a semiconductor device, such as a CSP / BGA assembly including a semiconductor capsule mounted on a carrier substrate, to be connected in a manner safe to a circuit board, by termocuración for a short time and with good productivity. The reaction products of the compositions of the invention demonstrate excellent thermal shock properties (or thermal cycle properties), and allow the semiconductor device to be easily removed from the circuit board by heating in a localized manner, in case of failure of the semiconductor device or of connection failure. This makes it possible to reuse the circuit board still electrically fixed) and thus obtain an improvement in the performance of the production process and a reduction in production costs.
The compositions of this invention can also be used for microelectronic applications, beyond the filler seal of imperfect cross-section, such as with a blanket cover, a die attachment or other applications for thermoformable compositions, in which a time of quick healing and a long useful work life. Other benefits and advantages of the present invention will become apparent more readily after reading the "Detailed description" section together with the figures.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates a sectional view, showing an example of the mounting structure in which the thermosetting resin composition of the present invention is used. Figure 2 illustrates a flow chart of a method useful for reworking a cured thermosetting resin composition, in accordance with the present invention, in order to remove a semiconductor device from a circuit board to which it was fixed.
DETAILED DESCRIPTION OF THE INVENTION As noted above, thermosetting resin compositions that are useful as fill seals of imperfect cross-section between a semiconductor device and a circuit board to which the semiconductor device is electrically connected, broadly include: ( a) an epoxy resin component, a portion of which is an epoxy compound having at least one thermally breakable tie; 8b) an optional inorganic filler component; and (c) a curing agent component, including an anhydride component, a nitrogen-containing component, such as an amine compound, an amide compound and / or an imidazole compound, and / or combinations thereof. The reaction products of these compositions are able to soften under exposure to high temperature conditions, such as above the selected temperature to cure the composition. The loss of adhesion to the substrate occurs at temperatures above that which was used to cure the composition. For example, at least about 50% adhesion to the substrate is typically lost at temperatures above about 200 ° C. Typically the composition includes about 10 to 60 weight percent of the epoxy resin component, by weight of the total composition, of which about 25 to 75% by weight consists of an epoxy compound having at least one ligature that can break thermally; about 0 to 60 weight percent of the inorganic caga component; and from 0.01 to about 60 weight percent of the curing agent component, about 0 to 50 weight percent of which consists of an anhydride compound, from 0 to about 5 percent of which consists of a an amide compound, such as an amide with cyano functionality, such as dicyanodiamide, and from 0 to about 2 percent of which consists of an imidazole compound. Of course, depending on the particular set of desirable properties for a composition intended for a specific purpose, these values may vary somewhat. Such variation can be achieved without undue experimentation by persons skilled in the art, and consequently, is contemplated within the scope of the present invention. The epoxy resin component of the present invention can include any common epoxy resin, such as a multifunctional epoxy resin. Ordinarily the multifunctional epoxy resin should be included in an amount within the range of about 15 weight percent to 75 weight percent of the total epoxy resin component. In the case of epoxy resin of the bisphenol-F type, conveniently its amount should be in the approximate range of 35 to 65 weight percent, such as about 40 to 50 weight percent of the total epoxy resin component. Examples of the multifunctional epoxy resin include the epoxy resin of the bisphenol-A type, the epoxy resin of the bisphenol-F type (such as RE-404-S of Nippon Kayaku, Japan); the phenol novolac epoxy resin and the cresol novolac type epoxy resin (such as "ARALDITE" ECN 1871 from Ciba Specialty Chemicals, Hawthorne, New York). Other suitable epoxy resins include the polyapoxy compounds based on aromatic amine and epichlorohydrin, such as N, N, N ', mN'-tetraglycidyl-4,4'-diaminodiphenylmethane; N-diglycidyl-4-aminophenyl glycidyl ether; and N, N, N ', N'-tetraglycidyl-1,3-propylene bis-4-aminobenzoate. Epoxy resins suitable for use herein also include polyglycidyl derivatives of phenolic compounds, such as those obtainable commercially under the "EPON" parts, such as "EPON" 828, "EPON" 1001, "EPON" 1009 and " EPON "1031 from Shell Chemical Co .; "DER" 331, "DER" 332, "DER" 334 and "DER" 542, from Dow Chemical Co .; and BREN-S by Nippon Kayaku. Other suitable epoxy resins include the polyepoxides prepared from polyols and the like and the polyglycidyl derivatives of phenol-formaldehyde novolacs, the latter obtainable commercially under the trademarks "DEN", as "DEN" 431, "DEN" 438 and "DEN" 439, from Dow Chemical. Also available commercially are cresol analogs, under the trademarks "ARALDITE", such as "ARALDITE" ECN 1235, "ARALDITE" ECN 1273 and "ARALDITE" ECN 1299 from Ciba Specialty Chemicals Corporation. SU-8 is an epoxy novolac, bisphenol-A type, obtainable from Interez, Inc. Polyglycidyl adducts of amines, amino alcohols and polycarboxylic acids are also useful in this invention; whose commercially obtainable resins include: "GLYAMINE" 135, "GLYAMINE" 125 and "GLYAMINE" 115, by F.I.C. Corporation; "ARALDITE" MY-720, "ARALDITE" 0500 and "ARALDITE" 0510 by Ciba Specialty Chemicals and PGA-X and PGA-C by Sherwin-Williams Co.
And, of course, combinations of the different epoxy resins are also convenient for use herein. The epoxy compounds with at least one thermally breakable ligature can be selected from those which fall within the following formula: wherein each R is independently selected from hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertbutyl, alkoxy of 1 to 4 carbon atoms, halogen, cyano and nitro; and each R3 is independently selected from hydrogen, methyl, ethyl, propyl and isopropyl; R, and r2 are each independently selected from hydrogen, methyl, ethyl, propyl, phenyl, tolyl and benzyl; provided that R ^ and R2 can not both be hydrogen, and m is 0 or 1. Particularly convenient epoxy compounds, within formula I, include: The presence in the epoxy resin component of the compound or of the epoxy compounds with at least one thermally breakable ligature allows the repair, replacement, recovery and / or recycling of operational electronic components from assemblies that had been left at least in part inoperable These epoxy compounds can be prepared from esters of cycloaliphatic dienes having the following formula: where R, R ,, R2, R3 and m are as noted above; which by themselves are the condensation product of an alcohol having the following formula A: where R, R ,, R2, R3 and m are as noted above; with an acid chloride that is within the following formula B: where R and R3 are as noted previously. Ordinarily, the condensation reaction is carried out in a polar anhydrous solvent at a temperature ranging from 0 to 20 ° C for a period of time varying between 6 and 18 hours. For epoxy diene ester, a percylate (such as peracetic acid, perbenzoic acid, meta-chloroperbenzoic acid and the like) can be used, the reaction being carried out until epoxidation of the diene ester occurs, typically within the time period of 2 to 18 hours. Many materials are potentially useful as an inorganic filler component. For example, reinforcing silicas, such as molten silicas, may often include the inorganic filler component and may not be treated or treated in order to alter the chemical nature of their surfaces. Virtually any fused reinforcing silica can be used. Particularly suitable ones have a low concentration of ions, and are of relatively small particle size, (for example, in the approximate scale of 2 to 10 microns, as in the order of about 2 microns), such as the commercially available silica of Admatechs, Japan, under the designation SO-E5. Other materials suitable for use as an inorganic filler component include those constructed of or containing aluminum oxide, silicon nitride, aluminum nitride, silica-coated aluminum nitride, boron nitride, and combinations thereof.
The curing agent component should include materials capable of catalyzing the polymerization of the epoxy resin component of the compositions of the invention. Suitable curing agents for use with the present invention include an anhydride component, a nitrogen-containing component, such as an amine compound, an amide compound and an imidazole compound, and combinations thereof. Anhydride compounds suitable for use herein include monoanhydrides and polyanhydrides, such as hexahydrophthalic anhydride ("HHPA") and methylhexahydrophthalic anhydride ("MHHPA") (commercially available from Lindau Chemicals, Inc., Columbia, South Carolina, USA) , used individually or in combination, a combination of which is available under the designation "LINDRIDE" 62C); and 5- (2,5-dioxotetrahydrol) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (available commercially from ChrisKev Co., Leewood, Kansas, U.A., under the designation B-4400). Of course, combinations of these anhydride compounds are also suitable for use in the compositions of the present invention. Examples of the amine compounds include aliphatic polyamines, such as diethylenetrin, triethylenetetramine and diethylaminopropylamine; aromatic polyamines, such as m-xylene diamine and diaminodiphenylamine; and alicyclic polyamines, such as isophorone diamine and menten diamine.
Of course, combinations of these amine compounds for use in the compositions of the present invention are also convenient. Examples of amide compounds include cyano-functional amides, such as dicyanodiamide. The imidazole compounds of: imidazole, isoimidazole and substituted imidazoles, such as alkyl substituted imidazoles (for example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-dimethylimidazole, butylimidazole, 2-heptadecenyl-4) can be selected. -methylimidazole, 2-methylimidazole, 2-undecenylimidazole, 1-vini I-2-methylimidazole, 2-n-heptadecylimidazole, 2-undecylimidazole, 2-heptadeci I imidazole, 2-ethyl-4-methyl imidazole, 1-benzyl-2 -methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-et l-4-m ethyl imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole , 1-guanaminoethyl-2-methylimidazole and addition products of an imidazole and trimellitic acid, 2-n-heptadecyl-4-methylimidazole and the like, generally where each alkyl substituent contains up to about 17 carbon atoms and, conveniently, up to about of 6 carbon atoms); and aryl substituted imidazoles (eg, phenylimidazole, benzylimidazole, 2-methyl-4,5-diphenylimidazole, 2,3,5-triphenylimidazole, 2-styrylimidazole, 1- (dodecylbenzyl) -2-methyl imidazole, 2- (2 -hydroxyl-4-tert-butylphenyl) -4,5-diphenylimidazole, 2- (2-methoxyphenyl) -4,5-diphenylimidazole, 2- (3-hydroxyphenyl) -4,5-diphenylimidazole, 2- (p-dimethylaminophenyl) - 4,5-difenii-imidazole, 2- (2-hydroxyphenyl) -4,5-diphenylimidazole, di (4,5-diphenyl-2-imidazole), benzene-1,4,2-naphthyl-4,5-diphenylimidazole , 1-benzyl-2-methylimidazole, 2-p-methoxystyirylimidazole and the like, generally where each aryl substituent contains up to about 10 carbon atoms and, conveniently, up to about 8 carbon atoms). Examples of commercial imidazole compounds are available from Air Products, Allentown, Pennsylvania, USA, under the trade designation "CUREZOL" 1B2MZ and from Synthron, Inc., Morganton, North Carolina, USA, under the designation "ACTIRON" NXJ- 60 Of course, combinations of these imidazole compounds for use in the compositions of the present invention are also convenient. The curing agent component may be used in an amount of about 5 to 40 parts by weight per 100 parts of the epoxy resin, such as from about 5 to about 40 parts by weight, per hundred parts of the epoxy resin. Additionally the composition may also include a fluidity improving agent, such as a silane and / or a titanate. Suitable silanes for use herein include: octyltrimethoxysilane (commercially available from OSI Specialties Co., Danbury, Connecticut, USA, under the trade designation A-137), and methacryloxypropyltrimethoxysilane (commercially available from OSI, under the trade designation A -174). Suitable titanates for use herein include tetracis [2,2-bis [(2-propenyloxy) methyl] -1-butanolate-0] [b1s (ditridecylphosphiro-0], diacid] 2 of titanium IV (commercially available from Kenrich Petrochemical Inc., Bayonne, New Jersey, USA, under the trade designation KR-55.) When used, the flow imparting agent may be employed in an amount of from 0 to about 2 parts by weight, per 100. In addition, adhesion promoters, such as silanes, glycidyltrimethoxysilane (commercially available from OSl under the trade designation A-187) or gamma-aminopropyltriethoxysilane (commercially available from OSl under the designation A-1100) can be used. Cyanate esters can also be used in the compositions of the invention The cyanate esters useful as components in the compositions of the invention can be selected from: dicyanatobenzenes, tricyanatobenzenes, dicyanatonaphthalenes, tritanatonaphthalenes, dicyanatobiphenyl, bis (cyanatophenyl) methanes and alkyl derivatives thereof; bis (dihalogenocyanatophenyl) propanes, bis (cyanatofenyl) ethers, bis (cyanatofenyl) sulfides, bis (cyanatofenyl) propanes, tris (cyanatofenil) phosphites, tris (cyanatofenyl) phosphates, bis (halogen cyanatofenyl) methanes, cyanolated novolac, bisfcianatofenil (methylethylidene) Jbenzene, thermoplastic oligomers terminated with cyanated bisphenol, and combinations thereof. More specifically, the aryl compounds have at least one cyanate ester group in each molecule and can be represented generally by the formula Ar (OCN) m, where Ar is an aromatic radical and m is an integer from 2 to 5. The aromatic radical Ar it must contain at least six carbon atoms, and can be derived, for example, from aromatic hydrocarbons, such as benzene, biphenylene, naphthalene, anthracene, pyrene or the like. It is also possible to derive the aromatic radical Ar from a polynuclear aromatic hydrocarbon, in which at least two aromatic rings are fixed to each other by means of a bridging group. Also included are two aromatic radicals derived from phenolic novolac-type resins; that is, cyanate esters of these phenolic resins. The aromatic radical Ar may also contain other non-reactive substituents, attached to the ring. Examples of those cyanate esters include, for example, 1,3-dicyanatobenzene, 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8- 2,6- or 2,7-dicyanatonaphthalene; 1, 3,6-tricianedonaphthalene, 414'-dicyanato-biphenyl, bis (4-cyanatophenyl) methane and 3,3 ', 5,5'-tetramethyl-bis (4-cyanatofenyl) methane; 2,2-bis (3,5-dichloro-4-cyanatophenyl) propane, 2,2-bis (3,5-dibromo-4-dicyanatophenyl) ether, bis (4-cyanatophenyl) sulfide, 2,2-bis ( 4-cyanatophenyl) propane; tris (4-cyanatophenyl) phosphite, tris (4-cyanatophenyl) phosphate, bis (3-chloro-4-cyanatophenyl) methane, cyanoated novolac, 1,3-bis [4-cyanatophenyl-1- (methylethylidene)] benzene and polycarbonate or another thermoplastic oligomer terminated with cyanated bisphenol. Other cyanate esters include the cyanates described in U.S. Patent Nos. 4,477,629 and 4,528,366, the disclosure of which is expressly incorporated herein by way of this reference; the cyanate esters described in U.S. Patent No. 1,305,702 and the cyanate esters described in the international patent publication WO 85/02184; the description of each of which is expressly incorporated herein by means of this reference. Of course, combinations of these cyanate esters within the imidazole component of the compositions of the present invention are also conveniently employed herein. A particularly suitable cyanate ester for use herein is available commercially from Ciba Specialty Chemicals, Tarrytown, New York, USA, under the trademark "ARAOCY" L10 [1,1-di (4-cyanatophenylethane)] USA, the cyanate esters can be used in an approximate amount from 1 to 20 weight percent, based on the total amount of the epoxy resin component. Conventional additives may also be used in the compositions of the present invention to obtain certain desired physical properties of the composition, the cured reaction product, or both. For example, it may be convenient, in certain cases (particularly when a large volume of inorganic filler component is used) to include a reactive comonomer component for the epoxy resin component, such as a reactive diluent. Suitable reactive diluents for use herein may include monofunctional epoxy resins or certain multifunctional epoxy resins. The reactive diluent should have a viscosity that is less than that of the epoxy resin component. Ordinarily the reactive diluent should have a viscosity less than about 250 cps. In case a monofunctional epoxy resin is included as a reactive diluent, said resin should be employed in an amount of up to about 50 parts, based on the total epoxy resin component. The monofunctional epoxy resin should have an epoxy group with an alkyl group of about 6 to about 28 carbon atoms; and examples of this include the alkyl glycidyl ethers of 6 to 28 carbon atoms in the alkyl; the glycidyl esters of fatty acid of 6 to 28 carbon atoms and the glycidyl ethers of aikilphenol of 6 to 28 carbon atoms in the alkyl. Commercially available monofunctional epoxy resin reactive diluents include those from Pacific Epoxy Polymers, Richmond, Michigan, USA, under the trade designations PEP-6770 (glycidyl ester of neodecanoic acid), PEP-6740 (phenyl glycidyl ether) and PEP- 6741 (butyl glycidyl ether). Commercially available multifunctional epoxy resin reactive diluents include those from Pacific Epoxy Polymers, under the trade designations PEP 6752 (Trimethylolpropane triglyceryl ether) and PEP-6760 (diglycidyl aniline).
The compositions of the present invention may additionally contain other additives, such as defoaming agents, leveling agents, dyes and pigments. In addition, photopolymerization initiators can also be incorporated therein, provided that those initiators do not adversely affect the properties of the composition or the reaction products formed therefrom. The thermosettable resin compositions of the present invention may be of the single package type, in which all the ingredients are mixed together, or of the two pack type, in which the curable component or components are (are included) in one part, and the healing agent is stored separately in a second part, and mixed with each other before use. During the application, the thermosetting resin compositions according to the present invention penetrate and flow easily within the space between the semiconductor capsule and the circuit board; or at least show a viscosity reduction under the conditions of heating or use, penetrating and flowing in that manner easily. In general it is convenient to prepare thermosetting resin compositions of the present invention by selecting the types and proportions of various components, to reach a viscosity, at the temperature of 25 ° C, within the range of 500 to 70,000 cps, such as 800 at 3,000 cps, depending on the amount of inorganic charge component present (if any) in order to improve its ability to penetrate into the space (eg, 10 to 200 μm) between the circuit board and the semiconductor device. At that viscosity, the gel times of the compositions will be designed at a specific period of time (such as 15 seconds, or 1 or 2 minutes) at a temperature of about 150 ° C. In that case, the compositions of the invention should not show, or should not substantially increase the viscosity for an approximate period of time of six hours. With said gelling time, the compositions penetrate into the space (eg, 10 to 200 μm) between the circuit board and the semiconductor device, relatively quickly, and allow a larger number of assemblies to be filled without increasing of viscosity in the composition, making it less effective for the application. The reference to Figure 1 shows a mounted structure (ie, an FC package) in which a thermosetting resin composition of the present invention has been applied and cured. The FC 4 package is formed by connecting a semiconductor capsule (a single capsule) 2 to a carrier substrate 1 (e.g., a circuit board) and sealing the space therebetween suitably with a thermosetting resin composition 3. More specifically, for example, in the assembly of the semiconductor devices FC using SBB technology, the semiconductor capsule 2 can be passed over a substrate carrying a conductive adhesive paste (such as a metal-loaded epoxy) to form a layer thereof. on the semiconductor capsule 2. Ordinarily the layer is formed by a printing mechanism. The conductive paste can be applied to the carrier substrate or to the semiconductor capsule. One way of doing this is with a stencil matrix claimed and described in International Patent Publication No. PCT / FR95 / 00898. Alternatively, this connection can also be made by an anisotropically conductive adhesive. See International Patent Publication No. PCT / US97 / 13677. Subsequently, the semiconductor capsule 2 is placed on the carrier substrate 1, in such a way that the semiconductor capsule 2 is in alignment with the electrodes 5 and 6 of the carrier substrate 1, now coated with a layer with design of the adhesive or solder paste, conductive , 7 and 8. The conductive adhesive paste can be cured by a variety of ways, although a heat healing mechanism is ordinarily employed. In order to improve reliability, the space between the semiconductor capsule 2 and the carrier substrate 1 is sealed with a thermosetting resin composition 3. The cured product of the thermosetting resin composition must completely fill the space. Ordinarily the semiconductor capsule can be coated with a material based on polyimide, benzocyclobutane or silicon nitride, to passivate environmental corrosion. Carrier substrates can be constructed from ceramic substrates of AI2O3, S¡N3 and mulita (AI2O3-SiO2); substrates or ribbons of heat resistant resins, such as polyimides; epoxy reinforced with glass; ABS and phenolic substrates that are also commonly used as circuit boards and the like. Any electrical connection of the semiconductor capsule to the carrier substrate can be used, such as a high-melting solder connection or an electrically (or anisotropically) conductive adhesive, and the like. In order to facilitate the connections, particularly in the SBB technology, the electrodes can be formed as wire junction projections. After the semiconductor capsule is electrically connected to the carrier substrate, the resulting structure is ordinarily subjected to a continuity test or the like. After passing that test, the semiconductor capsule can be fixed with a thermosetting resin composition as described below. In that way, in case of a failure, the semiconductor capsule can be removed before it is fixed to the carrier substrate with the thermosetting resin composition. Using a suitable application means, such as a dispenser, a thermosetting resin composition according to this invention is applied to the periphery of the electronically connected semiconductor capsule. The composition penetrates by capillary action in the space between the carrier substrate and the semiconductor capsule. The thermosetting resin composition is then thermally cured by the application of heat. During the early stage of this heating, the thermosetting resin composition shows a significant reduction in viscosity and, consequently, an increase in flowability, so that it more easily penetrates into the space between the carrier substrate and the semiconductor capsule. Additionally, by preheating the carrier substrate, the thermosetting resin composition is allowed to fully penetrate into the entire space between the carrier substrate and the semiconductor capsule. The thermosetting resin compositions of the present invention can be ordinarily cured by heating to a temperature in the range of about 120 to 180 ° C, for a period of time of about 0.5 to 30 minutes. However, generally after applying the composition, an initial cure time of about 1 minute sets the composition, and full cure is observed after about 5 to 15 minutes at 165 ° C. In such a way, the composition of the present invention can be used at relatively moderate temperatures and short-term healing conditions and, therefore, achieves very good productivity. The amount of thermosetting resin composition applied must be suitably adjusted so that it almost completely fills the space between the carrier substrate and the semiconductor capsule, an amount that, of course, can vary depending on the application. The cured reaction products of the thermosetting resin compositions of the present invention demonstrate excellent adhesive strength, heat resistance and electrical properties; and acceptable mechanical properties, such as resistance to flex cracking, chemical resistance, moisture resistance and the like, for the applications for which they are used herein. In the assembly process using the thermosetting resin composition of the present invention, after the semiconductor device is mounted on the circuit board, as described above, the resulting structure is tested with respect to the characteristics of the semiconductor device, the connection between the semiconductor device and the circuit board, other electrical characteristics, and the status of the seal. In case a fault is found, a repair can be made as follows, and as shown in the flow chart illustrated in Figure 2. The area around the semiconductor device that has failed is heated to a temperature around from 190 to about 260 ° C for a period of time ranging from about 10 seconds to about 1 minute. (See Figure 2, step 1). Conveniently the temperature should be maintained in the approximate range of 210 to 220 ° C, and the time period should be within the range of 30 seconds to one minute. While no particular limitation is imposed on the manner in which heating occurs, localized heating, such as the application of hot air to the failure site by a heating gun, is particularly convenient. As soon as the solder melts and the resin softens by partial decomposition, to cause a reduction in the strength of the joint, the semiconductor device can be removed and removed from the substrate, for example, with pliers or pliers. After the semiconductor device 4 is removed, a residue of the cured reaction product of the thermosetting resin composition and a solder residue remains on the circuitod board. The residue of the cured product of the thermosetting resin composition can be removed, for example, by scraping it after the residue has been softened by heating to a predetermined temperature. The solder residue can be removed, for example, using a welded wire absorber (see Figure 2, step 2). Finally another new semiconductor capsule can be mounted on the circuit board (which has been cleaned as described above) in the manner described above. (See figure 2, step 3). After mounting, a thermosetting resin composition according to this invention can be supplied in the area between the semiconductor device and the circuit board. (See figure 2, step 4). In this way, the repair of the faulty site is completed. When a faulty site on the circuit board is found, the semiconductor device can be reused, removing the residue of the cured reaction product from the thermosetting resin composition and the weld residue that remained at the bottom of the semiconductor device. the same way that was described further back. The present invention will be more readily appreciated with reference to the following examples.
EXAMPLES In these examples, compositions according to the present invention were prepared and evaluated for operation.
COMPOSITION OF THERMOFRAGABLE RESIN A thermosetting resin composition according to this invention was prepared by mixing, according to the invention, for a period of about 10 minutes, at room temperature, in an open container, the following components , in the annotated order: 1. an epoxy resin component, which includes: 24,095 grams of epoxy resin of the bisphenol-F type, (obtainable commercially from Nippon Kayaku, under the designation RE-404-S); and 24.95 grams of the epoxy compound having at least one thermally breakable ligature, represented by formula III; and 2. a curing agent component, which includes: 0.2 g of an imidazole component (commercially available from Air Products under the trade designation "CUEZOL" 1B2MZ) and 50 grams of an anhydride component, which consists of 42.42 grams of a mixture, in a 50:50 ratio, of the anhydrides "HHPA" and "MHHPA" (obtainable commercially from Lindau, under the trade designation "LINDRIDE" 62C), and 7.48 grams of a cycloaliphatic dianhydride (commercially available from Chris-Kev , under the commercial designation B-4400). Seven other formulations were prepared (samples No. 2-8) having the following components in the amounts noted below in Table 1. TABLE 1 Although the compositions were used when they were formed (see below), they were stored for a period of time up to about 3 to 6 months at a temperature of about -40 ° C, without experiencing increased viscosity. After training, the composition was transferred to a 10 ml syringe, made of non-reactive plastic.
THE ASSEMBLY PROCESS Using cream welding (PS10R-350A-F92C, manufactured by Harima Chemicals, Inc.), a CSP was mounted that had a package of 20 mm in square, an electrode diameter of 0.5 mm, a separation of electrodes 1.0 mm and a carrier substrate made of alumina; on a glass-reinforced epoxy board, 1.6 mm thick, that had a circuit formed on it.
THE FILLING PROCESS OF THE IMPERFECT TRANSVERSAL SECTION The compositions of this invention can be supplied through a 12G needle, connected to a syringe, within the joint between the carrier substrate and the semiconductor device, a previously formed assembly, as it was said further back. After the supply, the assembly was transferred to an oven, while maintaining the temperature at approximately 165 ° C. The composition was cured initially after about one minute and then cured completely after approximately 15 minutes at that temperature.
PHYSICAL PROPERTIES The compositions have a variety of properties in both uncured and cured states, which are measurable and are useful parameters for the end user, when selecting a particular formulation for a specific need. For example, in uncured state, the flow velocity is interesting; Upon reaching the cured state, adherence and the ability to work it again are of interest. The flow time allows the end user to determine how quickly the adhesive can be applied during a manufacturing process, such as a circuit assembly operation. It can be measured by passing the composition through a 25 μm separation between glass coverslips aligned perpendicular to each other, using metal sheets as spacers. The time required for the composition to flow between the coverslips is then measured to an approximate length of 2.54 cm, at intervals of 6.35 mm. The values in seconds for the flow times of the compositions indicated above are given as the average of three measurements, below, in Table 2. The healing pattern refers to the time necessary for the start of healing to occur. at a certain temperature, in a specified period of time. This can be seen in greater detail with respect to some of the examples prepared in accordance with the present invention, below, in Table 2.
TABLE 2 In a cured state, a variety of properties are useful, depending on the final use for which the composition is intended. For example, the adhesion provides information about the strength of the bond formed by the cured composition. The glass transition temperature ("Tg"), which is measured by differential scanning calorimetry ("Differential Scanning Calorimetry =" DSC "), or by thermomechanical analysis (Thermal Mechanical Analysis =" TMA ") gives information about the hardness and the strength of the cured reaction product (or the network) and its behavior with respect to temperature changes (ie, a high Tg must provide a material that is more capable of withstanding high temperatures.) And, of course, the reliability is important for the cured composition, the reliability test is described below.
TEST OF THERMAL CYCLES Several samples (No. 1-2 and 4-5) prepared as noted above, were exposed to thermal cycle tests, such as liquid-liquid thermal shock ("LL") tests or thermal cycle of air-air ("AA"). In the L-L tests, the samples were exposed to temperatures between -55 and 125 ° C, with a dwell time of 5 minutes at each end. In the A-A tests the temperature scale was the same as for the L-L test, but the residence time increased to 20 minutes. After a predetermined number of thermal cycles, the sample was subjected to a continuity test to confirm the integrity of the electrical connection between the CSP and the circuit board. Samples were considered acceptable if they passed 500 L-L cycles. Table 3 below shows the data collected.
TABLE 3 As shown in Table 3, these samples are all acceptable with the type of capsules tested.
THE ABILITY TO WORK THEM AGAIN Using a hot air generator, the area around the CSP, fixed to the circuit board with sample compositions No. 1-2 and 4-5, should be heated by applying hot air at an approximate temperature of 215 ° C for a period of one minute. Then the CSP can be easily separated by pulling it or twisting the semiconductor capsule of the circuit board, using pliers. The thermosetting resin composition prepared without the epoxy compound, having at least one thermally breakable ligature, represented by the formula III, the remainder of the epoxy resin component of the epoxy resin RS-404-S, which was supplied and cured as before, does not allow separation in the manner thus described.
RELIABILITY OF THE REPLACED CAPSULE The cured composition remaining on the circuit board after the process thus described can be removed using physical scraping procedures, such as a sanding with a rotating brush at approximately 30,000 r.p.m. Next, the semiconductor capsule site must be fused with faults, and a new semiconductor capsule can be fixed, using conventional flying microcapsule technology. The thermosetting resin composition of this invention can then be applied around the periphery of the newly replaced semiconductor capsule, and can be cured by heating at a temperature of about 165 ° C for a period of 7 minutes. Electrical connections were established safely, on the circuit board mounted on CSP, thus repaired. This new board assembly was again subjected to thermal cycle tests L-L and A-A. The results observed for sample No. 5 are given below in table 4.
TABLE 4 The samples described above are presented as illustrative examples, and not as limitations, of the compositions of the invention. Many additional embodiments thereof are included within the spirit and scope of the invention.

Claims (1)

  1. CLAIMS 1.- A thermosetting resin composition, capable of sealing the imperfect cross-sectional difference between a semiconductor device, including a semiconductor capsule mounted on a carrier substrate, and a circuit board to which the semiconductor device is electrically connected; whose reaction products are capable of softening and losing their adhesion by exposure to temperature conditions that exceed those used to cure the composition; said composition characterized in that it comprises: (a) an epoxy resin component, a portion of which comprises an epoxy compound having at least one thermally breakable tie; (b) optionally, an inorganic filler component; and (c) a curing agent component comprising a member selected from the group consisting of anhydride compounds, amine compounds, amide compounds, imidazole compounds and combinations thereof. 2. The composition according to claim 1, further characterized in that the epoxy compound having at least one ligature that can be thermally broken, can be selected from those that fall within the following formula: wherein each R is independently selected from hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertbutyl, alkoxy of 1 to 4 carbon atoms, halogen, cyano and nitro; and each R3 is independently selected from hydrogen, methyl, ethyl, propyl and isopropyl; R ^ and R2 are each independently selected from hydrogen, methyl, ethyl and propyl; provided that both R-1 and R 2 can not be hydrogen and m is 0 or 1. 3. The composition according to claim 2, further characterized in that the epoxy compound having at least one ligation that can be thermally broken is a member selected from the group consisting of: III 4. - The composition according to claim 2, further characterized in that the epoxy compound having at least one thermally breakable ligature is: 5. - The composition according to claim 1, further characterized in that it comprises a fluidity imparting agent. 6. The composition according to claim 5, further characterized in that the fluidity imparting agent is a member selected from the group consisting of silanes, titanates and combinations thereof. The composition according to claim 1, further characterized in that it comprises an adhesion promoter. 8. The composition according to claim 7, further characterized in that the adhesion promoter is a member selected from the group consisting of glycidyltrimethoxysilane, gamma-aminopropyltriethoxysilane, and combinations thereof. 9. The composition according to claim 1, further characterized in that it additionally comprises a cyanate ester. 10. The composition according to claim 9, further characterized in that the cyanate ester is a member selected from the group consisting of: dicyanatobenzenes, tricyanatobenzenes, dicyanatonaphthalenes, triacthonaphthalenes, dicyanatobiphenyl, bis (cyanoatiphenyl) methanes and their alkyl derivatives; bis (dihalogenocyanatophenyl) propanes, bis (cyanatofenyl) ethers, bis (cyanatofenyl) sulfides, bis (cyanatofenil) propanes, tris (cyanatofenyl) phosphites, tris (cyanatofenyl) phosphates, bis (halogenocyanatophenol) methanes, cyanolated novolac, bis [cyanatophenyl (methylethylidene)] benzene, thermoplastic oligomers terminated with cyanated bisphenol, and combinations thereof. 11. - The composition according to claim 1, further characterized in that the inorganic filler component of the group consisting of materials constructed of or containing reinforcing silicas, aluminum oxide, silicon nitride, aluminum nitride, nitride can be selected. of aluminum coated with silica, boron nitride and their combinations. 12. The composition according to claim 1, further characterized in that the inorganic filler component has a low ionic concentration and a particle size in the approximate range of 2 to 10 microns. 13. The composition according to claim 1, further characterized in that the anhydride compounds of the curing agent component can be selected from the group consisting of hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrole) -3- anhydride. methyl-3-cyclohexen-1,2-dicarboxylic acid, and combinations thereof. 14. The composition according to claim 1, further characterized in that the amine compounds of the curing agent component can be selected from the group consisting of: dicyanodiamide, diethylene triamine, triethylene tetraamine, diethylaminopropylamine, m-xylene diamine, diaminodiphenylamine, isophorone diamine, menten diamine , polyamides and their combinations. 15.- The composition in accordance with the claim 1, further characterized in that the amide compounds of the curing agent component can be selected from the group consisting of dicyanodiamide and combinations thereof. 16. The composition according to claim 1, further characterized in that the midazole compounds of the curing agent component can be selected from the group consisting of imidazole, isoimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-dimethyl imidazole, butyl imidazole, 2-heptadecenyl-4-methylimidazole, 2-methylimidazole, 2-undecenylimidazole, 1-vinyl-2-methyl-imidazole, 2-n-heptadecylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2 -ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl i midazole, 1-cyanoethyl-2-phenylimidazole, 1-guanaminoethyl-2-methylimidazole; the addition products of a midazole and trimellitic acid, the addition products of an imidazole and 2-n-heptadecyl-4-methylimidazole, phenylimidazole, benzylimidazole, 2-methyl-4,5-diphenylimidazole, 2,3,5- trifenilimidazoi, 2-styrylimidazole, 1- (dodecylbenzyl) -2-methylimidazole, 2- (2-hydroxy-4-terbutyl phenyl) -4,5-di-phenylimidazole, 2- (3-hydroxyphenyl) -4,5-diphenyl imidazole 2- (p-dimethylaminophenyl) -4,5-diphenylimidazole, 2- (2-hydroxy-phenyl) -4,5-diphenyl imidazole, di (4,5-diphenyl-2-imidazole) -benzene-1, 4.2 -naphthyl-4,5-diphenylimidazole, 1-benzyl-2-methylimidazole, 2-p-methoxystirylimidazole and combinations thereof. 17. The composition according to claim 1, further characterized in that the curing agent component is used in an amount of about 3 to 60 parts by weight, per 100 parts by weight of the epoxy resin. 18. - The composition according to claim 1, further characterized in that the curing agent component is used in an amount of about 5 to 40 parts by weight per 100 parts of the epoxy resin. 19.- The composition in accordance with the claim 5, further characterized in that the flow imparting agent is selected from octyltrimethoxysilane, methacryloxypropyltrimethoxysilane, tetracis [2,2-bis [(2-propenyloxy) methyl] -1-butanolate-0] [is (ditridecylphos-phyto-0), diacid ] 2 of titanium IV, and their combinations. 20.- The composition in accordance with the claim 5, further characterized in that the flow-imparting agent is used in an amount up to about 2 parts by weight, per 100 parts of the epoxy resin. 21. The composition according to claim 1, further characterized in that it has a viscosity in the approximate range of 500 to 70,000 cps. 22. A thermosetting resin composition, capable of sealing the imperfect cross-sectional space between a semiconductor device including a semiconductor capsule mounted on a carrier substrate, and a circuit board to which the semiconductor device is electrically connected; whose reaction products are capable of softening and losing their adhesion when exposed to temperature conditions exceeding those used to cure the composition; said composition characterized in that it comprises: (a) an epoxy resin component, a portion of which comprises an epoxy compound having at least one thermally breakable ligature, in an amount within the range of about 20 to 65 percent by weight, based on the total weight of the composition; (b) an inorganic filler component, in an amount up to about 60 weight percent, based on the total weight of the composition; (c) a curing agent component, in an amount within the range of 2 to about 50 weight percent, based on the total weight of the composition; and (d) a flow imparting agent, in an amount up to about 0.5 weight percent, based on the total weight of the composition. 23. The reaction products formed from the compositions according to any of claims 1 to 22. 24.- An electronic device, characterized in that it comprises a semiconductor device and a circuit board, to which the device is electrically connected. semiconductor, assembled using a thermosetting resin composition according to any of claims 1 to 21, as an imperfect cross-sectional space sealant between the semiconductor device and the circuit board; wherein the reaction products of the composition are able to soften and lose their adhesion when exposed to temperature conditions that exceed those used to cure the composition. This invention relates to thermosetting resin compositions, useful for mounting semiconductor devices in a circuit board, for example, capsule-size or capsule-scale ("CSP"), spherical grid ("BGA") devices and the like.; each of which has a semiconductor capsule, such as large-scale integration ("LSI"), on a carrier substrate. The compositions of this invention can be reworked when subjected to appropriate conditions.
MXPA00011554 1999-03-23 2000-11-23 Reworkable thermosetting resin compositions MXPA00011554A (en)

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WO2001074798A1 (en) * 2000-03-31 2001-10-11 Loctite Corporation Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
WO2001083607A1 (en) * 2000-04-21 2001-11-08 Henkel Loctite Corporation Rheology-controlled epoxy-based compositions
WO2002058108A2 (en) 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
CN101044183B (en) * 2004-10-20 2011-06-29 关西涂料株式会社 Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product
JP2006303192A (en) * 2005-04-20 2006-11-02 Sumitomo Bakelite Co Ltd Semiconductor device and method for reproducing chip
KR101132920B1 (en) * 2006-01-12 2012-04-04 에스케이 텔레콤주식회사 System for monitoring reverse call information using mobile network
CN101583489A (en) * 2007-01-16 2009-11-18 住友电木株式会社 Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies
EP2976380B1 (en) * 2013-03-22 2018-10-10 Henkel IP & Holding GmbH Diene/dienophile couples and thermosetting resin compositions having reworkability
CN108219367B (en) * 2016-12-22 2022-05-13 广东生益科技股份有限公司 Halogen-free thermosetting resin composition, prepreg containing same, laminated board and printed circuit board
CN113046007A (en) * 2021-03-22 2021-06-29 东莞澳中新材料科技股份有限公司 Thermal de-bonding composition, thermal de-bonding protective film comprising same and preparation method

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