MX9305031A - Metodo y aparato para la aplicacion de fundente. - Google Patents
Metodo y aparato para la aplicacion de fundente.Info
- Publication number
- MX9305031A MX9305031A MX9305031A MX9305031A MX9305031A MX 9305031 A MX9305031 A MX 9305031A MX 9305031 A MX9305031 A MX 9305031A MX 9305031 A MX9305031 A MX 9305031A MX 9305031 A MX9305031 A MX 9305031A
- Authority
- MX
- Mexico
- Prior art keywords
- flux
- board
- dosing
- dosing head
- relative
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Se describe un aparato dosificador para la aplicación de una corriente delgada de fundente a una superficie de un tablero de circuito impreso. La cabeza de dosificación recorre a un alto índice de velocidad en relación con el tablero durante la dosificación del fundente, para aplicar capas delgadas de fundente al mismo. De preferencia, la cabeza de dosificación se mueve a una velocidad de aproximadamente 20 a 90 pulgadas por segundo. Las puntas que dosifican el fundente se disponen angularmente en relación con el tablero, y si se desea, hacen múltiples pasadas sobre la superficie, para recubrir las secciones seleccionadas dos veces. Bien sea el tablero se avanza incrementalmente a través de la estación de fundente, o la cabeza de dosificación se avanza incrementalmente en relación con el tablero, de tal manera que el fundente se aplica cuando el tablero está estacionario. La cabeza de dosificación se puede disponer arriba del tablero, pero de diferencia se localiza debajo del tablero. Se localiza un material absorbente arriba del tablero, para recolectar cualquier cantidad diminuta de flujo derivado. Todos los componentes se localizan afuera de la cámara de trabajo, para limitar el potencial de una reacción adversa con los fundentes basados en alcohol.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/931,786 US5328085A (en) | 1992-08-18 | 1992-08-18 | Apparatus for applying flux |
US9066393A | 1993-07-13 | 1993-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9305031A true MX9305031A (es) | 1994-05-31 |
Family
ID=26782507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9305031A MX9305031A (es) | 1992-08-18 | 1993-08-18 | Metodo y aparato para la aplicacion de fundente. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5615828A (es) |
MX (1) | MX9305031A (es) |
WO (1) | WO1994004305A1 (es) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19535688A1 (de) * | 1995-09-26 | 1997-03-27 | Philips Patentverwaltung | Wellenlötmaschine und Verfahren zur Einstellung und automatischen Kontrolle der Höhe einer Lötwelle |
US5938848A (en) * | 1996-06-27 | 1999-08-17 | Nordson Corporation | Method and control system for applying solder flux to a printed circuit |
JPH10125618A (ja) * | 1996-10-23 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
US5993500A (en) * | 1997-10-16 | 1999-11-30 | Speedline Technololies, Inc. | Flux management system |
WO2002016068A2 (en) * | 2000-08-24 | 2002-02-28 | Advanced Micro Devices, Inc. | Controlled and programmed deposition of flux on a flip-chip die by spraying |
JP2002100857A (ja) * | 2000-09-25 | 2002-04-05 | Matsushita Electric Ind Co Ltd | フラックス塗布方法、フローはんだ付け方法およびこれらのための装置ならびに電子回路基板 |
NL1017843C2 (nl) * | 2001-04-12 | 2002-10-22 | Vitronics Soltec B V | Inrichting voor selectief solderen. |
US6913182B2 (en) | 2002-01-18 | 2005-07-05 | Precision Dispensing Equipment, Inc. | Method and apparatus for controlled application of flux |
EP1452260A1 (de) * | 2003-02-26 | 2004-09-01 | Behr GmbH & Co. | Vorrichtung und Verfahren zum Aufbringen eines Flussmittels für das Hartlöten von Teilen |
US20040224541A1 (en) * | 2003-05-09 | 2004-11-11 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
TWI288885B (en) * | 2004-06-24 | 2007-10-21 | Checkpoint Systems Inc | Die attach area cut-on-fly method and apparatus |
US8122847B2 (en) * | 2009-06-29 | 2012-02-28 | Ttm Technologies, Inc. | System for filling holes in a printed circuit board with a fluid fill material |
US8444770B2 (en) * | 2009-06-29 | 2013-05-21 | Ttm Technologies, Inc. | System for cleaning components for filling holes in a printed circuit board with a fluid fill material |
JP5762137B2 (ja) * | 2011-05-27 | 2015-08-12 | 上村工業株式会社 | めっき方法 |
KR102034820B1 (ko) * | 2012-11-30 | 2019-11-08 | 삼성전자주식회사 | 반도체 칩 실장장치 및 이를 이용한 반도체 칩의 실장방법 |
CN106312228A (zh) * | 2015-06-25 | 2017-01-11 | 安徽超威电源有限公司 | 一种助焊剂添加装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4697730A (en) * | 1984-05-25 | 1987-10-06 | The Htc Corporation | Continuous solder system |
EP0209995B1 (en) * | 1985-07-10 | 1994-08-31 | Evenoak Limited | Soldering method |
US4695482A (en) * | 1986-01-21 | 1987-09-22 | Weiswurm Klaus D | Method and apparatus for coating of circuit boards |
JPS62282773A (ja) * | 1986-05-30 | 1987-12-08 | Apollo Seiko Kk | 自動半田付け方法及び装置 |
US4806706A (en) * | 1987-04-08 | 1989-02-21 | Nippon Cmk Corp. | Printed wiring board |
US4796795A (en) * | 1987-10-13 | 1989-01-10 | Cooper Industries, Inc. | Flux fume removal device |
US4986462A (en) * | 1988-03-02 | 1991-01-22 | General Dynamics Corporation | Method for cleaning and/or fluxing circuit card assemblies |
DE3809156A1 (de) * | 1988-03-18 | 1989-09-28 | Ernst Hohnerlein | Verfahren und vorrichtung zum auftragen eines flussmittels |
US4821948A (en) * | 1988-04-06 | 1989-04-18 | American Telephone And Telegraph Company | Method and apparatus for applying flux to a substrate |
US5038706A (en) * | 1988-05-27 | 1991-08-13 | Teledyne Industries, Inc. | Printed circuits board soldering apparatus |
US4848271A (en) * | 1988-07-06 | 1989-07-18 | General Electric Company | Flux applying apparatus |
US4898320A (en) * | 1988-11-21 | 1990-02-06 | Honeywell, Inc. | Method of manufacturing a high-yield solder bumped semiconductor wafer |
US4967933A (en) * | 1989-02-27 | 1990-11-06 | Asymptotic Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US5052338A (en) * | 1990-01-31 | 1991-10-01 | Asymptotic Technologies, Inc. | Apparatus for dispensing viscous materials a constant height above a workpiece surface |
US5065692A (en) * | 1990-04-30 | 1991-11-19 | At&T Bell Laboratories | Solder flux applicator |
US5065932A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corporation | Solder placement nozzle with inert cover gas and inert gas bleed |
US5042708A (en) * | 1990-09-24 | 1991-08-27 | International Business Machines Corporation | Solder placement nozzle assembly |
US5074455A (en) * | 1990-10-09 | 1991-12-24 | Motorola, Inc. | Solder flux dispenser suitable for use in automated manufacturing |
US5145531A (en) * | 1990-10-31 | 1992-09-08 | Hughes Aircraft Company | Fluxing apparatus and method |
US5328085A (en) * | 1992-08-18 | 1994-07-12 | Precision Dispensing Equipment, Inc. | Apparatus for applying flux |
US5368219A (en) * | 1993-11-04 | 1994-11-29 | Nordson Corporation | Method and apparatus for applying solder flux to a printed circuit |
-
1993
- 1993-08-17 WO PCT/US1993/007741 patent/WO1994004305A1/en active Application Filing
- 1993-08-18 MX MX9305031A patent/MX9305031A/es unknown
-
1995
- 1995-03-02 US US08/397,395 patent/US5615828A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1994004305A1 (en) | 1994-03-03 |
US5615828A (en) | 1997-04-01 |
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