JPS55164623A - Preparation of plaster - Google Patents

Preparation of plaster

Info

Publication number
JPS55164623A
JPS55164623A JP7060379A JP7060379A JPS55164623A JP S55164623 A JPS55164623 A JP S55164623A JP 7060379 A JP7060379 A JP 7060379A JP 7060379 A JP7060379 A JP 7060379A JP S55164623 A JPS55164623 A JP S55164623A
Authority
JP
Japan
Prior art keywords
effective component
printing technique
ink
jet printing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7060379A
Other languages
Japanese (ja)
Inventor
Yoshifumi Takahashi
Kunihiko Miwa
Masayuki Miyatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink Mfg Co Ltd
Original Assignee
Toyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Mfg Co Ltd filed Critical Toyo Ink Mfg Co Ltd
Priority to JP7060379A priority Critical patent/JPS55164623A/en
Publication of JPS55164623A publication Critical patent/JPS55164623A/en
Pending legal-status Critical Current

Links

Landscapes

  • Medicinal Preparation (AREA)

Abstract

PURPOSE: To prepare a plaster having a uniform layer of effective component, in high productivity, by applying the effective component to the substrate by ink-jet printing technique.
CONSTITUTION: An adhesive layer is applied to a surface of a substrate. A liquid composition containing an effective component such as methyl salicylate, menthol, camphor, thymol, mint oil, etc. is applied to the surface of the adhesive layer by ink-jet printing technique. The ink-jet printing technique is a relatively new printing technique, which can apply an inke uniformly with a desired pattern. Since the effective component is applied to the substrate separately from the adhesive component, the amount of the expensive effective component can be reduced.
COPYRIGHT: (C)1980,JPO&Japio
JP7060379A 1979-06-07 1979-06-07 Preparation of plaster Pending JPS55164623A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7060379A JPS55164623A (en) 1979-06-07 1979-06-07 Preparation of plaster

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7060379A JPS55164623A (en) 1979-06-07 1979-06-07 Preparation of plaster

Publications (1)

Publication Number Publication Date
JPS55164623A true JPS55164623A (en) 1980-12-22

Family

ID=13436305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7060379A Pending JPS55164623A (en) 1979-06-07 1979-06-07 Preparation of plaster

Country Status (1)

Country Link
JP (1) JPS55164623A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1501120A1 (en) * 2003-05-26 2005-01-26 Shinko Electric Co. Ltd. Method for thinning wafer by grinding
US20100068247A1 (en) * 2008-09-16 2010-03-18 Tsung-Wei Robert Mou Method And System For Providing Targeted And Individualized Delivery Of Cosmetic Actives
US8358348B2 (en) 2008-05-09 2013-01-22 Elc Management Llc Method and system for automatic or manual evaluation to provide targeted and individualized delivery of cosmetic actives in a mask or patch form
US8491926B2 (en) 2008-09-16 2013-07-23 Elc Management Llc Method and system for automatic or manual evaluation to provide targeted and individualized delivery of cosmetic actives in a mask or patch form
US8597667B2 (en) 2008-05-09 2013-12-03 Elc Management Llc Targeted and individualized cosmetic delivery

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1501120A1 (en) * 2003-05-26 2005-01-26 Shinko Electric Co. Ltd. Method for thinning wafer by grinding
US6958298B2 (en) 2003-05-26 2005-10-25 Shinko Electric Industries Co., Ltd. Method for thinning wafer by grinding
US8358348B2 (en) 2008-05-09 2013-01-22 Elc Management Llc Method and system for automatic or manual evaluation to provide targeted and individualized delivery of cosmetic actives in a mask or patch form
US8597667B2 (en) 2008-05-09 2013-12-03 Elc Management Llc Targeted and individualized cosmetic delivery
US20100068247A1 (en) * 2008-09-16 2010-03-18 Tsung-Wei Robert Mou Method And System For Providing Targeted And Individualized Delivery Of Cosmetic Actives
US8425477B2 (en) * 2008-09-16 2013-04-23 Elc Management Llc Method and system for providing targeted and individualized delivery of cosmetic actives
US8491926B2 (en) 2008-09-16 2013-07-23 Elc Management Llc Method and system for automatic or manual evaluation to provide targeted and individualized delivery of cosmetic actives in a mask or patch form

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