MX9100563A - Componentes de paquetes electronicos,de aluminio anodizado y de proceso para su produccion - Google Patents

Componentes de paquetes electronicos,de aluminio anodizado y de proceso para su produccion

Info

Publication number
MX9100563A
MX9100563A MX9100563A MX9100563A MX9100563A MX 9100563 A MX9100563 A MX 9100563A MX 9100563 A MX9100563 A MX 9100563A MX 9100563 A MX9100563 A MX 9100563A MX 9100563 A MX9100563 A MX 9100563A
Authority
MX
Mexico
Prior art keywords
production
components
anodized aluminum
electronic packages
packages
Prior art date
Application number
MX9100563A
Other languages
English (en)
Inventor
Anthony Mark Pasqualoni
Deepak Mahulikar
Satish Kumar Jalota
Anderu James Brock
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX9100563A publication Critical patent/MX9100563A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/14—Producing integrally coloured layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Treatment Of Metals (AREA)
MX9100563A 1990-08-17 1991-08-07 Componentes de paquetes electronicos,de aluminio anodizado y de proceso para su produccion MX9100563A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/568,818 US5066368A (en) 1990-08-17 1990-08-17 Process for producing black integrally colored anodized aluminum components

Publications (1)

Publication Number Publication Date
MX9100563A true MX9100563A (es) 1992-04-01

Family

ID=24272870

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9100563A MX9100563A (es) 1990-08-17 1991-08-07 Componentes de paquetes electronicos,de aluminio anodizado y de proceso para su produccion

Country Status (7)

Country Link
US (2) US5066368A (es)
EP (1) EP0724778A1 (es)
JP (1) JP2934504B2 (es)
AU (1) AU8523491A (es)
CA (1) CA2088165A1 (es)
MX (1) MX9100563A (es)
WO (1) WO1992003846A1 (es)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239131A (en) * 1992-07-13 1993-08-24 Olin Corporation Electronic package having controlled epoxy flow
US5315155A (en) * 1992-07-13 1994-05-24 Olin Corporation Electronic package with stress relief channel
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
TW238419B (es) * 1992-08-21 1995-01-11 Olin Corp
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
US5477008A (en) * 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
US5436407A (en) * 1994-06-13 1995-07-25 Integrated Packaging Assembly Corporation Metal semiconductor package with an external plastic seal
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
US5892278A (en) * 1996-05-24 1999-04-06 Dai Nippon Printingco., Ltd. Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same
TW342142U (en) * 1997-05-13 1998-10-01 Caesar Technology Inc A super slim IC structure
US5952083A (en) * 1997-10-21 1999-09-14 Advanced Technology Interconnect, Inc. Aluminum alloys for electronic components
US6365028B1 (en) * 1997-12-17 2002-04-02 Isle Coat Limited Method for producing hard protection coatings on articles made of aluminum alloys
US6778398B2 (en) 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package
US20050218004A1 (en) * 2003-11-26 2005-10-06 Calphalon Corporation Process for making a composite aluminum article
US7515431B1 (en) 2004-07-02 2009-04-07 Apple Inc. Handheld computing device
KR100726240B1 (ko) * 2005-10-04 2007-06-11 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
US7911771B2 (en) * 2007-05-23 2011-03-22 Apple Inc. Electronic device with a metal-ceramic composite component
US8824140B2 (en) 2010-09-17 2014-09-02 Apple Inc. Glass enclosure
CA2824541A1 (en) 2011-02-08 2012-08-16 Cambridge Nanotherm Limited Insulated metal substrate
US9512536B2 (en) 2013-09-27 2016-12-06 Apple Inc. Methods for forming white anodized films by metal complex infusion
DE212014000273U1 (de) 2014-08-29 2017-04-26 Apple Inc. Prozess zur Minderung der Spallation anodischer Oxidschichten von hochfesten Substratlegierungen
EP3038114B1 (de) 2014-12-23 2019-02-06 Hydro Aluminium Rolled Products GmbH Aluminiumlegierung für Leadframes
WO2016111693A1 (en) 2015-01-09 2016-07-14 Apple Inc. Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys
US9869623B2 (en) 2015-04-03 2018-01-16 Apple Inc. Process for evaluation of delamination-resistance of hard coatings on metal substrates
US20160289858A1 (en) * 2015-04-03 2016-10-06 Apple Inc. Process to mitigate grain texture differential growth rates in mirror-finish anodized aluminum
US10760176B2 (en) 2015-07-09 2020-09-01 Apple Inc. Process for reducing nickel leach rates for nickel acetate sealed anodic oxide coatings
US10711363B2 (en) 2015-09-24 2020-07-14 Apple Inc. Anodic oxide based composite coatings of augmented thermal expansivity to eliminate thermally induced crazing
US9970080B2 (en) 2015-09-24 2018-05-15 Apple Inc. Micro-alloying to mitigate the slight discoloration resulting from entrained metal in anodized aluminum surface finishes
US10760175B2 (en) 2015-10-30 2020-09-01 Apple Inc. White anodic films with multiple layers
US10174436B2 (en) 2016-04-06 2019-01-08 Apple Inc. Process for enhanced corrosion protection of anodized aluminum
US11352708B2 (en) 2016-08-10 2022-06-07 Apple Inc. Colored multilayer oxide coatings
US20180080138A1 (en) * 2016-09-22 2018-03-22 Apple Inc. Processes for reducing surface concentration of dyes in anodic oxides
US10927473B2 (en) * 2016-09-22 2021-02-23 Apple Inc. Oxide coatings for metal surfaces
US11242614B2 (en) 2017-02-17 2022-02-08 Apple Inc. Oxide coatings for providing corrosion resistance on parts with edges and convex features
WO2019098378A1 (ja) * 2017-11-17 2019-05-23 株式会社東亜電化 黒色酸化被膜を備えるマグネシウム又はアルミニウム金属部材及びその製造方法
US11549191B2 (en) 2018-09-10 2023-01-10 Apple Inc. Corrosion resistance for anodized parts having convex surface features
US12085734B1 (en) 2020-04-20 2024-09-10 Apple Inc. Electronic devices with low-reflectance coatings
CN115548589A (zh) * 2022-10-24 2022-12-30 楚能新能源股份有限公司 一种电池模组用汇流排及其制备方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL238065A (es) * 1958-04-14
GB1022423A (en) * 1964-03-20 1966-03-16 Reynolds Metals Co Anodizing aluminium and alloys thereof
US3423298A (en) * 1966-07-05 1969-01-21 Olin Mathieson Process for coloring aluminum
US3328274A (en) * 1966-11-25 1967-06-27 Kaiser Aluminium Chem Corp Method of anodizing aluminum
US3708407A (en) * 1968-09-09 1973-01-02 Scionics Corp Process for anodizing aluminum and its alloys
US3597339A (en) * 1968-09-09 1971-08-03 Scionics Of California Inc Process for anodizing aluminum and its alloys
US4026781A (en) * 1969-08-07 1977-05-31 Scionics Of California Inc. Anodizing means and techniques
US3639221A (en) * 1969-12-22 1972-02-01 Kaiser Aluminium Chem Corp Process for integral color anodizing
US3669855A (en) * 1970-01-28 1972-06-13 Kaiser Aluminium Chem Corp Control of integral color anodizing process
DE2207232C3 (de) * 1971-02-24 1975-09-18 Sumitomo Chemical Co., Ltd., Osaka (Japan) Verfahren zur Herstellung von in sich gefärbte n anodischen Oxidschichten auf Aluminiumlegierungen
US3860503A (en) * 1971-07-30 1975-01-14 Riken Light Metal Ind Co Method for forming a colored coating on aluminous materials
US3714000A (en) * 1971-11-29 1973-01-30 Kaiser Aluminium Chem Corp Integral color anodizing of aluminum
US3793089A (en) * 1971-12-22 1974-02-19 Kaiser Aluminium Chem Corp Aluminum sheet
US3819938A (en) * 1973-02-01 1974-06-25 Gen Electric Opto-electronic transducers for object detection
US4193848A (en) * 1973-08-13 1980-03-18 Swiss Aluminium Ltd. Process for the production of composite material
US3956675A (en) * 1974-10-15 1976-05-11 Robertshaw Controls Company Electrical control housing and support package
US3945895A (en) * 1974-12-05 1976-03-23 Fujisash Industries, Ltd. Method of producing colored anodic coating on aluminum and its alloys
US4100041A (en) * 1976-04-14 1978-07-11 Toyo Chuo Kagaku Kenkyusho Method of forming a colored and oxide film on aluminum and aluminum alloys
DE7813233U1 (de) * 1978-04-29 1978-08-24 Jenaer Glaswerk Schott & Gen., 6500 Mainz Glas- oder glaskeramik- heiz- und/oder kochflaeche mit angeklebten rahmen- und befestigungselementen
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE3104623A1 (de) * 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer
JPS59162300A (ja) * 1983-03-07 1984-09-13 Fujisash Co 接着性が改善されたアルミニウム材又はアルミニウム合金材の製造方法
JPS6192449A (ja) * 1984-10-12 1986-05-10 Fuji Photo Film Co Ltd エア−サンドイツチ型情報記録媒体
JPS63112193A (ja) * 1986-10-31 1988-05-17 Nippon Parkerizing Co Ltd 平版印刷用アルミニウム基板の製造方法
US4771637A (en) * 1987-03-18 1988-09-20 Kistler Instrument Corporation Accelerometer
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
US4898651A (en) * 1988-01-15 1990-02-06 International Business Machines Corporation Anodic coatings on aluminum for circuit packaging
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
DE3806738C1 (es) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
US4931151A (en) * 1989-04-11 1990-06-05 Novamax Technologies Holdings Inc. Method for two step electrolytic coloring of anodized aluminum
JPH02112580A (ja) * 1989-09-14 1990-04-25 Fujisash Co 室内建具の組子桟構造
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference

Also Published As

Publication number Publication date
US5403975A (en) 1995-04-04
WO1992003846A1 (en) 1992-03-05
JP2934504B2 (ja) 1999-08-16
EP0724778A1 (en) 1996-08-07
JPH06500360A (ja) 1994-01-13
AU8523491A (en) 1992-03-17
EP0724778A4 (en) 1995-08-14
US5066368A (en) 1991-11-19
CA2088165A1 (en) 1992-02-18

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