MX365809B - Uso de cetal como solvente y adhesivos y composición de adhesivo que contiene cetal. - Google Patents
Uso de cetal como solvente y adhesivos y composición de adhesivo que contiene cetal.Info
- Publication number
- MX365809B MX365809B MX2014014628A MX2014014628A MX365809B MX 365809 B MX365809 B MX 365809B MX 2014014628 A MX2014014628 A MX 2014014628A MX 2014014628 A MX2014014628 A MX 2014014628A MX 365809 B MX365809 B MX 365809B
- Authority
- MX
- Mexico
- Prior art keywords
- ketal
- adhesive composition
- adhesives
- solvent
- dioxolane
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000002904 solvent Substances 0.000 title abstract 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract 3
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- 229920001084 poly(chloroprene) Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J111/00—Adhesives based on homopolymers or copolymers of chloroprene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/095—Oxygen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2311/00—Characterised by the use of homopolymers or copolymers of chloroprene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
- C08K5/1565—Five-membered rings
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
La presente invención se refiere al uso de un cetal cíclico, 2-metil-2-etil-1,3-dioxolano, como disolvente en adhesivos y una composición adhesiva que contenga tal cetal. El cetal 2-metil-2-etil-1,3-dioxolano presenta una elevada potencia solubilizante para el polímero policloropreno, formando soluciones con elevada viscosidad y tiempo e secado adecuado después de la aplicación en forma de una película a una superficie. Debido a su desempeño técnico satisfactorio, la composición adhesiva con la formulación de acuerdo con la invención tiene buena aceptación comercial y puede usarse en vez de las composiciones que contienen tolueno u otros disolventes aromáticos y oxigenados.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRBR102012013353-9A BR102012013353A2 (pt) | 2012-06-01 | 2012-06-01 | Uso de cetal como solvente em adesivos, e, composição de adesivo contendo cetal |
| PCT/BR2013/000166 WO2013177641A1 (pt) | 2012-06-01 | 2013-05-13 | Uso de cetal como solvente em adesivos, e, composição de adesivo contendo cetal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2014014628A MX2014014628A (es) | 2015-08-10 |
| MX365809B true MX365809B (es) | 2019-06-14 |
Family
ID=49672200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2014014628A MX365809B (es) | 2012-06-01 | 2013-05-13 | Uso de cetal como solvente y adhesivos y composición de adhesivo que contiene cetal. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9464215B2 (es) |
| AR (1) | AR092010A1 (es) |
| BR (1) | BR102012013353A2 (es) |
| CL (1) | CL2014003282A1 (es) |
| MX (1) | MX365809B (es) |
| WO (1) | WO2013177641A1 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101849085B1 (ko) * | 2013-11-25 | 2018-04-16 | 코웨이 주식회사 | 변좌 어셈블리 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3718867B2 (ja) | 1994-05-09 | 2005-11-24 | 東ソー株式会社 | 接着剤用ラテックス及びそれを用いたクロロプレン系接着剤組成物 |
| US5773113A (en) * | 1996-11-21 | 1998-06-30 | Brady Precision Tape Co. | Adhesive compositions for electronic applications |
| US6469082B1 (en) * | 2001-06-29 | 2002-10-22 | Illinois Tool Works, Inc. | Low VOC solvent-based polychloroprene contact adhesive |
| JP5844109B2 (ja) | 2010-11-25 | 2016-01-13 | 株式会社ダイセル | 環状アセタール化合物を含む接着剤 |
-
2012
- 2012-06-01 BR BRBR102012013353-9A patent/BR102012013353A2/pt not_active Application Discontinuation
-
2013
- 2013-05-13 WO PCT/BR2013/000166 patent/WO2013177641A1/pt not_active Ceased
- 2013-05-13 US US14/404,810 patent/US9464215B2/en not_active Expired - Fee Related
- 2013-05-13 MX MX2014014628A patent/MX365809B/es active IP Right Grant
- 2013-05-30 AR ARP130101906A patent/AR092010A1/es unknown
-
2014
- 2014-11-28 CL CL2014003282A patent/CL2014003282A1/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CL2014003282A1 (es) | 2015-06-12 |
| MX2014014628A (es) | 2015-08-10 |
| US9464215B2 (en) | 2016-10-11 |
| WO2013177641A1 (pt) | 2013-12-05 |
| US20150152296A1 (en) | 2015-06-04 |
| BR102012013353A2 (pt) | 2014-04-29 |
| AR092010A1 (es) | 2015-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |