MX338271B - Empaque de microelectrónica de alta densisdad. - Google Patents

Empaque de microelectrónica de alta densisdad.

Info

Publication number
MX338271B
MX338271B MX2013011403A MX2013011403A MX338271B MX 338271 B MX338271 B MX 338271B MX 2013011403 A MX2013011403 A MX 2013011403A MX 2013011403 A MX2013011403 A MX 2013011403A MX 338271 B MX338271 B MX 338271B
Authority
MX
Mexico
Prior art keywords
packaging
high density
microelectronics
microelectronics packaging
density microelectronics
Prior art date
Application number
MX2013011403A
Other languages
English (en)
Other versions
MX2013011403A (es
Inventor
Tao Xu
Harmel Jean Defretin
Glenn Gardner
Original Assignee
Schlumberger Technology Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technology Bv filed Critical Schlumberger Technology Bv
Publication of MX2013011403A publication Critical patent/MX2013011403A/es
Publication of MX338271B publication Critical patent/MX338271B/es

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    • H—ELECTRICITY
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    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Luminescent Compositions (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

En la presente se provee un empaque de microelectrónica ilustrativo y métodos ilustrativos para manufacturar el mismo. El empaque puede permitir y/o mejorar el uso de microelectrónica en un orificio profundo, ajustes de alta temperatura y/o alta presión. El empaque de microelectrónica puede incluir componentes activos de doble lado, disipadores de calor y/o apilamiento tridimensional de dados.
MX2013011403A 2011-04-01 2012-03-29 Empaque de microelectrónica de alta densisdad. MX338271B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161470579P 2011-04-01 2011-04-01
PCT/US2012/031060 WO2012135406A2 (en) 2011-04-01 2012-03-29 High density microelectronics packaging

Publications (2)

Publication Number Publication Date
MX2013011403A MX2013011403A (es) 2014-01-31
MX338271B true MX338271B (es) 2016-04-11

Family

ID=46932330

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013011403A MX338271B (es) 2011-04-01 2012-03-29 Empaque de microelectrónica de alta densisdad.

Country Status (6)

Country Link
US (1) US9431375B2 (es)
EP (1) EP2695188A4 (es)
BR (1) BR112013025345A2 (es)
CA (1) CA2831916A1 (es)
MX (1) MX338271B (es)
WO (1) WO2012135406A2 (es)

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US8659143B2 (en) * 2011-10-03 2014-02-25 Invensas Corporation Stub minimization for wirebond assemblies without windows
US9920617B2 (en) 2014-05-20 2018-03-20 Baker Hughes, A Ge Company, Llc Removeable electronic component access member for a downhole system
US9976404B2 (en) 2014-05-20 2018-05-22 Baker Hughes, A Ge Company, Llc Downhole tool including a multi-chip module housing
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US20150130040A1 (en) 2015-05-14
BR112013025345A2 (pt) 2017-10-17

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