MX336211B - Panel de circuito impreso. - Google Patents

Panel de circuito impreso.

Info

Publication number
MX336211B
MX336211B MX2012009680A MX2012009680A MX336211B MX 336211 B MX336211 B MX 336211B MX 2012009680 A MX2012009680 A MX 2012009680A MX 2012009680 A MX2012009680 A MX 2012009680A MX 336211 B MX336211 B MX 336211B
Authority
MX
Mexico
Prior art keywords
wiring board
printed wiring
mount device
venting hole
surface mount
Prior art date
Application number
MX2012009680A
Other languages
English (en)
Other versions
MX2012009680A (es
Inventor
Kazuo Maruyama
Satoshi Horigome
Original Assignee
Keihin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keihin Corp filed Critical Keihin Corp
Publication of MX2012009680A publication Critical patent/MX2012009680A/es
Publication of MX336211B publication Critical patent/MX336211B/es

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Un panel de circuito impreso en el que un dispositivo de montaje superficial se monta en un material base de aislamiento usando soldadura de tipo reflujo que utiliza pasta de soldadura, incluye una primera superficie en la cual se dispone el dispositivo de montaje superficial; y una segunda superficie en un lado opuesto a la primera superficie, en donde se forma un agujero de ventilación que penetra desde la primera superficie a la segunda superficie, y el agujero de ventilación se forma directamente debajo del dispositivo de montaje superficial.
MX2012009680A 2011-08-25 2012-08-21 Panel de circuito impreso. MX336211B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011183323A JP2013045919A (ja) 2011-08-25 2011-08-25 プリント配線板

Publications (2)

Publication Number Publication Date
MX2012009680A MX2012009680A (es) 2013-02-25
MX336211B true MX336211B (es) 2016-01-11

Family

ID=48009584

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2012009680A MX336211B (es) 2011-08-25 2012-08-21 Panel de circuito impreso.

Country Status (3)

Country Link
JP (1) JP2013045919A (es)
CN (1) CN103118481A (es)
MX (1) MX336211B (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547079B (zh) * 2013-10-24 2017-05-24 中国电子科技集团公司第四十一研究所 一种软介质电路的制作方法
JPWO2015151433A1 (ja) * 2014-04-01 2017-04-13 パナソニックＩｐマネジメント株式会社 部品実装基板
US11057985B2 (en) 2019-02-28 2021-07-06 Denso Ten Limited Printed wiring board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2938876B2 (ja) * 1988-03-09 1999-08-25 キヤノン株式会社 画像記録方法および装置
JP2517672B2 (ja) * 1989-07-17 1996-07-24 キヤノン株式会社 プリント配線基板の形成方法
JPH0373472U (es) * 1989-11-20 1991-07-24
JPH05110242A (ja) * 1991-10-17 1993-04-30 Matsushita Electric Ind Co Ltd 基 板
JPH0567046U (ja) * 1992-02-04 1993-09-03 ソニー株式会社 両面実装基板
JP2735059B2 (ja) * 1995-12-26 1998-04-02 日本電気株式会社 プリント配線板の実装部品のリペア方法
JP2002118357A (ja) * 2000-10-06 2002-04-19 Ricoh Co Ltd プリント配線基板
JP2006253396A (ja) * 2005-03-10 2006-09-21 Lite-On Technology Corp プリント回路板
CN101287332B (zh) * 2008-05-27 2011-02-09 艾默生网络能源有限公司 电路板及其加工方法
JP5627232B2 (ja) * 2009-12-28 2014-11-19 キヤノン株式会社 回路基板
US8547709B2 (en) * 2010-02-12 2013-10-01 Cyntec Co. Ltd. Electronic system with a composite substrate

Also Published As

Publication number Publication date
MX2012009680A (es) 2013-02-25
JP2013045919A (ja) 2013-03-04
CN103118481A (zh) 2013-05-22

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