MX2023006775A - Material recubierto de plata, metodo para manufacturar el material recubierto de plata y componente terminal. - Google Patents

Material recubierto de plata, metodo para manufacturar el material recubierto de plata y componente terminal.

Info

Publication number
MX2023006775A
MX2023006775A MX2023006775A MX2023006775A MX2023006775A MX 2023006775 A MX2023006775 A MX 2023006775A MX 2023006775 A MX2023006775 A MX 2023006775A MX 2023006775 A MX2023006775 A MX 2023006775A MX 2023006775 A MX2023006775 A MX 2023006775A
Authority
MX
Mexico
Prior art keywords
coated material
terminal component
manufacturing
material manufacturing
coated
Prior art date
Application number
MX2023006775A
Other languages
English (en)
Inventor
Yosuke Sato
Kentaro Arai
Yutaro Hirai
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of MX2023006775A publication Critical patent/MX2023006775A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00—Production of homogeneous polycrystalline material with defined structure
    • C30B28/04—Production of homogeneous polycrystalline material with defined structure from liquids
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)

Abstract

La presente invención se relaciona con un material recubierto de Ag y su tecnología relacionada, el material recubierto de Ag incluye un material y una película de Ag formada sobre el material, en donde el material recubierto de Ag se caracteriza porque la película de Ag incluye capas de Ag, para las cuales los diámetros de grano de cristal promedio difieren por lo menos tres veces, y por lo menos tres de las cuales se laminan alternadamente.
MX2023006775A 2020-12-10 2021-07-14 Material recubierto de plata, metodo para manufacturar el material recubierto de plata y componente terminal. MX2023006775A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020204658A JP2022092093A (ja) 2020-12-10 2020-12-10 Ａｇ被覆素材、Ａｇ被覆素材の製造方法及び端子部品
PCT/JP2021/026418 WO2022123818A1 (ja) 2020-12-10 2021-07-14 Ａｇ被覆素材、Ａｇ被覆素材の製造方法及び端子部品

Publications (1)

Publication Number Publication Date
MX2023006775A true MX2023006775A (es) 2023-06-20

Family

ID=81974365

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023006775A MX2023006775A (es) 2020-12-10 2021-07-14 Material recubierto de plata, metodo para manufacturar el material recubierto de plata y componente terminal.

Country Status (6)

Country Link
US (1) US20240018680A1 (es)
EP (1) EP4261329A1 (es)
JP (1) JP2022092093A (es)
CN (1) CN116568865A (es)
MX (1) MX2023006775A (es)
WO (1) WO2022123818A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023079476A (ja) * 2021-11-29 2023-06-08 矢崎総業株式会社 端子用めっき材並びにそれを用いた端子及び端子付き電線

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008169408A (ja) * 2007-01-09 2008-07-24 Auto Network Gijutsu Kenkyusho:Kk コネクタ用銀めっき端子
JP5209550B2 (ja) * 2009-03-23 2013-06-12 国立大学法人 熊本大学 銀めっき材の製造方法
JP5667543B2 (ja) 2011-09-30 2015-02-12 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP5848168B2 (ja) * 2012-03-14 2016-01-27 Ｄｏｗａメタルテック株式会社 銀めっき材
JP2014095139A (ja) 2012-11-12 2014-05-22 Oriental Mekki Kk 銀めっき積層体
JP6086532B2 (ja) * 2013-03-21 2017-03-01 Ｄｏｗａメタルテック株式会社 銀めっき材
JP6395560B2 (ja) 2013-11-08 2018-09-26 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP6472191B2 (ja) * 2014-02-07 2019-02-20 神鋼リードミック株式会社 差し込みコネクタ
JP6309372B2 (ja) 2014-07-01 2018-04-11 日本航空電子工業株式会社 コネクタ
WO2016121312A1 (ja) * 2015-01-30 2016-08-04 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Also Published As

Publication number Publication date
WO2022123818A1 (ja) 2022-06-16
CN116568865A (zh) 2023-08-08
JP2022092093A (ja) 2022-06-22
US20240018680A1 (en) 2024-01-18
EP4261329A1 (en) 2023-10-18

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