MX2023000110A - Sistema de adquisicion de imagenes 3d para inspeccion optica y metodo para inspeccion optica de objetos, en particular, ensambles electronicos, tableros electronicos y similares. - Google Patents
Sistema de adquisicion de imagenes 3d para inspeccion optica y metodo para inspeccion optica de objetos, en particular, ensambles electronicos, tableros electronicos y similares.Info
- Publication number
- MX2023000110A MX2023000110A MX2023000110A MX2023000110A MX2023000110A MX 2023000110 A MX2023000110 A MX 2023000110A MX 2023000110 A MX2023000110 A MX 2023000110A MX 2023000110 A MX2023000110 A MX 2023000110A MX 2023000110 A MX2023000110 A MX 2023000110A
- Authority
- MX
- Mexico
- Prior art keywords
- optical inspection
- light
- digital sensor
- inspected
- objects
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title abstract 5
- 230000003287 optical effect Effects 0.000 title abstract 5
- 230000000712 assembly Effects 0.000 title abstract 2
- 238000000429 assembly Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8848—Polarisation of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Sistema de adquisición de imágenes 3D automático (1, 10, 100) para inspección óptica de objetos (B), en particular para ensambles electrónicos, tableros electrónicos y similares, comprendiendo: una o más fuentes de luz (21, 22) configuradas para emitir una luz (2, 3) hacia un campo de visión (11) en donde se coloca un objeto (B) a ser inspeccionado; y al menos un sensor digital (31, 32, 33) que adquiere al menos parte de la luz (2, 3) reflejada por el objeto (B) a ser inspeccionado; el sensor digital (31, 32, 33) está conectado operativamente a una unidad de procesamiento de datos (90) configurada para determinar características físicas y/o geométricas del objeto (B) a ser inspeccionado con base en la luz (2', 3AB) adquirida por el sensor digital (31, 32, 33); las fuentes de luz (21, 22) comprenden una fuente de luz (22) configurada para generar pulsos de luz láser (2), el sensor digital (31, 32, 33) comprende un sensor de intensidad (33); y el sistema de inspección óptico automático (1, 10, 100) además comprende: un aparato intensificador de imágenes (60), y una pluralidad de elementos ópticos (48, 55, 49, 57) los cuales definen una trayectoria (4) del pulso de luz láser (2) desde la fuente láser (22) hacia el campo de visión (11) y desde el campo de visión (11) hacia el aparato intensificador de imágenes (60); el aparato intensificador de imágenes (60) está configurado para ser cambiado desde una condición abierta hacia una condición cerrada y viceversa [de manera ultra-rápida] durante la inspección del objeto.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2020/068858 WO2022002414A1 (en) | 2020-07-03 | 2020-07-03 | 3d image acquisition system for optical inspection and method for optical inspection of objects, in particular electronic assemblies, electronic boards and the like |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2023000110A true MX2023000110A (es) | 2023-04-14 |
Family
ID=71523142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2023000110A MX2023000110A (es) | 2020-07-03 | 2020-07-03 | Sistema de adquisicion de imagenes 3d para inspeccion optica y metodo para inspeccion optica de objetos, en particular, ensambles electronicos, tableros electronicos y similares. |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230204519A1 (es) |
EP (1) | EP4176228A1 (es) |
MX (1) | MX2023000110A (es) |
WO (1) | WO2022002414A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114608467A (zh) * | 2022-03-22 | 2022-06-10 | 中国建筑材料科学研究总院有限公司 | 微通道板变形检测装置和检测方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4031306B2 (ja) * | 2002-07-12 | 2008-01-09 | 日本放送協会 | 3次元情報検出システム |
AU2003265989A1 (en) * | 2002-09-30 | 2004-04-23 | Applied Materials Israel, Ltd. | Illumination system for optical inspection |
US7599071B2 (en) | 2005-04-06 | 2009-10-06 | Dimensional Photonics International, Inc. | Determining positional error of an optical component using structured light patterns |
JP2006337286A (ja) * | 2005-06-03 | 2006-12-14 | Ricoh Co Ltd | 形状計測装置 |
US20080117438A1 (en) * | 2006-11-16 | 2008-05-22 | Solvision Inc. | System and method for object inspection using relief determination |
-
2020
- 2020-07-03 MX MX2023000110A patent/MX2023000110A/es unknown
- 2020-07-03 EP EP20737139.4A patent/EP4176228A1/en active Pending
- 2020-07-03 WO PCT/EP2020/068858 patent/WO2022002414A1/en active Application Filing
- 2020-07-03 US US18/014,263 patent/US20230204519A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4176228A1 (en) | 2023-05-10 |
US20230204519A1 (en) | 2023-06-29 |
WO2022002414A1 (en) | 2022-01-06 |
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