MX2022012106A - Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad. - Google Patents
Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad.Info
- Publication number
- MX2022012106A MX2022012106A MX2022012106A MX2022012106A MX2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A
- Authority
- MX
- Mexico
- Prior art keywords
- electrical
- signal
- conducted
- systems
- energy
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/081—Bases, casings or covers
- H02G3/083—Inlets
- H02G3/085—Inlets including knock-out or tear-out sections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Treating Waste Gases (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Un dispositivo, sistema y método para proteger los sistemas electrónicos de fallas o daños cuando dichos sistemas están sujetos a energía conducida o radiada no deseada, como pulsos electromagnéticos o interferencias electromagnéticas. La invención también reduce la cantidad de emisiones conducidas o radiadas de un sistema electrónico. Un novedoso alimentador de señal no conductor permite comunicar una señal deseada con conectividad eléctrica. Una señal eléctrica entrante deseada se convierte en energía vibratoria mediante un transductor piezoeléctrico, que se comunica al volumen interior de un recinto eléctrico conductor que alberga un sistema a proteger, donde se vuelve a convertir en energía eléctrica para procesamiento mediante el sistema a proteger mediante un segundo transductor piezoeléctrico. El alimentador de señal permite emplear un recinto conductor continuo, que proporciona protección contra la energía radiada no deseada. El alimentador de señal permite la comunicación sin necesidad de conducción eléctrica a través del alimentador, protegiendo así contra la energía conducida no deseada.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063003278P | 2020-03-31 | 2020-03-31 | |
US202063014443P | 2020-04-23 | 2020-04-23 | |
PCT/US2021/025284 WO2021242398A2 (en) | 2020-03-31 | 2021-03-31 | Devices, systems and methods for reducing conducted and radiated emissions and susceptibility |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022012106A true MX2022012106A (es) | 2022-10-18 |
Family
ID=78745736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022012106A MX2022012106A (es) | 2020-03-31 | 2021-03-31 | Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad. |
Country Status (11)
Country | Link |
---|---|
US (1) | US20220053674A1 (es) |
EP (1) | EP4128377A4 (es) |
JP (1) | JP2023520884A (es) |
KR (1) | KR20220160675A (es) |
CN (1) | CN115606336A (es) |
AU (1) | AU2021278790A1 (es) |
BR (1) | BR112022019598A2 (es) |
CA (1) | CA3173704A1 (es) |
IL (1) | IL296942A (es) |
MX (1) | MX2022012106A (es) |
WO (1) | WO2021242398A2 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220201908A1 (en) * | 2020-03-31 | 2022-06-23 | Face International Corporation | Interconnectable electronic equipment rack system having reduced radiated emissions and susceptibility |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3521089A (en) * | 1968-06-05 | 1970-07-21 | Atomic Energy Commission | Piezoelectric feedthrough device |
US5650685A (en) * | 1992-01-30 | 1997-07-22 | The United States Of America As Represented By The Secretary Of The Army | Microcircuit package with integrated acoustic isolator |
US6215227B1 (en) * | 1999-11-16 | 2001-04-10 | Face International Corp. | Thickness mode piezoelectric transformer with end-masses |
US6836054B2 (en) * | 2001-09-11 | 2004-12-28 | Face International Corp. | Thickness mode piezoelectric transducer with resonant drive circuit |
US6617757B2 (en) * | 2001-11-30 | 2003-09-09 | Face International Corp. | Electro-luminescent backlighting circuit with multilayer piezoelectric transformer |
US9154111B2 (en) * | 2011-05-20 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Double bulk acoustic resonator comprising aluminum scandium nitride |
JP6254509B2 (ja) * | 2014-11-07 | 2017-12-27 | 信越化学工業株式会社 | 電磁波シールド性支持基材付封止材及び封止後半導体素子搭載基板、封止後半導体素子形成ウエハ並びに半導体装置 |
-
2021
- 2021-03-31 EP EP21814401.2A patent/EP4128377A4/en active Pending
- 2021-03-31 CA CA3173704A patent/CA3173704A1/en active Pending
- 2021-03-31 CN CN202180039186.XA patent/CN115606336A/zh active Pending
- 2021-03-31 JP JP2022560034A patent/JP2023520884A/ja active Pending
- 2021-03-31 MX MX2022012106A patent/MX2022012106A/es unknown
- 2021-03-31 IL IL296942A patent/IL296942A/en unknown
- 2021-03-31 BR BR112022019598A patent/BR112022019598A2/pt unknown
- 2021-03-31 KR KR1020227037976A patent/KR20220160675A/ko unknown
- 2021-03-31 WO PCT/US2021/025284 patent/WO2021242398A2/en active Application Filing
- 2021-03-31 AU AU2021278790A patent/AU2021278790A1/en active Pending
- 2021-10-27 US US17/512,652 patent/US20220053674A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023520884A (ja) | 2023-05-22 |
CN115606336A (zh) | 2023-01-13 |
AU2021278790A1 (en) | 2022-10-20 |
WO2021242398A3 (en) | 2022-01-13 |
CA3173704A1 (en) | 2021-12-02 |
WO2021242398A2 (en) | 2021-12-02 |
IL296942A (en) | 2022-12-01 |
EP4128377A2 (en) | 2023-02-08 |
BR112022019598A2 (pt) | 2022-11-29 |
EP4128377A4 (en) | 2024-04-17 |
US20220053674A1 (en) | 2022-02-17 |
KR20220160675A (ko) | 2022-12-06 |
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