MX2022012106A - Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad. - Google Patents

Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad.

Info

Publication number
MX2022012106A
MX2022012106A MX2022012106A MX2022012106A MX2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A MX 2022012106 A MX2022012106 A MX 2022012106A
Authority
MX
Mexico
Prior art keywords
electrical
signal
conducted
systems
energy
Prior art date
Application number
MX2022012106A
Other languages
English (en)
Inventor
Clark D Boyd
Original Assignee
Face Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Face Int Corp filed Critical Face Int Corp
Publication of MX2022012106A publication Critical patent/MX2022012106A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0018Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/503Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/40Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0049Casings being metallic containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/101Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02Details
    • H02G3/08Distribution boxes; Connection or junction boxes
    • H02G3/081Bases, casings or covers
    • H02G3/083Inlets
    • H02G3/085Inlets including knock-out or tear-out sections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Treating Waste Gases (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

Un dispositivo, sistema y método para proteger los sistemas electrónicos de fallas o daños cuando dichos sistemas están sujetos a energía conducida o radiada no deseada, como pulsos electromagnéticos o interferencias electromagnéticas. La invención también reduce la cantidad de emisiones conducidas o radiadas de un sistema electrónico. Un novedoso alimentador de señal no conductor permite comunicar una señal deseada con conectividad eléctrica. Una señal eléctrica entrante deseada se convierte en energía vibratoria mediante un transductor piezoeléctrico, que se comunica al volumen interior de un recinto eléctrico conductor que alberga un sistema a proteger, donde se vuelve a convertir en energía eléctrica para procesamiento mediante el sistema a proteger mediante un segundo transductor piezoeléctrico. El alimentador de señal permite emplear un recinto conductor continuo, que proporciona protección contra la energía radiada no deseada. El alimentador de señal permite la comunicación sin necesidad de conducción eléctrica a través del alimentador, protegiendo así contra la energía conducida no deseada.
MX2022012106A 2020-03-31 2021-03-31 Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad. MX2022012106A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063003278P 2020-03-31 2020-03-31
US202063014443P 2020-04-23 2020-04-23
PCT/US2021/025284 WO2021242398A2 (en) 2020-03-31 2021-03-31 Devices, systems and methods for reducing conducted and radiated emissions and susceptibility

Publications (1)

Publication Number Publication Date
MX2022012106A true MX2022012106A (es) 2022-10-18

Family

ID=78745736

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022012106A MX2022012106A (es) 2020-03-31 2021-03-31 Dispositivos, sistemas y metodos para reducir las emisiones conducidas y radiadas y la susceptibilidad.

Country Status (11)

Country Link
US (1) US20220053674A1 (es)
EP (1) EP4128377A4 (es)
JP (1) JP2023520884A (es)
KR (1) KR20220160675A (es)
CN (1) CN115606336A (es)
AU (1) AU2021278790A1 (es)
BR (1) BR112022019598A2 (es)
CA (1) CA3173704A1 (es)
IL (1) IL296942A (es)
MX (1) MX2022012106A (es)
WO (1) WO2021242398A2 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220201908A1 (en) * 2020-03-31 2022-06-23 Face International Corporation Interconnectable electronic equipment rack system having reduced radiated emissions and susceptibility

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3521089A (en) * 1968-06-05 1970-07-21 Atomic Energy Commission Piezoelectric feedthrough device
US5650685A (en) * 1992-01-30 1997-07-22 The United States Of America As Represented By The Secretary Of The Army Microcircuit package with integrated acoustic isolator
US6215227B1 (en) * 1999-11-16 2001-04-10 Face International Corp. Thickness mode piezoelectric transformer with end-masses
US6836054B2 (en) * 2001-09-11 2004-12-28 Face International Corp. Thickness mode piezoelectric transducer with resonant drive circuit
US6617757B2 (en) * 2001-11-30 2003-09-09 Face International Corp. Electro-luminescent backlighting circuit with multilayer piezoelectric transformer
US9154111B2 (en) * 2011-05-20 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Double bulk acoustic resonator comprising aluminum scandium nitride
JP6254509B2 (ja) * 2014-11-07 2017-12-27 信越化学工業株式会社 電磁波シールド性支持基材付封止材及び封止後半導体素子搭載基板、封止後半導体素子形成ウエハ並びに半導体装置

Also Published As

Publication number Publication date
JP2023520884A (ja) 2023-05-22
CN115606336A (zh) 2023-01-13
AU2021278790A1 (en) 2022-10-20
WO2021242398A3 (en) 2022-01-13
CA3173704A1 (en) 2021-12-02
WO2021242398A2 (en) 2021-12-02
IL296942A (en) 2022-12-01
EP4128377A2 (en) 2023-02-08
BR112022019598A2 (pt) 2022-11-29
EP4128377A4 (en) 2024-04-17
US20220053674A1 (en) 2022-02-17
KR20220160675A (ko) 2022-12-06

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