MX2022000658A - Composiciones que contienen agentes de relleno termicamente conductores. - Google Patents

Composiciones que contienen agentes de relleno termicamente conductores.

Info

Publication number
MX2022000658A
MX2022000658A MX2022000658A MX2022000658A MX2022000658A MX 2022000658 A MX2022000658 A MX 2022000658A MX 2022000658 A MX2022000658 A MX 2022000658A MX 2022000658 A MX2022000658 A MX 2022000658A MX 2022000658 A MX2022000658 A MX 2022000658A
Authority
MX
Mexico
Prior art keywords
thermally conductive
compositions containing
astm
conductive fillers
measured according
Prior art date
Application number
MX2022000658A
Other languages
English (en)
Inventor
Liang Ma
Maria S French
Allison G Condie
Fabien Mezzanotti
Josiane Léon
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MX2022000658A publication Critical patent/MX2022000658A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625—Vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)

Abstract

La presente invención se refiere a una composición que comprenden: un polímero termoplástico y un paquete de relleno térmicamente conductor que comprende partículas de relleno térmicamente conductoras y eléctricamente aislantes que tienen una conductividad térmica de al menos 5 W/m·K (medida de acuerdo con ASTM D7984) y una resistividad volumétrica de al menos 10 ?·m (medida de acuerdo con ASTM D257, C611 o B193) y que están presentes en una cantidad de al menos 50% en volumen en función del volumen total del paquete de relleno. La presente invención también se refiere a recubrimientos que comprenden una conductividad térmica de al menos 0.5 W/m·K (medida de acuerdo con ASTM D7984) y a sustratos, al menos una porción que está recubierta con tal recubrimiento.
MX2022000658A 2019-07-16 2020-07-15 Composiciones que contienen agentes de relleno termicamente conductores. MX2022000658A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1908020A FR3098817A1 (fr) 2019-07-16 2019-07-16 Compositions contenant des charges thermiquement conductrices
PCT/US2020/042099 WO2021011628A1 (en) 2019-07-16 2020-07-15 Compositions containing thermally conductive fillers

Publications (1)

Publication Number Publication Date
MX2022000658A true MX2022000658A (es) 2022-02-16

Family

ID=68806917

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022000658A MX2022000658A (es) 2019-07-16 2020-07-15 Composiciones que contienen agentes de relleno termicamente conductores.

Country Status (7)

Country Link
US (1) US20220267563A1 (es)
EP (1) EP3999578A1 (es)
KR (1) KR20220035178A (es)
CN (1) CN114127176B (es)
FR (1) FR3098817A1 (es)
MX (1) MX2022000658A (es)
WO (1) WO2021011628A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
CN115698153B (zh) * 2020-04-15 2024-07-30 Ppg工业俄亥俄公司 含有导热填料的组合物
KR102542423B1 (ko) 2020-09-23 2023-06-12 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체
KR102598700B1 (ko) * 2022-11-18 2023-11-07 고덕상 미네랄 촉매제를 이용한 그릇 제조방법
KR102598693B1 (ko) * 2022-11-18 2023-11-06 고덕상 미네랄 촉매제를 이용한 생활용품 제조방법
KR102598696B1 (ko) * 2022-11-18 2023-11-06 고덕상 미네랄 촉매제를 이용한 건축자재 제조방법
CN116285771B (zh) * 2022-12-22 2024-07-02 隆基绿能科技股份有限公司 导热填料及其制备方法、灌封胶及其制备方法、接线盒、光伏组件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793867A (en) 1986-09-26 1988-12-27 Chemfil Corporation Phosphate coating composition and method of applying a zinc-nickel phosphate coating
US5588989A (en) 1994-11-23 1996-12-31 Ppg Industries, Inc. Zinc phosphate coating compositions containing oxime accelerators
US7749368B2 (en) 2006-12-13 2010-07-06 Ppg Industries Ohio, Inc. Methods for coating a metal substrate and related coated substrates
US8673091B2 (en) 2007-08-03 2014-03-18 Ppg Industries Ohio, Inc Pretreatment compositions and methods for coating a metal substrate
US20090152491A1 (en) * 2007-11-16 2009-06-18 E. I. Du Pont De Nemours And Company Thermally conductive resin compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20120129980A1 (en) 2010-11-19 2012-05-24 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
JP6316556B2 (ja) * 2013-08-29 2018-04-25 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 電気絶縁性および熱伝導性のポリマー組成物
EP3182446B1 (en) * 2015-12-17 2019-06-05 3M Innovative Properties Company Thermal interface material
US20180230290A1 (en) * 2017-02-10 2018-08-16 E I Du Pont De Nemours And Company Thermally conductive polymer composition

Also Published As

Publication number Publication date
KR20220035178A (ko) 2022-03-21
WO2021011628A1 (en) 2021-01-21
CN114127176A (zh) 2022-03-01
US20220267563A1 (en) 2022-08-25
EP3999578A1 (en) 2022-05-25
FR3098817A1 (fr) 2021-01-22
CN114127176B (zh) 2024-02-09

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