MX2021013235A - Composicion resistiva de alta adhesion. - Google Patents
Composicion resistiva de alta adhesion.Info
- Publication number
- MX2021013235A MX2021013235A MX2021013235A MX2021013235A MX2021013235A MX 2021013235 A MX2021013235 A MX 2021013235A MX 2021013235 A MX2021013235 A MX 2021013235A MX 2021013235 A MX2021013235 A MX 2021013235A MX 2021013235 A MX2021013235 A MX 2021013235A
- Authority
- MX
- Mexico
- Prior art keywords
- resistive composition
- substrate
- high adhesion
- thick film
- resistive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
Abstract
Se proporciona una composición resistiva para formar resistores de película gruesa sobre un sustrato. La composición resistiva incluye partículas de platino y partículas de cerámica. Las partículas de cerámica incluyen partículas de alúmina. Un vehículo orgánico puede incluirse para formar una tinta o una pasta para el proceso de película gruesa. Después de la aplicación del sustrato, la composición resistiva se recuece para formar los resistores de película gruesa, la cual se adhiere por completo al sustrato.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962859313P | 2019-06-10 | 2019-06-10 | |
PCT/US2020/034494 WO2020251746A1 (en) | 2019-06-10 | 2020-05-26 | High adhesion resistive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021013235A true MX2021013235A (es) | 2021-12-10 |
Family
ID=73780785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021013235A MX2021013235A (es) | 2019-06-10 | 2020-05-26 | Composicion resistiva de alta adhesion. |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220238261A1 (es) |
EP (1) | EP3942578A4 (es) |
CN (1) | CN113924631B (es) |
CA (1) | CA3134212A1 (es) |
MX (1) | MX2021013235A (es) |
WO (1) | WO2020251746A1 (es) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3416960A (en) * | 1966-05-09 | 1968-12-17 | Beckman Instruments Inc | Cermet resistors, their composition and method of manufacture |
JPS5922385B2 (ja) * | 1980-04-25 | 1984-05-26 | 日産自動車株式会社 | セラミツク基板のスル−ホ−ル充填用導電体ペ−スト |
EP0153737B1 (en) * | 1984-02-27 | 1993-07-28 | Kabushiki Kaisha Toshiba | Circuit substrate having high thermal conductivity |
DE4127845C1 (es) * | 1991-08-22 | 1992-11-19 | W.C. Heraeus Gmbh, 6450 Hanau, De | |
US5122302A (en) * | 1991-09-30 | 1992-06-16 | E. I. Du Pont De Nemours And Company | Thick film NTC thermistor compositions |
JPH07312301A (ja) * | 1994-03-24 | 1995-11-28 | Ngk Insulators Ltd | 抵抗体素子 |
EP0722920B9 (en) * | 1994-08-09 | 2002-06-12 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Composite material and production method therefor |
KR20000069416A (ko) | 1997-10-10 | 2000-11-25 | 에이엠티 인터내셔널 인코포레이티드 | 트레이 밸브 부착을 위한 장치 및 방법 |
DE19934109C1 (de) * | 1999-07-21 | 2001-04-05 | Bosch Gmbh Robert | Temperaturfühler und Verfahren zu seiner Herstellung |
DE10015502A1 (de) * | 2000-03-14 | 2001-09-27 | Bosch Gmbh Robert | Photostrukturierbare Paste |
US6620343B1 (en) * | 2002-03-19 | 2003-09-16 | Therm-O-Disc Incorporated | PTC conductive composition containing a low molecular weight polyethylene processing aid |
DE10239470A1 (de) * | 2002-08-28 | 2004-03-11 | Arndt Dung | Verfahren und Vorrichtungen zur Überwachung des von einem Anstellzylinder herrührenden, eine auswechselbare Elektrode am Elektrodentragarm festlegenden Spanndrucks |
US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
JP2007103594A (ja) * | 2005-10-03 | 2007-04-19 | Shoei Chem Ind Co | 抵抗体組成物並びに厚膜抵抗体 |
JP6740961B2 (ja) * | 2017-05-26 | 2020-08-19 | 住友金属鉱山株式会社 | 導体形成用組成物とその製造方法、導体とその製造方法、チップ抵抗器 |
JP6618969B2 (ja) * | 2017-10-13 | 2019-12-11 | 株式会社ノリタケカンパニーリミテド | 導電性ペースト |
-
2020
- 2020-05-26 WO PCT/US2020/034494 patent/WO2020251746A1/en unknown
- 2020-05-26 MX MX2021013235A patent/MX2021013235A/es unknown
- 2020-05-26 EP EP20823174.6A patent/EP3942578A4/en active Pending
- 2020-05-26 CA CA3134212A patent/CA3134212A1/en active Pending
- 2020-05-26 US US17/615,193 patent/US20220238261A1/en active Pending
- 2020-05-26 CN CN202080042236.5A patent/CN113924631B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP3942578A1 (en) | 2022-01-26 |
WO2020251746A1 (en) | 2020-12-17 |
US20220238261A1 (en) | 2022-07-28 |
CN113924631A (zh) | 2022-01-11 |
CA3134212A1 (en) | 2020-12-17 |
EP3942578A4 (en) | 2023-01-18 |
CN113924631B (zh) | 2023-06-27 |
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