MX2021008838A - Soldaduras de tapon y tapa de soldadura para sistemas de distribucion de fluidos. - Google Patents
Soldaduras de tapon y tapa de soldadura para sistemas de distribucion de fluidos.Info
- Publication number
- MX2021008838A MX2021008838A MX2021008838A MX2021008838A MX2021008838A MX 2021008838 A MX2021008838 A MX 2021008838A MX 2021008838 A MX2021008838 A MX 2021008838A MX 2021008838 A MX2021008838 A MX 2021008838A MX 2021008838 A MX2021008838 A MX 2021008838A
- Authority
- MX
- Mexico
- Prior art keywords
- cap
- substrate body
- delivery systems
- fluid delivery
- weld cap
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L41/00—Branching pipes; Joining pipes to walls
- F16L41/02—Branch units, e.g. made in one piece, welded, riveted
- F16L41/03—Branch units, e.g. made in one piece, welded, riveted comprising junction pieces for four or more pipe members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/003—Housing formed from a plurality of the same valve elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Valve Housings (AREA)
- Micromachines (AREA)
Abstract
Un sustrato de flujo que comprende un cuerpo de sustrato formado a partir de un bloque sólido de un primer material, el cuerpo de sustrato que tiene una primera superficie y una segunda superficie opuesta a la primera superficie, una pluralidad de pares de orificios de conducto de componente definidos en la primera superficie del cuerpo de sustrato, una pluralidad de rutas de fluido que se extienden entre cada respectivo par de orificios de conducto de componente y en comunicación para fluidos con cada orificio de conducto de componente del respectivo par de orificios de conducto de componente, cada respectiva ruta de fluido que se forma en la segunda superficie del cuerpo de sustrato, y al menos una tapa formada a partir de un segundo material, la por lo menos una tapa que tiene una primera superficie de tapa que se construye para sellar al menos una ruta de fluido, y una segunda superficie de tapa opuesta a la primera superficie, en donde el cuerpo de sustrato incluye una abertura configurada para acoplarse con la por lo menos una tapa.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962798371P | 2019-01-29 | 2019-01-29 | |
PCT/IB2020/000069 WO2020157574A1 (en) | 2019-01-29 | 2020-01-28 | Weld cap and plug welds fluid delivery systems |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021008838A true MX2021008838A (es) | 2021-09-08 |
Family
ID=70476252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021008838A MX2021008838A (es) | 2019-01-29 | 2020-01-28 | Soldaduras de tapon y tapa de soldadura para sistemas de distribucion de fluidos. |
Country Status (10)
Country | Link |
---|---|
US (1) | US20200240565A1 (es) |
EP (1) | EP3918239A1 (es) |
JP (1) | JP2022519042A (es) |
KR (1) | KR20210119478A (es) |
CN (1) | CN113631846A (es) |
CA (1) | CA3126775A1 (es) |
IL (1) | IL285180A (es) |
MX (1) | MX2021008838A (es) |
SG (1) | SG11202107658VA (es) |
WO (1) | WO2020157574A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210140779A (ko) * | 2019-04-15 | 2021-11-23 | 램 리써치 코포레이션 | 가스 전달을 위한 모듈형 컴포넌트 시스템 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3278156A (en) | 1965-12-27 | 1966-10-11 | Nuclear Products Company | Bellows valve |
US3521910A (en) | 1968-11-12 | 1970-07-28 | Cajon Co | Tube coupling |
JPH02149113A (ja) * | 1988-11-30 | 1990-06-07 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
JPH0552309U (ja) * | 1991-12-18 | 1993-07-13 | 株式会社ユニシアジェックス | 流体給排用ポートの取付構造 |
JP3431631B2 (ja) | 1993-10-06 | 2003-07-28 | ユニット インストルメンツ インコーポレーテッド | プロセス流体の処理装置 |
US5730423A (en) | 1996-10-16 | 1998-03-24 | Parker-Hannifin Corporation | All metal diaphragm valve |
JPH11273637A (ja) * | 1998-03-19 | 1999-10-08 | Mitsubishi Cable Ind Ltd | 密閉型電池の製造方法 |
US6357760B1 (en) | 2000-05-19 | 2002-03-19 | Michael Doyle | Ring seal |
EP1680943A1 (en) | 2003-11-07 | 2006-07-19 | Celerity, Inc. | Surface mount heater |
JP2009146645A (ja) * | 2007-12-12 | 2009-07-02 | Toyota Motor Corp | 溶接構造体の製造方法及び電池の製造方法 |
US8307854B1 (en) | 2009-05-14 | 2012-11-13 | Vistadeltek, Inc. | Fluid delivery substrates for building removable standard fluid delivery sticks |
US20140020779A1 (en) * | 2009-06-10 | 2014-01-23 | Vistadeltek, Llc | Extreme flow rate and/or high temperature fluid delivery substrates |
TWI534922B (zh) * | 2009-06-10 | 2016-05-21 | 威士塔戴爾泰克有限責任公司 | 極端流量和/或高溫流體輸送基板 |
CN202391550U (zh) * | 2011-12-06 | 2012-08-22 | 浙江世纪华通车业股份有限公司 | 一种汽车散热器水室的加水管工艺口封盖密封结构 |
DE112016005157T5 (de) * | 2015-11-10 | 2018-08-02 | Kabushiki Kaisha Toyota Jidoshokki | Stromspeichervorrichtung |
-
2020
- 2020-01-28 WO PCT/IB2020/000069 patent/WO2020157574A1/en unknown
- 2020-01-28 EP EP20722634.1A patent/EP3918239A1/en active Pending
- 2020-01-28 CA CA3126775A patent/CA3126775A1/en active Pending
- 2020-01-28 JP JP2021544157A patent/JP2022519042A/ja active Pending
- 2020-01-28 US US16/774,915 patent/US20200240565A1/en active Pending
- 2020-01-28 CN CN202080011195.3A patent/CN113631846A/zh active Pending
- 2020-01-28 MX MX2021008838A patent/MX2021008838A/es unknown
- 2020-01-28 KR KR1020217026854A patent/KR20210119478A/ko not_active Application Discontinuation
- 2020-01-28 SG SG11202107658VA patent/SG11202107658VA/en unknown
-
2021
- 2021-07-28 IL IL285180A patent/IL285180A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2020157574A1 (en) | 2020-08-06 |
KR20210119478A (ko) | 2021-10-05 |
EP3918239A1 (en) | 2021-12-08 |
JP2022519042A (ja) | 2022-03-18 |
CA3126775A1 (en) | 2020-08-06 |
CN113631846A (zh) | 2021-11-09 |
SG11202107658VA (en) | 2021-08-30 |
US20200240565A1 (en) | 2020-07-30 |
IL285180A (en) | 2021-09-30 |
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