MX2021006643A - Composicion de adhesivo polimerico de alta resistencia modificado con silano. - Google Patents

Composicion de adhesivo polimerico de alta resistencia modificado con silano.

Info

Publication number
MX2021006643A
MX2021006643A MX2021006643A MX2021006643A MX2021006643A MX 2021006643 A MX2021006643 A MX 2021006643A MX 2021006643 A MX2021006643 A MX 2021006643A MX 2021006643 A MX2021006643 A MX 2021006643A MX 2021006643 A MX2021006643 A MX 2021006643A
Authority
MX
Mexico
Prior art keywords
silane
adhesive composition
modified polymer
high strength
polymer adhesive
Prior art date
Application number
MX2021006643A
Other languages
English (en)
Inventor
Christopher Verosky
Matthias Kohl
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of MX2021006643A publication Critical patent/MX2021006643A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Abstract

Se describe una composición de adhesivo curable por humedad que comprende al menos un polímero modificado con silano, un relleno que comprende una sílice pirogenada modificada en la superficie y una de las cristobalitas modificadas en la superficie y una sílice; y, opcionalmente, al menos uno de los promotores de adhesión amino silano, un catalizador de organoestaño, un potenciador de la vida útil de la deshidratación, un estabilizador de la luz, dióxido de titanio, un modificador reológico y mezclas de los mismos. La composición de adhesivo encuentra un uso especial en la unión de sustratos metálicos entre sí con una fuerza de unión significativamente mayor que la proporcionada por los adhesivos poliméricos modificados con silano por sí solos.
MX2021006643A 2018-12-13 2019-12-10 Composicion de adhesivo polimerico de alta resistencia modificado con silano. MX2021006643A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862779083P 2018-12-13 2018-12-13
PCT/US2019/065390 WO2020123454A1 (en) 2018-12-13 2019-12-10 High strength, silane-modified polymer adhesive composition

Publications (1)

Publication Number Publication Date
MX2021006643A true MX2021006643A (es) 2021-07-07

Family

ID=71075417

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021006643A MX2021006643A (es) 2018-12-13 2019-12-10 Composicion de adhesivo polimerico de alta resistencia modificado con silano.

Country Status (8)

Country Link
US (1) US20210269685A1 (es)
EP (1) EP3894507A4 (es)
JP (1) JP7440518B2 (es)
KR (1) KR20210091724A (es)
CN (1) CN113166625B (es)
CA (1) CA3121582A1 (es)
MX (1) MX2021006643A (es)
WO (1) WO2020123454A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3941971A1 (en) * 2019-03-20 2022-01-26 Sika Technology AG Method for adhesively bonding rubber-based thermoplastic substrates
KR102388213B1 (ko) * 2021-12-08 2022-04-19 주식회사 엠티지 용접 대체용 난연성 실란트 조성물
EP4324892A1 (en) * 2022-08-17 2024-02-21 Henkel AG & Co. KGaA Removable adhesive and sealant composition

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469522A (en) * 1980-10-08 1984-09-04 General Electric Company Process for treating fillers with fluorosilicone compounds
JP3330974B2 (ja) * 1992-05-28 2002-10-07 東レ・ダウコーニング・シリコーン株式会社 室温硬化性オルガノポリシロキサン組成物
US6737169B2 (en) * 2001-01-31 2004-05-18 Jsr Corporation Polymer composition, cured product, laminate and method for producing the cured product
MXPA02011492A (es) 2001-12-03 2003-06-30 Rohm & Haas Adhesivos de curado con humedad.
ATE360047T1 (de) * 2002-08-29 2007-05-15 Amber Chemical Company Ltd Bei raumtemperatur härtbare organopolysiloxanzusammensetzungen
WO2006106095A1 (en) * 2005-04-06 2006-10-12 Dow Corning Corporation Organosiloxane compositions
WO2009047580A1 (en) * 2007-10-11 2009-04-16 Amber Chemical Company Ltd. Thixotropic/non-slump room temperature curable organopolysiloxane compositions
GB0724914D0 (en) * 2007-12-21 2008-01-30 Dow Corning Moisture curable compositions
JP4544374B1 (ja) 2009-04-08 2010-09-15 横浜ゴム株式会社 接着剤組成物
DE102010002808B4 (de) * 2010-03-12 2019-02-21 Henkel Ag & Co. Kgaa Härtbare Zusammensetzungen auf Basis Silan-modifizierter Polymere und ihre Verwendung als Fliesenkleber
JP2012167210A (ja) 2011-02-15 2012-09-06 Yokohama Rubber Co Ltd:The 湿気硬化型樹脂組成物
JP5265813B2 (ja) * 2011-05-13 2013-08-14 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
WO2013090127A1 (en) * 2011-12-15 2013-06-20 Momentive Performance Materials, Inc. Moisture curable organopolysiloxane compositions
EP2796493A1 (en) * 2013-04-25 2014-10-29 Huntsman International Llc Composition comprising silylated polymers and polyhedral oligomeric metallo silsesquioxane
CN107075063A (zh) * 2014-11-20 2017-08-18 莫门蒂夫性能材料股份有限公司 可湿固化的组合物
MX2017016766A (es) * 2015-07-07 2018-03-09 Henkel Ag & Co Kgaa Composicion de silicona de baja viscocidad, de dos componentes, resistentes a altas temperaturas.

Also Published As

Publication number Publication date
CN113166625B (zh) 2024-02-20
CA3121582A1 (en) 2020-06-18
JP2022512246A (ja) 2022-02-02
JP7440518B2 (ja) 2024-02-28
US20210269685A1 (en) 2021-09-02
WO2020123454A1 (en) 2020-06-18
EP3894507A1 (en) 2021-10-20
KR20210091724A (ko) 2021-07-22
CN113166625A (zh) 2021-07-23
EP3894507A4 (en) 2022-09-07

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