MX2019008900A - Dispositivo de medicion tridimensional. - Google Patents

Dispositivo de medicion tridimensional.

Info

Publication number
MX2019008900A
MX2019008900A MX2019008900A MX2019008900A MX2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A
Authority
MX
Mexico
Prior art keywords
period
stripe pattern
projection
camera
total black
Prior art date
Application number
MX2019008900A
Other languages
English (en)
Inventor
Ohyama Tsuyoshi
Sakaida Norihiko
Umemura Nobuyuki
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of MX2019008900A publication Critical patent/MX2019008900A/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Se provee un dispositivo de medición tridimensional capaz de impedir una reducción en exactitud de medición durante la medición tridimensional. Un dispositivo de inspección de sustrato 1 comprende un dispositivo de proyección 4 que proyecta un patrón de franjas sobre un sustrato impreso 2; una cámara 5 que muestra una porción del sustrato impreso 2 sobre el cual se ha proyectado el patrón de franjas y un dispositivo de control 6 que efectúa varios tipos de control en el dispositivo de inspección de sustrato 1. El dispositivo de proyección 4 comprende una fuente de luz 4a que emite luz predeterminada y un DMD 4b que convierte la luz de la fuente de luz 4a en un patrón de franjas, el dispositivo de proyección proyecta el patrón de franjas sobre el sustrato impreso 2 en un número predeterminado de cuadros por unidad de tiempo. El dispositivo de control 6: establece un período de proyección del patrón de negro total de un cuadro, tal período es un período en el cual se puede proyectar un patrón negro total predeterminado antes y después de un período de proyección del patrón de franjas de un número predeterminado de cuadros; inicia la formación de imagen efectuada por la cámara 5 en el período de proyección del patrón negro total que es antes del período de proyección del patrón de franjas y finaliza la formación de imagen efectuada por la cámara 5 en el período de proyección del patrón negro total que es después del período de proyección del patrón de franjas.
MX2019008900A 2017-03-02 2017-08-28 Dispositivo de medicion tridimensional. MX2019008900A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017039311A JP6353573B1 (ja) 2017-03-02 2017-03-02 三次元計測装置
PCT/JP2017/030703 WO2018158983A1 (ja) 2017-03-02 2017-08-28 三次元計測装置

Publications (1)

Publication Number Publication Date
MX2019008900A true MX2019008900A (es) 2019-09-11

Family

ID=62779971

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019008900A MX2019008900A (es) 2017-03-02 2017-08-28 Dispositivo de medicion tridimensional.

Country Status (7)

Country Link
US (1) US10914574B2 (es)
JP (1) JP6353573B1 (es)
CN (1) CN110291359B (es)
DE (1) DE112017007154T5 (es)
MX (1) MX2019008900A (es)
TW (1) TWI641802B (es)
WO (1) WO2018158983A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306230B1 (ja) * 2017-02-09 2018-04-04 Ckd株式会社 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法
CN109799239B (zh) * 2019-01-29 2021-03-02 安徽省沃特邦电子科技有限公司 一种电子元件的快速检测装置
JP7371443B2 (ja) * 2019-10-28 2023-10-31 株式会社デンソーウェーブ 三次元計測装置
CN113513987B (zh) * 2021-07-10 2023-04-18 深慧视(深圳)科技有限公司 一种3d点云坐标生成装置
CN116858130B (zh) * 2023-05-30 2024-01-09 中国空气动力研究与发展中心低速空气动力研究所 一种基于π/2互补双脉宽调制模式的三维冰形测量方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1437000A (zh) * 2002-02-09 2003-08-20 沈阳同联集团高新技术有限公司 投影栅线测量物体三维表面形状的方法和装置
JP4709571B2 (ja) * 2005-04-05 2011-06-22 国立大学法人広島大学 視覚情報処理システム及びその視覚情報処理方法
EP2183546B1 (en) * 2007-08-17 2015-10-21 Renishaw PLC Non-contact probe
US8358829B2 (en) * 2008-11-26 2013-01-22 Camtek Ltd. System and a method for inspecting an object
JP2010164350A (ja) * 2009-01-14 2010-07-29 Ckd Corp 三次元計測装置
JP4744610B2 (ja) * 2009-01-20 2011-08-10 シーケーディ株式会社 三次元計測装置
WO2012032668A1 (ja) * 2010-09-07 2012-03-15 大日本印刷株式会社 スキャナ装置および物体の三次元形状測定装置
CN103857981B (zh) * 2011-10-11 2017-05-10 株式会社尼康 形状测定装置、构造物制造系统、形状测定方法、构造物制造方法
JP5917116B2 (ja) * 2011-12-06 2016-05-11 キヤノン株式会社 情報処理装置、情報処理装置の制御方法、およびプログラム
JP2014032159A (ja) * 2012-08-06 2014-02-20 Canon Inc 投影撮像システム及び投影撮像システムの制御方法
US9513113B2 (en) * 2012-10-29 2016-12-06 7D Surgical, Inc. Integrated illumination and optical surface topology detection system and methods of use thereof
JP5780659B2 (ja) * 2013-06-13 2015-09-16 ヤマハ発動機株式会社 ３次元形状測定装置
JP6618249B2 (ja) * 2014-02-18 2019-12-11 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ 投影システムおよび半導体集積回路

Also Published As

Publication number Publication date
DE112017007154T5 (de) 2019-11-28
TWI641802B (zh) 2018-11-21
JP6353573B1 (ja) 2018-07-04
US10914574B2 (en) 2021-02-09
CN110291359A (zh) 2019-09-27
WO2018158983A1 (ja) 2018-09-07
JP2018146289A (ja) 2018-09-20
CN110291359B (zh) 2021-05-28
US20190360798A1 (en) 2019-11-28
TW201833513A (zh) 2018-09-16

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