MX2015003654A - Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados. - Google Patents

Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados.

Info

Publication number
MX2015003654A
MX2015003654A MX2015003654A MX2015003654A MX2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A
Authority
MX
Mexico
Prior art keywords
fixture
fluid
positioning system
dispensing
predetermined locations
Prior art date
Application number
MX2015003654A
Other languages
English (en)
Inventor
Roberto Francisco-Yi Lu
Qinglong Zeng
Charles David Fry
Bicheng Chen
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of MX2015003654A publication Critical patent/MX2015003654A/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/10Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0469Surface mounting by applying a glue or viscous material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1021Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • B05B12/122Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to presence or shape of target
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)

Abstract

Una máquina dispensadores de fluidos (100) incluye un bastidor (110) y un soporte (106) sostenido por el bastidor. El soporte está configurado para sostener un sustrato (104). Un sistema de posicionamiento (120) es sostenido por el bastidor. Un sistema de guía (160) es sostenido por el sistema de posicionamiento. El sistema de guía tiene una cámara (102) que apunta hacia el soporte que es movible con relación al soporte. El dispensador de fluido está configurado para suministrar fluido en un sustrato. Un controlador (170) se comunica con el sistema de posicionamiento y el sistema de guía. El controlador opera el sistema de posicionamiento para controlar una posición del dispensador de fluido en relación al soporte en base a una imagen obtenida por la cámara.
MX2015003654A 2012-09-20 2013-09-11 Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados. MX2015003654A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261703364P 2012-09-20 2012-09-20
US13/833,645 US9962728B2 (en) 2012-09-20 2013-03-15 Fluid dispensing machine and method of dispensing fluid
PCT/US2013/059111 WO2014046921A1 (en) 2012-09-20 2013-09-11 Dispensing machine automatically dispensing fluid to predetermined locations

Publications (1)

Publication Number Publication Date
MX2015003654A true MX2015003654A (es) 2015-09-25

Family

ID=50274754

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015003654A MX2015003654A (es) 2012-09-20 2013-09-11 Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados.

Country Status (5)

Country Link
US (1) US9962728B2 (es)
CN (1) CN104640641B (es)
MX (1) MX2015003654A (es)
TW (1) TW201417896A (es)
WO (1) WO2014046921A1 (es)

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EP3825013A1 (en) * 2013-12-06 2021-05-26 Musashi Engineering, Inc. Liquid material application device
US10837977B2 (en) * 2015-05-11 2020-11-17 Kabushiki Kaisha Yaskawa Denki Rack for dispensing and dispensing system
WO2016181466A1 (ja) 2015-05-11 2016-11-17 株式会社安川電機 分注システム、コントローラ及び制御方法
US10987693B2 (en) 2015-08-18 2021-04-27 The Boeing Company Sealant application tip
US10881005B2 (en) * 2016-06-08 2020-12-29 Nordson Corporation Methods for dispensing a liquid or viscous material onto a substrate
EP3474994A4 (en) * 2016-06-24 2019-06-05 Kobra Biosolutions, LLC VERIFICATION PIPETTE AND VISION APPARATUS
EP3490770A1 (de) * 2016-07-26 2019-06-05 Chemetall GmbH Verfahren und vorrichtung zum befüllen von dichtkappen
US20180106659A1 (en) * 2016-10-15 2018-04-19 Centech Corp. Automated volumetric measurement and verification system
CN108581118B (zh) * 2017-03-17 2022-01-11 泰科电子(上海)有限公司 焊膏自动供应系统
JP6830406B2 (ja) * 2017-06-01 2021-02-17 株式会社日立製作所 分注装置
CN107278045A (zh) * 2017-08-03 2017-10-20 苏州市唯西芈电子科技有限公司 焊接固化一体机
CN107457155A (zh) * 2017-09-27 2017-12-12 深圳市海能达通信有限公司 一种在线式3d点胶机及利用其进行点胶的方法
CN113316513A (zh) 2018-12-20 2021-08-27 捷普有限公司 使用超细喷射材料增材制造的设备、系统和方法
WO2020142225A1 (en) 2019-01-04 2020-07-09 Jabil Inc. Apparatus, system, and method of providing a circuit board carrier for an underfill system
WO2020142226A1 (en) 2019-01-04 2020-07-09 Jabil Inc. Apparatus, system, and method of providing a dispenser of circuit board component underfill
JP7465648B2 (ja) * 2019-10-25 2024-04-11 東芝産業機器システム株式会社 接着剤塗布装置及び接着剤塗布方法、回転子の製造方法
CN110665745A (zh) * 2019-10-26 2020-01-10 中山市联申达科技有限公司 Fa自动点胶贴片设备
CN112275542A (zh) * 2020-10-08 2021-01-29 中山市光大光学仪器有限公司 一种自动点胶工装及其点胶方法
US11826768B2 (en) * 2021-03-11 2023-11-28 Ford Global Technologies, Llc Method and apparatus for adaptive control and real-time edge tracking of adhesive and sealer dispensing
KR102602833B1 (ko) * 2021-09-30 2023-11-16 엔젯 주식회사 복수의 노즐 헤드를 구비한 프린팅 장치 및 복수의 노즐팁 정렬 방법
CN114950868A (zh) * 2022-07-05 2022-08-30 广东猛犸象智能机器人制造有限公司 一种3d视觉引导的智能点胶拼接产品系统及方法

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US5110615A (en) * 1990-01-31 1992-05-05 Asymptotic Technologies, Inc. Method for dispensing viscous materials a constant height above a workpiece surface
US5460758A (en) * 1990-12-21 1995-10-24 Eos Gmbh Electro Optical Systems Method and apparatus for production of a three-dimensional object
US5614024A (en) 1993-08-06 1997-03-25 Hitachi Techno Engineering Co., Ltd. Apparatus for applying paste
US6923117B1 (en) * 1999-07-26 2005-08-02 Matsushita Electric Industrial Co., Ltd. Solder paste printing apparatus and printing method
US6697694B2 (en) 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
DE10257567B4 (de) 2002-12-10 2015-10-08 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verfahren und Computerprogramm und computerlesbares Medium zum computergesteuerten Auftragen von Kleberaupen auf ein Bauteil
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US7404861B2 (en) * 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same

Also Published As

Publication number Publication date
US20140079871A1 (en) 2014-03-20
WO2014046921A1 (en) 2014-03-27
CN104640641A (zh) 2015-05-20
US9962728B2 (en) 2018-05-08
TW201417896A (zh) 2014-05-16
CN104640641B (zh) 2018-04-27

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