MX2015003654A - Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados. - Google Patents
Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados.Info
- Publication number
- MX2015003654A MX2015003654A MX2015003654A MX2015003654A MX2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A MX 2015003654 A MX2015003654 A MX 2015003654A
- Authority
- MX
- Mexico
- Prior art keywords
- fixture
- fluid
- positioning system
- dispensing
- predetermined locations
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
- B05B12/122—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to presence or shape of target
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
- Loading And Unloading Of Fuel Tanks Or Ships (AREA)
Abstract
Una máquina dispensadores de fluidos (100) incluye un bastidor (110) y un soporte (106) sostenido por el bastidor. El soporte está configurado para sostener un sustrato (104). Un sistema de posicionamiento (120) es sostenido por el bastidor. Un sistema de guía (160) es sostenido por el sistema de posicionamiento. El sistema de guía tiene una cámara (102) que apunta hacia el soporte que es movible con relación al soporte. El dispensador de fluido está configurado para suministrar fluido en un sustrato. Un controlador (170) se comunica con el sistema de posicionamiento y el sistema de guía. El controlador opera el sistema de posicionamiento para controlar una posición del dispensador de fluido en relación al soporte en base a una imagen obtenida por la cámara.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261703364P | 2012-09-20 | 2012-09-20 | |
US13/833,645 US9962728B2 (en) | 2012-09-20 | 2013-03-15 | Fluid dispensing machine and method of dispensing fluid |
PCT/US2013/059111 WO2014046921A1 (en) | 2012-09-20 | 2013-09-11 | Dispensing machine automatically dispensing fluid to predetermined locations |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2015003654A true MX2015003654A (es) | 2015-09-25 |
Family
ID=50274754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015003654A MX2015003654A (es) | 2012-09-20 | 2013-09-11 | Maquina dispensadora que suministra automaticamente un fluido en lugares predeterminados. |
Country Status (5)
Country | Link |
---|---|
US (1) | US9962728B2 (es) |
CN (1) | CN104640641B (es) |
MX (1) | MX2015003654A (es) |
TW (1) | TW201417896A (es) |
WO (1) | WO2014046921A1 (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3825013A1 (en) * | 2013-12-06 | 2021-05-26 | Musashi Engineering, Inc. | Liquid material application device |
US10837977B2 (en) * | 2015-05-11 | 2020-11-17 | Kabushiki Kaisha Yaskawa Denki | Rack for dispensing and dispensing system |
WO2016181466A1 (ja) | 2015-05-11 | 2016-11-17 | 株式会社安川電機 | 分注システム、コントローラ及び制御方法 |
US10987693B2 (en) | 2015-08-18 | 2021-04-27 | The Boeing Company | Sealant application tip |
US10881005B2 (en) * | 2016-06-08 | 2020-12-29 | Nordson Corporation | Methods for dispensing a liquid or viscous material onto a substrate |
EP3474994A4 (en) * | 2016-06-24 | 2019-06-05 | Kobra Biosolutions, LLC | VERIFICATION PIPETTE AND VISION APPARATUS |
EP3490770A1 (de) * | 2016-07-26 | 2019-06-05 | Chemetall GmbH | Verfahren und vorrichtung zum befüllen von dichtkappen |
US20180106659A1 (en) * | 2016-10-15 | 2018-04-19 | Centech Corp. | Automated volumetric measurement and verification system |
CN108581118B (zh) * | 2017-03-17 | 2022-01-11 | 泰科电子(上海)有限公司 | 焊膏自动供应系统 |
JP6830406B2 (ja) * | 2017-06-01 | 2021-02-17 | 株式会社日立製作所 | 分注装置 |
CN107278045A (zh) * | 2017-08-03 | 2017-10-20 | 苏州市唯西芈电子科技有限公司 | 焊接固化一体机 |
CN107457155A (zh) * | 2017-09-27 | 2017-12-12 | 深圳市海能达通信有限公司 | 一种在线式3d点胶机及利用其进行点胶的方法 |
CN113316513A (zh) | 2018-12-20 | 2021-08-27 | 捷普有限公司 | 使用超细喷射材料增材制造的设备、系统和方法 |
WO2020142225A1 (en) | 2019-01-04 | 2020-07-09 | Jabil Inc. | Apparatus, system, and method of providing a circuit board carrier for an underfill system |
WO2020142226A1 (en) | 2019-01-04 | 2020-07-09 | Jabil Inc. | Apparatus, system, and method of providing a dispenser of circuit board component underfill |
JP7465648B2 (ja) * | 2019-10-25 | 2024-04-11 | 東芝産業機器システム株式会社 | 接着剤塗布装置及び接着剤塗布方法、回転子の製造方法 |
CN110665745A (zh) * | 2019-10-26 | 2020-01-10 | 中山市联申达科技有限公司 | Fa自动点胶贴片设备 |
CN112275542A (zh) * | 2020-10-08 | 2021-01-29 | 中山市光大光学仪器有限公司 | 一种自动点胶工装及其点胶方法 |
US11826768B2 (en) * | 2021-03-11 | 2023-11-28 | Ford Global Technologies, Llc | Method and apparatus for adaptive control and real-time edge tracking of adhesive and sealer dispensing |
KR102602833B1 (ko) * | 2021-09-30 | 2023-11-16 | 엔젯 주식회사 | 복수의 노즐 헤드를 구비한 프린팅 장치 및 복수의 노즐팁 정렬 방법 |
CN114950868A (zh) * | 2022-07-05 | 2022-08-30 | 广东猛犸象智能机器人制造有限公司 | 一种3d视觉引导的智能点胶拼接产品系统及方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5110615A (en) * | 1990-01-31 | 1992-05-05 | Asymptotic Technologies, Inc. | Method for dispensing viscous materials a constant height above a workpiece surface |
US5460758A (en) * | 1990-12-21 | 1995-10-24 | Eos Gmbh Electro Optical Systems | Method and apparatus for production of a three-dimensional object |
US5614024A (en) | 1993-08-06 | 1997-03-25 | Hitachi Techno Engineering Co., Ltd. | Apparatus for applying paste |
US6923117B1 (en) * | 1999-07-26 | 2005-08-02 | Matsushita Electric Industrial Co., Ltd. | Solder paste printing apparatus and printing method |
US6697694B2 (en) | 1998-08-26 | 2004-02-24 | Electronic Materials, L.L.C. | Apparatus and method for creating flexible circuits |
DE10257567B4 (de) | 2002-12-10 | 2015-10-08 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Verfahren und Computerprogramm und computerlesbares Medium zum computergesteuerten Auftragen von Kleberaupen auf ein Bauteil |
KR100618579B1 (ko) | 2002-12-23 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | 디스펜서 정렬장치 및 그 방법 |
US7404861B2 (en) * | 2004-04-23 | 2008-07-29 | Speedline Technologies, Inc. | Imaging and inspection system for a dispenser and method for same |
-
2013
- 2013-03-15 US US13/833,645 patent/US9962728B2/en active Active
- 2013-09-11 WO PCT/US2013/059111 patent/WO2014046921A1/en active Application Filing
- 2013-09-11 MX MX2015003654A patent/MX2015003654A/es unknown
- 2013-09-11 CN CN201380048026.7A patent/CN104640641B/zh active Active
- 2013-09-18 TW TW102133819A patent/TW201417896A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20140079871A1 (en) | 2014-03-20 |
WO2014046921A1 (en) | 2014-03-27 |
CN104640641A (zh) | 2015-05-20 |
US9962728B2 (en) | 2018-05-08 |
TW201417896A (zh) | 2014-05-16 |
CN104640641B (zh) | 2018-04-27 |
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