MX2013002490A - Aparato emisor de luz. - Google Patents

Aparato emisor de luz.

Info

Publication number
MX2013002490A
MX2013002490A MX2013002490A MX2013002490A MX2013002490A MX 2013002490 A MX2013002490 A MX 2013002490A MX 2013002490 A MX2013002490 A MX 2013002490A MX 2013002490 A MX2013002490 A MX 2013002490A MX 2013002490 A MX2013002490 A MX 2013002490A
Authority
MX
Mexico
Prior art keywords
light emitting
emitting apparatus
diodes
electrical signal
electrical
Prior art date
Application number
MX2013002490A
Other languages
English (en)
Spanish (es)
Inventor
Mark John Steinhardt
Erik John Hasenoehrl
Kenneth Stephen Mcguire
William Johnstone Ray
Corey Michael Bischoff
Mark D Lowenthal
Neil O Shotton
Richard A Blanchard
Mark Allan Lewandowski
Brad Oraw
Edward Mack Sawicki
Original Assignee
Procter & Gamble
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Procter & Gamble filed Critical Procter & Gamble
Publication of MX2013002490A publication Critical patent/MX2013002490A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2121/00—Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Paints Or Removers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Led Device Packages (AREA)
MX2013002490A 2010-09-03 2011-09-02 Aparato emisor de luz. MX2013002490A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37986010P 2010-09-03 2010-09-03
PCT/US2011/050292 WO2012031178A2 (en) 2010-09-03 2011-09-02 A light emitting apparatus

Publications (1)

Publication Number Publication Date
MX2013002490A true MX2013002490A (es) 2013-11-20

Family

ID=44651986

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013002490A MX2013002490A (es) 2010-09-03 2011-09-02 Aparato emisor de luz.

Country Status (6)

Country Link
EP (1) EP2612354A2 (ja)
JP (1) JP2014511132A (ja)
CN (1) CN103081133A (ja)
CA (1) CA2810394A1 (ja)
MX (1) MX2013002490A (ja)
WO (1) WO2012031178A2 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102818145B (zh) * 2012-06-29 2014-10-29 王知康 一种无散热器组合式led模块及生产方法
CN102818146B (zh) * 2012-06-29 2014-10-29 王知康 一种全向发光薄铜箔包塑led模块及加工方法
US9299887B2 (en) * 2013-03-15 2016-03-29 Nthdegree Technologies Worldwide Inc. Ultra-thin printed LED layer removed from substrate
CA2999499C (en) * 2013-03-15 2020-04-07 Sonovia Holdings Llc Light and ultrasonic transducer device
BR112015026793A2 (pt) * 2013-04-22 2017-10-31 Guizhou Gzgps Co Ltd método de fabricação da ampola do diodo emissor de luz
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
US9905743B2 (en) 2013-11-21 2018-02-27 Ford Global Technologies, Llc Printed LED heat sink double lock
US10436391B2 (en) 2014-06-05 2019-10-08 Signify Holding B.V. Lighting device, luminaire and manufacturing method
US9892944B2 (en) * 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
JP6696298B2 (ja) * 2015-07-30 2020-05-20 日亜化学工業株式会社 発光素子及びそれを用いた発光装置
CN105315792B (zh) * 2015-11-18 2020-01-10 Tcl集团股份有限公司 量子点油墨及其制备方法、量子点发光二极管
KR102471116B1 (ko) * 2016-05-12 2022-11-28 삼성디스플레이 주식회사 롤러블 디스플레이
JP6639451B2 (ja) * 2016-09-15 2020-02-05 イーラックス・インコーポレイテッドｅＬｕｘ Ｉｎｃ． 表面実装型発光素子を有するディスプレイ
CN107246565A (zh) * 2017-08-04 2017-10-13 中节能晶和照明有限公司 一种便于维护的led路灯模组
CN111036766B (zh) * 2018-10-11 2021-12-10 名硕电脑(苏州)有限公司 托盘
CN110500566B (zh) * 2019-08-21 2020-11-03 东莞市杰伦塑胶灯饰有限公司 一种可变形灯
CN111081831B (zh) * 2019-11-20 2021-03-23 华南师范大学 基于多电极的照明通信器件及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US6683663B1 (en) * 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US20030091647A1 (en) 2001-11-15 2003-05-15 Lewis Jennifer A. Controlled dispersion of colloidal suspensions via nanoparticle additions
US20050176246A1 (en) * 2004-02-09 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7557367B2 (en) * 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly

Also Published As

Publication number Publication date
WO2012031178A3 (en) 2012-10-18
JP2014511132A (ja) 2014-05-08
WO2012031178A2 (en) 2012-03-08
CA2810394A1 (en) 2012-03-08
CN103081133A (zh) 2013-05-01
EP2612354A2 (en) 2013-07-10

Similar Documents

Publication Publication Date Title
MX2013002490A (es) Aparato emisor de luz.
EP2629341B8 (en) White light emitting device and lighting device
EP2580519A4 (en) LIGHTING SYSTEMS AND METHODS USING LIGHT EMITTING DIODES (LED)
EP3058401A4 (en) Light emitting diode (led) devices
WO2012034107A3 (en) A reconfigurable luminaire
GB2487698A (en) Apparatus and method for led light control
EP2434213A4 (en) LIGHTING LAMP WITH LED
EP2660881A4 (en) Light-emitting diode driver circuit and led light source
EP2859594A4 (en) HYBRID ELECTRIC BULBS USING COMBINATIONS OF REMOTE PHOSPHORES AND DIRECT EMISSION LEDS
MY177682A (en) Eu2+ -activated phosphors
GB201012483D0 (en) Light emitting diodes
EP2439796B8 (en) Light emitting device and lighting system
EP2677233A4 (en) LED LIGHT SOURCE WITH WHITE LIGHT WITH A REMOTE PHOSPHOR CONVERTER
AU356610S (en) Light-emitting diodes (LED) lighting apparatus
SA515360522B1 (ar) مصباح مقاوم للانفجار
GB201205042D0 (en) Light emiting diode (LED) lighting fixture
EP2649655A4 (en) LED LIGHTING DEVICES WITH HIGH LIGHT POWER
TWM389350U (en) Light source module of light-emitting diode
ZA201206539B (en) White light emitting diode (led) device
MX2012000728A (es) Unidad de iluminacion de diodos emisores de luz.
ZA201206538B (en) White light emitting diode (led) lighting device driven by pulse current
EP2595203A4 (en) LIGHT EMITTING DIODE AND LIGHT EMITTING DIODE LAMP
TWM476366U (en) Light emitting diode system
SI2445318T1 (sl) Led signalna svetilka z delovanjem na konstantni tok
EP2572557A4 (en) MULTICOLOR LUMINAIRE