MX170062B - Composiciones dielectricas - Google Patents

Composiciones dielectricas

Info

Publication number
MX170062B
MX170062B MX1683989A MX1683989A MX170062B MX 170062 B MX170062 B MX 170062B MX 1683989 A MX1683989 A MX 1683989A MX 1683989 A MX1683989 A MX 1683989A MX 170062 B MX170062 B MX 170062B
Authority
MX
Mexico
Prior art keywords
glass
approximately
state transition
degrees celsius
lead
Prior art date
Application number
MX1683989A
Other languages
English (en)
Inventor
Azis S Shaikh
Robert D Gardner
Dineen M Hopp
Gordon J Roberts
Original Assignee
Ferro Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corp filed Critical Ferro Corp
Publication of MX170062B publication Critical patent/MX170062B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/085—Particles bound with glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/087—Chemical composition of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/088—Shaping of glass or deposition of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

La presente invención se refiere a una composición delctrica que comprende a) de un 30 a 100 por ciento aproximadamente en peso de una composición de vidrio seleccionada entre el grupo formado por (a-1) una composición de vidrio exenta de plomo con una temperatura de transición del estado vítreo comprendida en la gama de 600 grados centígrados y los 800 grados centígrados aproximadamente (a-2) una mezcla de dos composiciones de vidrio exentas de bismuto, exentas de plomo o con bajo contenido de plomo con una primera composición de vidrio que presenta una temperatura de transición del estado vitreo comprendida en la gama de 585 grados centígrados y los 620 grados centígrados aproximadamente y una segunda composición de vidrio que presenta una temperatura de transición del estado vítreo incluída en la gama de 765 grados centígrados y los 815 grados centígrados aproximadamente (a-3) una mezcla de tres composiciones de vidrio, una primera composición de vidrio que presenta una temperatura de transición del estado vítreo comprendida en los 650 grados centígrados y los 750 grados centígrados aproximadamente (b) hasta un 30 por ciento aproximadamente en peso de por lo menos un modificador y la expansión y c) hasta 40 por ciento aproximadamente en peso de por lo menos un óxido refractario.
MX1683989A 1988-07-19 1989-07-18 Composiciones dielectricas MX170062B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22110588A 1988-07-19 1988-07-19
US37755189A 1989-07-13 1989-07-13

Publications (1)

Publication Number Publication Date
MX170062B true MX170062B (es) 1993-08-04

Family

ID=26915508

Family Applications (1)

Application Number Title Priority Date Filing Date
MX1683989A MX170062B (es) 1988-07-19 1989-07-18 Composiciones dielectricas

Country Status (4)

Country Link
EP (1) EP0422127A4 (es)
AU (1) AU3977789A (es)
MX (1) MX170062B (es)
WO (1) WO1990000966A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164342A (en) * 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5258335A (en) * 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5071794A (en) * 1989-08-04 1991-12-10 Ferro Corporation Porous dielectric compositions
WO1991002363A1 (en) * 1989-08-04 1991-02-21 Ferro Corporation Porous dielectric compositions
US5510301A (en) * 1994-10-24 1996-04-23 Fink; Kimberly S. Sealing frit pastes
EP0896571B1 (en) * 1996-04-29 2003-03-19 Corning Incorporated Sealing glass paste method
KR20010096522A (ko) * 1999-12-15 2001-11-07 김창선 의류 패턴 제도 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB962568A (en) * 1960-11-11 1964-07-01 Owens Illinois Glass Co Improvements in and relating to refractory compositions
FR1348287A (fr) * 1963-02-25 1964-01-04 Corning Glass Works Objet composite en céramique
US3927238A (en) * 1973-05-07 1975-12-16 Bell Telephone Labor Inc Lead-free glaze for high density alumina
US4084976A (en) * 1977-07-20 1978-04-18 Champion Spark Plug Company Lead-free glaze for alumina bodies
JPS54154079A (en) * 1978-05-25 1979-12-04 Fujitsu Ltd Method of producing multiilayer circuit board
US4369254A (en) * 1980-10-17 1983-01-18 Rca Corporation Crossover dielectric inks
JPS6025398B2 (ja) * 1980-12-27 1985-06-18 セントラル硝子株式会社 グレ−ズドセラミック基板
US4634634A (en) * 1981-10-19 1987-01-06 Ngk Spark Plug Co., Ltd. Glaze ceramic base
US4547467A (en) * 1983-06-22 1985-10-15 Burroughs Corporation Dielectric composition and devices using it
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法
US4752531A (en) * 1985-03-25 1988-06-21 E. I. Du Pont De Nemours And Company Dielectric composition
DE3525972A1 (de) * 1985-07-20 1987-01-29 Standard Elektrik Lorenz Ag Emaillierungen mit heterogenem gefuege
JPH0634452B2 (ja) * 1985-08-05 1994-05-02 株式会社日立製作所 セラミツクス回路基板
US4717690A (en) * 1986-02-12 1988-01-05 Heraeus, Inc. Cermalloy Division Overglaze inks
JP2507418B2 (ja) * 1986-05-02 1996-06-12 旭硝子株式会社 回路基板用組成物

Also Published As

Publication number Publication date
WO1990000966A1 (en) 1990-02-08
EP0422127A4 (en) 1992-02-19
EP0422127A1 (en) 1991-04-17
AU3977789A (en) 1990-02-19

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